Abstract: A molding device and a molding method are provided. The molding device includes an upper molding assembly and a lower molding assembly. The upper molding assembly includes an upper molding plate and a plurality of positioning columns disposed thereon. The mold core and a plurality of matching columns surrounding the mold core are disposed at the same side of the upper molding plate. The lower molding assembly includes a lower molding plate and at least one formation mold, wherein the lower molding plate has at least one accommodating groove, a plurality of matching grooves and a plurality of positioning holes surrounding the accommodating groove. The formation mold is disposed in the accommodating groove, and the formation mold has a formation cavity corresponding to the mold core. Each positioning column is disposed respectively into each positioning hole, and each matching column is disposed respectively into each matching groove.