Patents by Inventor Chih-Tung Wang

Chih-Tung Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11940388
    Abstract: Example methods are provided to improve placement of an adaptor (210,220) to a mobile computing device (100) to measure a test strip (221) coupled to the adaptor (220) with a camera (104) and a screen (108) on a face of the mobile computing device (100). The method may include displaying a light area on a first portion of the screen (108). The first portion may be adjacent to the camera (104). The light area and the camera (104) may be aligned with a key area of the test strip (221) so that the camera (104) is configured to capture an image of the key area. The method may further include providing first guiding information for a user to place the adaptor (210,220) to the mobile computing device (100) according to a position of the light area on the screen (108).
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: March 26, 2024
    Assignee: IXENSOR CO., LTD.
    Inventors: Yenyu Chen, An Cheng Chang, Tai I Chen, Su Tung Yang, Chih Jung Hsu, Chun Cheng Lin, Min Han Wang, Shih Hao Chiu
  • Publication number: 20240071758
    Abstract: A method for fabricating a high electron mobility transistor (HEMT) includes the steps of forming a buffer layer on a substrate, forming a barrier layer on the buffer layer, forming a p-type semiconductor layer on the barrier layer, forming a gate electrode layer on the p-type semiconductor layer, and patterning the gate electrode layer to form a gate electrode. Preferably, the gate electrode includes an inclined sidewall.
    Type: Application
    Filed: September 23, 2022
    Publication date: February 29, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Tung Yeh, You-Jia Chang, Bo-Yu Chen, Yun-Chun Wang, Ruey-Chyr Lee, Wen-Jung Liao
  • Patent number: 6229726
    Abstract: An integrated circuit formed on a semiconductor substrate having multiple input/output signal paths such that the semiconductor substrate can be mounted to more than one package type. The integrated circuit formed on the semiconductor substrate has at least three pluralities of input output connector pads. The first plurality of input/output connector pads is placed on the semiconductor substrate and is attached to a first functional circuit of the integrated circuit. The second and third pluralities of input/output connector pads are placed on the semiconductor substrate and are attached to a second functional circuit of the integrated circuit. The third plurality of input/output connector pads is placed in an area separated from the first and second pluralities of input/output connector pads.
    Type: Grant
    Filed: February 7, 2000
    Date of Patent: May 8, 2001
    Assignee: Etron Technology, Inc.
    Inventors: Gyh-Bin Wang, Chih-Tung Wang, Tah-Kang Joseph Ting
  • Patent number: 6183111
    Abstract: A figurative structure for clamping a decorative lamp string, having a lamp-mounting frame with a plurality of fastening bases. Each fastening base has a hollow portion for mounting a socket assembly of the lamp string, every two adjacent fastening bases being connected together by means of connecting arm plates. Only a given part of each socket assembly of the lamp string mounted on the lamp-mounting frame is covered by the positioning plates or hooks 20. Thus, the front or rear side of the lamp-mounting frame can show the figurative structure formed with the socket assemblies to enable the bulbs on the fastening bases to be seen clearly. The figurative structure formed with the lamp-mounting frame can be shown completely by means of the winked bulbs.
    Type: Grant
    Filed: May 17, 1999
    Date of Patent: February 6, 2001
    Inventor: Chih-Tung Wang
  • Patent number: 5681107
    Abstract: An improved structure for a decorative lamp, in which an end opening of a cylinder part under the socket for inserting power wires is provided with two sets of positioning slots having different depth; each of the positioning slots is furnished with a guide slot between the inside and the opening thereof; the diameter of the guide slot is slightly less than that of the positioning slot; the set of deep positioning slots is used for laying and fastening two power wires respectively; a fixing cap to be assembled with cylinder part of the socket is furnished with two semi-circular posts in the central part thereof; the outer part of the fixing cap is provided with a round flange; at least two positioning studs are furnished between the bottom part of the semi-circular posts and the round flange; the positioning studs are to be mated with the shallow positioning slots on the end opening of the cylinder part of the socket.
    Type: Grant
    Filed: October 11, 1996
    Date of Patent: October 28, 1997
    Inventor: Chih-Tung Wang
  • Patent number: D387882
    Type: Grant
    Filed: March 5, 1997
    Date of Patent: December 16, 1997
    Inventor: Chih-Tung Wang