Patents by Inventor Chih-Ta HUANG

Chih-Ta HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11985314
    Abstract: Video processing methods and apparatuses in a video encoding or decoding system for processing out-of-bounds nodes in a current picture. An out-of-bounds node is a coding tree node with a block region across a current picture boundary. The video processing method or apparatus determines an inferred splitting type, applies the inferred splitting type to split the out-of-bounds node into child blocks, adaptively splits each child block into one or multiple leaf blocks, and encodes or decodes the leaf blocks in the out-of-bounds node inside the current picture. The inferred splitting type for partitioning out-of-bounds nodes in an inter slice, picture, or tile is the same as the inferred splitting type for partitioning out-of-bounds nodes in an intra slice, picture, or tile.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: May 14, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Chia-Ming Tsai, Chih-Wei Hsu, Tzu-Der Chuang, Ching-Yeh Chen, Yu-Wen Huang, Shih-Ta Hsiang
  • Patent number: 11967717
    Abstract: Disclosed is a tungsten-doped lithium manganese iron phosphate-based particulate for a cathode of a lithium-ion battery. The particulates include a composition represented by a formula of LixMn0.998-y-zFeyMzW0.002PaO4a±p/C, wherein x, y, z, a, p, and M are as defined herein. Also disclosed is a powdery material including the particulates, and a method for preparing the powdery material.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: April 23, 2024
    Assignee: HCM CO., LTD.
    Inventors: Chien-Wen Jen, Hsin-Ta Huang, Chih-Tsung Hsu, Yi-Hsuan Wang
  • Patent number: 11967546
    Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen, Szu-Wei Lu, Ying-Ching Shih, Wen-Chih Chiou, Chi-Hsi Wu, Chen-Hua Yu
  • Patent number: 11956421
    Abstract: Method and apparatus of video coding are disclosed. According to one method, in the decoder side, a predefined Intra mode is assigned to a neighboring block adjacent to the current luma block when the neighboring block satisfies one or more conditions. An MPM (Most Probable Mode) list is derived based on information comprising at least one of neighboring Intra modes. A current Intra mode is derived utilizing the MPM list. The current luma block is decoded according to the current Intra mode According to another method, a predefined Intra mode is assigned to a neighboring block adjacent to the current luma block if the neighboring block is coded in BDPCM (Block-based Delta Pulse Code Modulation) mode, where the predefined Intra mode is set to horizontal mode or vertical mode depending on prediction direction used by the BDPCM mode.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: April 9, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Man-Shu Chiang, Chih-Wei Hsu, Tzu-Der Chuang, Ching-Yeh Chen, Yu-Wen Huang, Shih-Ta Hsiang
  • Publication number: 20240099030
    Abstract: A bonded assembly includes an interposer; a semiconductor die that is attached to the interposer and including a planar horizontal bottom surface and a contoured sidewall; a high bandwidth memory (HBM) die that is attached to the interposer; and a dielectric material portion contacting the semiconductor die and the interposer. The contoured sidewall includes a vertical sidewall segment and a non-horizontal, non-vertical surface segment that is adjoined to a bottom edge of the vertical sidewall segment and is adjoined to an edge of the planar horizontal bottom surface of the semiconductor die. The vertical sidewall segment and the non-horizontal, non-vertical surface segment are in contact with the dielectric material portion. The contoured sidewall may provide a variable lateral spacing from the HBM die to reduce local stress in a portion of the HBM die that is proximal to the interposer.
    Type: Application
    Filed: April 20, 2023
    Publication date: March 21, 2024
    Inventors: Kuan-Yu Huang, Sung-Hui Huang, Kuo-Chiang Ting, Chia-Hao Hsu, Hsien-Pin Hsu, Chih-Ta Shen, Shang-Yun Hou
  • Patent number: 11923429
    Abstract: A semiconductor device and method for forming the semiconductor device are provided. In some embodiments, a semiconductor substrate comprises a device region. An isolation structure extends laterally in a closed path to demarcate the device region. A first source/drain region and a second source/drain region are in the device region and laterally spaced. A sidewall of the first source/drain region directly contacts the isolation structure at a first isolation structure sidewall, and remaining sidewalls of the first source/drain region are spaced from the isolation structure. A selectively-conductive channel is in the device region, and extends laterally from the first source/drain region to the second source/drain region. A plate comprises a central portion and a first peripheral portion. The central portion overlies the selectively-conductive channel, and the first peripheral portion protrudes from the central portion towards the first isolation structure sidewall.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chang Cheng, Fu-Yu Chu, Ming-Ta Lei, Ruey-Hsin Liu, Shih-Fen Huang
  • Publication number: 20240069606
    Abstract: A portable electronic device including a first body, a second body, and a hinge mechanism is provided. The second body is connected to the first body through the hinge mechanism, and the hinge mechanism has a basis axis located at the first body and a rotation axis located at a lower end of the second body. When the second body rotates with respect to the first body, the rotation axis slides along an arc shaped path with respect to the basis axis to increase or decrease a distance between the rotation axis and the basis axis and increase or decrease a distance between the lower end of the second body and a back end of the first body.
    Type: Application
    Filed: November 3, 2023
    Publication date: February 29, 2024
    Applicants: Acer Incorporated, Sinher Technology Inc.
    Inventors: Yi-Ta Huang, Cheng-Nan Ling, Chih-Chun Liu, Yung-Chang Chiang
  • Patent number: 11913084
    Abstract: A quenching fixture adapted to clamp at least one workpiece is provided. The quenching fixture includes a first positioning component and a second positioning component. Both of the first positioning component and the second positioning component have a positioning surface, multiple protrusions protruding from the positioning surface and a heat dissipation channel disposed between the protrusions in a staggered manner. The positioning surface of the first positioning component faces the positioning surface of the second positioning component, and the protrusions of the first positioning component overlap the protrusions of the second positioning component. The workpiece is clamped between the protrusions of the first positioning component and the protrusions of the second positioning component.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: February 27, 2024
    Assignee: Acer Incorporated
    Inventors: Yi-Ta Huang, Cheng-Nan Ling, Chih-Chun Liu
  • Patent number: 9086861
    Abstract: An air duct includes a hollow main body defining a through slot, an inlet member and an outlet member connected to opposite ends of the main body. The inlet member includes a top wall, a bottom wall, a first sidewall, and a second sidewall. The second sidewall slantingly extends forward and away from the first sidewall. A space communicating with the through slot is bounded by the top wall, the bottom wall, and the first and second sidewalls. The space has an inlet wider than the through slot. The outlet member is perpendicularly connected to the main body and defines an outlet communicating with the through slot.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: July 21, 2015
    Assignee: Zhongshan Innocloud Intellectual Property Services Co., Ltd.
    Inventors: Cheng-Hsiu Yang, Chih-Ta Huang
  • Publication number: 20150041186
    Abstract: A fixing member for mounting a heat sink to a circuit board without screws includes a connecting portion through the heat sink and the circuit board, and a blocking portion connected to a bottom end of the connecting portion to latch in a bottom surface of the circuit board. A resilient portion connected to a top end of the connecting portion and bearing down on a top surface of the heat sink is deformable to enable the initial latching of the hooked portion in the bottom surface of the circuit board.
    Type: Application
    Filed: August 16, 2013
    Publication date: February 12, 2015
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHIH-TA HUANG, CHUN-WEI KUAN
  • Publication number: 20150013955
    Abstract: A heat sink includes a base and a number of fins mounted parallelly on the base. Each fin defines a number of vents, and two heat dissipating pieces protrude from opposite sides of each vent. The heat dissipating pieces of each vent cooperatively bounds an opening communicating with the corresponding vent. The number of openings of each fin is aligned with the number of openings of the other fins. The aligned openings of the number of fins cooperatively define a number of first air channels perpendicular to the number of fins. The number of heat dissipating pieces bound a number of second air channels parallel to the number of fins.
    Type: Application
    Filed: April 14, 2014
    Publication date: January 15, 2015
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: TAI-WEI LIN, CHIH-TA HUANG
  • Publication number: 20150016031
    Abstract: A packing member attached to non-coplanar outer surfaces of an electronic component includes a number of non-coplanar plates attached to the outer surfaces of the electronic component. A junction of every two adjacent plates defines a row of a plurality of through holes. A middle line of each row of through holes is aligned with a corresponding junction of two adjacent outer surfaces of the electronic component.
    Type: Application
    Filed: July 25, 2013
    Publication date: January 15, 2015
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHIH-TA HUANG, MENG-HSIEN LIN, YAO-TING CHANG
  • Publication number: 20140204523
    Abstract: An air duct includes a hollow main body defining a through slot, an inlet member and an outlet member connected to opposite ends of the main body. The inlet member includes a top wall, a bottom wall, a first sidewall, and a second sidewall. The second sidewall slantingly extends forward and away from the first sidewall. A space communicating with the through slot is bounded by the top wall, the bottom wall, and the first and second sidewalls. The space has an inlet wider than the through slot. The outlet member is perpendicularly connected to the main body and defines an outlet communicating with the through slot.
    Type: Application
    Filed: February 28, 2013
    Publication date: July 24, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHENG-HSIU YANG, CHIH-TA HUANG
  • Publication number: 20140154049
    Abstract: A verification method for a rotation speed value of a fan includes steps of receiving a predictive rotation speed value of the fan, an input environmental temperature value and a plurality of temperature values of components, sending the received environmental temperature value and a plurality of temperature values of components to the control unit to control the fan to rotate on the condition of the input temperature values; acquiring the actual rotation speed value of the fan on the condition of the input temperature values; detecting whether the actual rotation speed value of the fan is consistent with the predictive rotation speed value of the fan; and outputting information of showing that the actual rotation speed value of the fan does not match the predictive rotation speed value of the fan if not.
    Type: Application
    Filed: March 29, 2013
    Publication date: June 5, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chih-Ta HUANG, Yao-Ting CHANG, Chao-Ke WEI
  • Patent number: D753832
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: April 12, 2016
    Assignees: Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventors: Chi-Hsueh Lin, Wei-Jen Lo, Chih-Ta Huang
  • Patent number: D760903
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: July 5, 2016
    Assignees: Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventors: Chi-Hsueh Lin, Wei-Jen Lo, Chih-Ta Huang