Abstract: A memory control method includes a processor initiating a memory access instruction to a cache controller to search a cache memory, an address detector checking if the memory access instruction is corresponding to predetermined conditions if a cache miss occurs, the address detector transmitting a signal to inform a replacement mask logic unit if the memory access instruction is corresponding to the predetermined conditions, and the replacement mask logic unit providing predetermined data to store the predetermined data into the cache memory.

Abstract: A semiconductor package includes a circuit substrate, a die, a frame structure, and a heat sink lid. The die is disposed on the circuit substrate and electrically connected with the circuit substrate. The die includes two first dies disposed side by side and separate from each other with a gap between two facing sidewalls of the two first dies. The frame structure is disposed on the circuit substrate and surrounding the die. The heat sink lid is disposed on the die and the frame structure. The head sink lid has a slit that penetrates through the heat sink lid in a thickness direction and exposes the gap between the two facing sidewalls of the two first dies.

Abstract: An eye-diagram index analytic method includes: calculating a transfer function of multiple coupled lines; converting the transfer function into a pulse response; calculating an eye-diagram index according to the pulse response; and correcting the eye-diagram index according to peak distortion analysis.

Abstract: An electronic device is disclosed. The electronic device includes a first electronic component and a first interposer. The first electronic component is disposed under the interposer and includes a logic circuit and a power delivery circuit disposed between the interposer and the logic circuit. The interposer and the power delivery circuit are collectively configured to function as a power delivery structure which is electrically connected to the logic circuit.

Abstract: A radio frequency (RF) tamper detector of an electronic device can offer improved chassis intrusion monitoring to protect the device from software and hardware-based tampering. The tamper detector can monitor RF noise levels in a first frequency band and in a second frequency band to calculate an RF noise level moving average for each frequency band. If the moving averages in both frequency bands exceed a RF noise threshold, the tamper detector can set a cover removal flag to indicate that a cover of the device housing has been removed. The tamper detector can cause the electronic device to lock or disable a system BIOS when cover removal is detected. Additionally, the electronic device can notify remote monitoring systems (e.g., operated by an IT administrator or warranty support center) to receive additional instructions to secure the device.

Abstract: Provided herein are anti-reflective multi-layer systems and methods of using the same. In particular, the various embodiments described herein include display systems and methods and using the same.

Abstract: An integrated circuit design implementation system includes a synthesis tool configured to: receive a behavioral description of each of a plurality of first components; generate first netlists based on the behavioral descriptions of the first components; receive connection information of a plurality of second components, wherein the connection information comprises physical arrangement and connectivity among the first components and the second components; generate a plurality of third components, wherein each of the third components operatively corresponds to an interface between a pair of one of the first components and one of the second components; and transform the first netlists to a second netlist based on first vertices, second vertices, third vertices, and edges. The first vertices correspond to the first components, respectively, the second vertices correspond to the second components, respectively, and the third vertices correspond to the third components, respectively.

Abstract: The present disclosure provides a semiconductor package. The semiconductor package includes a heat spreader, a first die, a plurality of first conductive bumps, a molding layer and a redistribution layer. The first die is disposed on the heat spreader and has a top surface and a bottom surface opposing to the top surface. The first conductive bumps are disposed on the top surface of the first die and electrically connected to the first die. The molding layer is formed on the heat spreader to cover the top surface of the first die and expose the first conductive bumps. The redistribution layer is disposed on the molding layer to electrically connect to the first conductive bumps. The present disclosure further provides a method of manufacturing the above semiconductor package.

Abstract: An integrated circuit includes a plurality of routing lines extending along a first direction, the plurality of routing lines being separated in the first direction by integral multiples of a nominal minimum pitch. The integrated circuit includes a plurality of standard cells, at least one of the plurality of standard cells having a first boundary coinciding with a routing line of the plurality of routing lines, and a second boundary offset from each of the plurality of routing lines.

Abstract: An exhaust structure includes a piping section, wherein the piping section has a first inner diameter in a central region of the piping section, the piping section has a second diameter in at least one of an inlet or an outlet, and the second diameter has a same value as the first inner diameter. The exhaust structure further includes a plurality of smoothing layers configured to resist turbulence and condensation produced by a flow of one or more gasses in the piping section.

Abstract: The present disclosure provides a structure and method of fabricating the structure. The structure comprises a cavity enclosed by a first substrate and a second substrate opposite to the first substrate. Further, the structure includes a feature in the cavity and the feature is protruded from a surface of the first substrate. In addition, the structure includes a dielectric layer over the feature, wherein the dielectric layer includes a first surface in contact with the feature and a second surface opposite to the first surface is positioned toward the cavity.

Abstract: A package includes a first package component; a second package component bonded to the first package component by a first plurality of solder connectors; and a first plurality of spacer connectors extending from the first package component to the second package component. A diameter of a spacer connector the first plurality of spacer connectors is larger than a height of a solder connector of the first plurality of solder connectors, and the first plurality of spacer connectors comprises a different material than the first plurality of solder connectors.

Abstract: A power converter is coupled between a power source and multiple loads, and the power converter includes a first switch module. The switch module includes an inductor, a first switch, a second switch, a third switch, and a fourth switch. The first switch, the second switch, the third switch, and the fourth switch are configured to be turned on or turned off so that the inductor is stored energy or released energy to converter the power source into multiple voltages to the multiple loads.

Abstract: A biodegradable marker pen including a barrel, a cap, and an ink reservoir. The barrel has a hollow cylindrical structure, the ink reservoir is placed in the barrel, and the cap is detachably coupled with the barrel hermetically. The barrel, the cap, and the ink reservoir comprise 2 to 10 mass percentage of a biodegradable masterbatch respectively.

Abstract: An overlay error measurement method includes disposing a lower-layer pattern over a substrate that includes disposing a first pattern having a first plurality of first sub-patterns extending in a first interval along a first direction and being arranged with a first pitch in a second direction crossing the first direction. The method includes disposing a second pattern having a second plurality of second sub-patterns extending in a second interval along the first direction and being arranged with a second pitch, smaller than the first pitch, in the second direction crossing the first direction. The second sub-patterns are disposed interleaved between the first sub-patterns. The method includes disposing an upper-layer pattern including a third pattern having the first pitch and at least partially overlapping with the lower-layer pattern over the lower-layer pattern and determining an overlay error between the lower-layer pattern and the upper-layer pattern.

Abstract: A sprinkler water flow switching device is assembled in a movable seat of the water sprinkler with a partition dividing into an impeller chamber and a gear chamber. The partition is provided with a first water channel and a second water channel for directing water from the gear chamber to the impeller chamber, so as to control the direction of rotation of the impeller in the impeller chamber. The water flow switching device includes a projection member, a seesaw plate and a driving lever in the gear chamber; the driving lever can oscillate and actuate the seesaw plate to move on the projection member, then the seesaw plate can move as a seesaw to selectively close the water inlet of the first water channel or the second water channel, thereby changing the rotation direction of the impeller and the water spray direction.

Abstract: A source base station receives, from a candidate base station while a user device is operating in a source cell of the source base station, a first message that indicates a conditional handover configuration providing information for user device operation within a candidate target cell of the candidate base station, but does not indicate a corresponding condition for handing over to the candidate target cell. The source base station generates the corresponding condition for handing over to the candidate target cell, and sends, to the user device, a second message that indicates the conditional handover configuration and the corresponding condition.

Abstract: A semiconductor device including fin field-effect transistors, includes a first gate structure extending in a first direction, a second gate structure extending the first direction and aligned with the first gate structure in the first direction, a third gate structure extending in the first direction and arranged in parallel with the first gate structure in a second direction crossing the first direction, a fourth gate structure extending the first direction, aligned with the third gate structure and arranged in parallel with the second gate structure, an interlayer dielectric layer disposed between the first to fourth gate electrodes, and a separation wall made of different material than the interlayer dielectric layer and disposed between the first and third gate structures and the second and fourth gate structures.

Abstract: DP-2 antagonists reversed PGD2-mediated human hair growth inhibition in a dose-dependent manner in vitro by reducing PGD2-triggered apoptosis and maintaining proliferation of keratinocytes. Hair follicles from approximately half of the alopecia patients exhibited little susceptibility to PGD2's effect in vitro. SNPs in the human DP-2 gene were identified that are associated with hair growth inhibition by PGD2. These findings underscore the role of DP-2 in regulating hair growth and indicate that DP-2 can be an effective approach in preventing and/or treating androgenetic alopecia in patients sensitive to PGD2. Furthermore, the SNPs identified here can be used to identify patients who will benefit from treatment.

Abstract: An adhered multilayer die unit includes at least one probe zone and at least one non-probe zone for probes to be inserted in the probe zone. The adhered multilayer die unit includes dies and at least one adhesive layer. Each die includes at least one connecting surface, and through holes in the at least one probe zone for the probes to be inserted through the through holes of each die. The at least one adhesive layer adheres the connecting surfaces of the dies to each other. The at least one adhesive layer is entirely in the at least one non-probe zone. Accordingly, the adhered multilayer die unit of the invention has great structural strength in large-area condition, avoids drilling process difficulty problem and size restriction of fastening combining manner, avoids adhesive spillage and its affection on probes, and avoids adhesive-caused problems of adhesive spillage and die levelness deviation.