Patents by Inventor Chih-Tsung Tu

Chih-Tsung Tu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal thermal interface material and thermal module and packaged microelectronic component containing the material
    Patent number: 8373991
    Abstract: The invention provides a metal thermal interface material (TIM) with through-holes in its body and/or zigzags or wave shapes on its border, which is suitable for use at thermal interfaces of a thermal conduction path from an integrated circuit die to its associated heat sink in a packaged microelectronic component. The invention also includes a thermal module and a packaged microelectronic component including the metal thermal interface material.
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: February 12, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Yuan-Chang Fann, Chun-Mu Chen, Cheng-Chou Wong, Chih-Tsung Tu, Jen-Dong Hwang
  • METAL THERMAL INTERFACE MATERIAL AND THERMAL MODULE AND PACKAGED MICROELECTRONIC COMPONENT CONTAINING THE MATERIAL
    Publication number: 20090135567
    Abstract: The invention provides a metal thermal interface material (TIM) with through-holes in its body and/or zigzags or wave shapes on its border, which is suitable for use at thermal interfaces of a thermal conduction path from an integrated circuit die to its associated heat sink in a packaged microelectronic component. The invention also includes a thermal module and a packaged microelectronic component including the metal thermal interface material.
    Type: Application
    Filed: July 11, 2008
    Publication date: May 28, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yuan-Chang Fann, Chun-Mu Chen, Cheng-Chou Wong, Chih-Tsung Tu, Jen-Dong Hwang