Abstract: A package structure and methods for forming the package structure are provided. The package structure includes a lead frame having a chip bonding area and a shell surrounding a portion of the lead frame. The shell has an inner surface and an outer surface opposite to the inner surface. A cavity is recessed from the inner surface, and the chip bonding area is exposed from the cavity. The structure further includes a light emitting diode chip disposed over the chip bonding area and a first glue layer disposed in the cavity to cover the light emitting diode chip. A separation film is disposed on the first glue layer in the cavity and a second glue layer disposed on the separation film in the cavity. The second glue layer contains a wavelength conversion material and the first glue layer does not contain any wavelength conversion material.