Abstract: An automatic adjustment device for a disc of a bicycle brake includes a seat adapted to be mounted to a brake device, and a sliding rod adapted to be attached to a fork of the bicycle, and the sliding rod slidably mounted on the seat. The brake device is moved horizontally relative to a brake disc of the bicycle to balance the pressure of the two opposite sides of the brake disc.

Abstract: A disturbing plate structure having at least one down set, applicable in a lead frame-type package in a semiconductor. The disturbing plate has at least a lead frame, a die, a glue layer, a plurality of disturbing plates, a top mold compound, and a bottom mold compound. The lead frame has a plurality of leads. Two disturbing plates are located on two sides of the die. A space is formed by bending a first bent portion and a second bent portion of the disturbing plate down. Finally, the lead frame is encapsulated with a mold compound. By adjusting the size of the space formed by the first bent portion and the second bent portion, the top mold compound section has substantially the same volume as the bottom mold compound section to finish the packaging and forming.

Abstract: A thin-type semiconductor device and a die pad thereof are proposed. The thin-type semiconductor device includes a semiconductor chip, a die pad, a plurality of leads and an encapsulant. With the use of a strengthening structure formed on a side surface of the die pad and/or on a first surface of the die pad other than an area for attaching the chip thereto, adherence between the die pad and the encapsulant can be enhanced, as well as delamination between the die pad and the encapsulant or crack in the encapsulant can be prevented from occurrence, and accordingly credibility and reliability of the semiconductor device can be assured.

Abstract: A method is proposed for forming a constricted-mouth dimple structure on a lead-frame die pad for an integrated circuit (IC) package. This method can help secure the molded compound of the integrated circuit package more firmly in position to the die pad so that the molded compound would be less likely subjected to delamination. This method is charaterized in the use of a stamping process to punch on a selected part of the die pad that is located around the mouth of an originally-formed inwardly-tapered dimple structure, thereby narrowing the mouth of the inwardly-tapered dimple structure, resulting in the forming of the intended constricted-mouth dimple structure. Since this method requires only an additional stamping process to narrow the originally-formed inwardly-tapered dimple structure, it is much easier and more cost-effective to implement than the prior art.