Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.

Abstract: A bonded assembly includes an interposer; a semiconductor die that is attached to the interposer and including a planar horizontal bottom surface and a contoured sidewall; a high bandwidth memory (HBM) die that is attached to the interposer; and a dielectric material portion contacting the semiconductor die and the interposer. The contoured sidewall includes a vertical sidewall segment and a non-horizontal, non-vertical surface segment that is adjoined to a bottom edge of the vertical sidewall segment and is adjoined to an edge of the planar horizontal bottom surface of the semiconductor die. The vertical sidewall segment and the non-horizontal, non-vertical surface segment are in contact with the dielectric material portion. The contoured sidewall may provide a variable lateral spacing from the HBM die to reduce local stress in a portion of the HBM die that is proximal to the interposer.

Abstract: An electric parking stand has a frame (100), a leg assembly (200), and a planetary gear motor (300). The frame (100) has a pair of end plates (110) and a plurality of supporting rods (120) connected between the pair of end plates (110). The leg assembly (200) is pivoted with the respective end plates (110), and the leg assembly (200) has a sector gear (220). The planetary gear motor (300) is fixed to the supporting rods (120) and engaged with the sector gear (220). Thereby, the preassembled electric parking stand could be installed onto a motor cycle by screwing the respective end plates (110) to the motor cycle.