Abstract: A composite-type heat pipe includes a working fluid, a first capillary structure, a second capillary structure and a pipe body. The first capillary structure has a smooth surface. The second capillary structure has plural trenches. The pipe body accommodates the working fluid. The pipe body includes a first section and a second section. The second section is connected with the first section. The first capillary structure is formed on a first inner wall of the first section. The second capillary structure with the trenches is formed on a second inner wall of the second section. The trenches extend along an axial direction of the pipe body.

Abstract: An apparatus and method are provided. According to one embodiment, an apparatus includes a level-shifter circuit configured to output voltages Vol+ and Vol?; and an output alignment circuit configured to output voltages Vo+ and Vo? that are triggered by an edge of a combination of Vol+ and Vol?, and where Vo+ and Vo? are set by high states of Vol+ and Vol? prior to a transition on an input of the level-shifter circuit, and the method includes outputting, by a level-shifter circuit, voltages Vol+ and Vol?; and outputting, by an output alignment circuit, voltages Vo+ and Vo? that are triggered by an edge of a combination of Vol+ and Vol?, and where Vo+ and Vo? are set by high states of Vol+ and Vol? prior to a transition on an input of the level-shifter circuit.

Abstract: A vapor chamber includes an upper plate and a lower plate. The lower plate is attached on the upper plate. The upper plate and the lower plate are combined together to define a working space. The lower plate is in thermal contact with a heat source. A reinforcing layer is formed on a surface of the upper plate or the lower plate away from the working space.

Abstract: A manufacturing method of a touch panel includes following steps. The first sensing electrodes and the second sensing electrodes are formed on a substrate first. Connecting bridges are formed next, wherein adjacent two first sensing electrodes are connected by at least one connecting bridge, and a manufacturing method of the connecting bridges includes following steps. A metal layer is formed on the substrate first, wherein a material of the metal layer includes silver. A photoresist layer is formed on a surface of the metal layer next, wherein a material of the photoresist layer includes sulfur. A photolithography process and an etching process are respectively performed on the photoresist layer and the metal layer to form the connecting bridges, wherein silver in the metal layer and sulfur in the photoresist layer react with each other to form a silver sulfide layer after the photoresist layer is formed.

Abstract: An electrical connector assembly, a female connector, and a male connector are provided. The electrical connector assembly includes a female connector and a male connector detachably inserted into the female connector. The female connector includes a housing and a plurality of transmission wafers inserted into the housing. Each of the transmission wafers includes an insulating frame and a plurality of grounding terminals fixed to the insulating frame. The male connector includes a carrier and a plurality of shielding terminals fixed to the carrier. Two side walls of each of the shielding terminals are respectively abutted against and electrically connected to two of the grounding terminals each having at least one first contacting portion.

Abstract: A flexible vapor chamber for an electronic device includes an upper cover, a lower cover, an accommodation space, a capillary structure, plural support structures and a working fluid. The upper cover is made of a first flexible material. The lower cover is made of a second flexible material. The accommodation space is arranged between the upper cover and the lower cover. The capillary structure is disposed on the lower cover and accommodated within the accommodation space. The plural support structures are disposed on the upper cover and accommodated within the accommodation space. The plural support structures are contacted with the capillary structure. The working fluid is accommodated within the accommodation space. The flexible vapor chamber is permitted to be subjected to a flexural action in a flexible range. Consequently, the installation of the flexible vapor chamber complies with a shape of the electronic device.

Abstract: An electrical connector and a transmission wafer thereof are provided. The transmission wafer includes an insulating frame, a plurality of grounding terminals fixed to the insulating frame, and a shielding member disposed on the insulating frame. Each of the grounding terminals includes a middle grounding segment embedded in the insulating frame, a front grounding segment, and a rear grounding segment, the latter two of which respectively extend from two ends of the middle grounding segment in two different directions. The shielding member includes a grounding sheet disposed on the insulating frame and a plurality of elastic arms curvedly extending from the grounding sheet to protrude from the insulating frame. The elastic arms are respectively abutted against portions of the front grounding segments arranged adjacent to the insulating frame.

Abstract: An apparatus and method are provided. According to one embodiment, an apparatus includes a level-shifter circuit configured to output voltages Vol+ and Vol?; and an output alignment circuit configured to output voltages Vo+ and Vo? that are triggered by an edge of a combination of Vol+ and Vol?, and where Vo+ and Vo? are set by high states of Vol+ and Vol? prior to a transition on an input of the level-shifter circuit, and the method includes outputting, by a level-shifter circuit, voltages Vol+ and Vol?; and outputting, by an output alignment circuit, voltages Vo+ and Vo? that are triggered by an edge of a combination of Vol+ and Vol?, and where Vo+ and Vo? are set by high states of Vol+ and Vol? prior to a transition on an input of the level-shifter circuit.

Abstract: A female connector and a transmission wafer are provided. The female connector includes a housing and a plurality of transmission wafers inserted into the housing. Each of the transmission wafers includes an insulating frame, a plurality of grounding terminals fixed to the insulating frame, and a first shielding member and a second shielding member respectively disposed on two opposite sides of the insulating frame. In each of the transmission wafers, the second shielding member is disposed on a front end portion of the insulating frame, and the first and second shielding members are electrically connected to the grounding terminals so as to be electrically connected to each other through the grounding terminals. The second shielding member of one of any two adjacent transmission wafers is abutted against and electrically connected to the first shielding member of the other one of the any two adjacent transmission wafers.

Abstract: A female connector and a transmission wafer are provided. The female connector includes a housing and a plurality of transmission wafers inserted into the housing. Each of the transmission wafers includes an insulating frame, a plurality of grounding terminals fixed to the insulating frame, and a first shielding member and a second shielding member respectively disposed on two opposite sides of the insulating frame. In each of the transmission wafers, the second shielding member is disposed on a front end portion of the insulating frame, and the first and second shielding members are electrically connected to the grounding terminals so as to be electrically connected to each other through the grounding terminals. The second shielding member of one of any two adjacent transmission wafers is abutted against and electrically connected to the first shielding member of the other one of the any two adjacent transmission wafers.

Abstract: An electrical connector assembly, a female connector, and a male connector are provided. The electrical connector assembly includes a female connector and a male connector detachably inserted into the female connector. The female connector includes a housing and a plurality of transmission wafers inserted into the housing. Each of the transmission wafers includes an insulating frame and a plurality of grounding terminals fixed to the insulating frame. The male connector includes a carrier and a plurality of shielding terminals fixed to the carrier. Two side walls of each of the shielding terminals are respectively abutted against and electrically connected to two of the grounding terminals each having at least one first contacting portion.

Abstract: An apparatus and method are provided. According to one embodiment, an apparatus includes a level-shifter circuit configured to output voltages Vo1+ and Vo1?; and an output alignment circuit configured to output voltages Vo+ and Vo? that are triggered by an edge of a combination of Vo1+ and Vo1?, and where Vo+ and Vo? are set by high states of Vo1+ and Vo1? prior to a transition on an input of the level-shifter circuit, and the method includes outputting, by a level-shifter circuit, voltages Vo1+ and Vo1?; and outputting, by an output alignment circuit, voltages Vo+ and Vo? that are triggered by an edge of a combination of Vo1+ and Vo1?, and where Vo+ and Vo? are set by high states of Vo1+ and Vo1? prior to a transition on an input of the level-shifter circuit.

Abstract: A fast heat-sinking, current stabilization and pressure boosting device for condenser is disclosed, comprising a heat exchange module and an outer case. The heat exchange module is further divided into a high pressure area and a low pressure area, and an air in channel is installed in the high pressure area and a water out channel is installed in the low pressure area; also, the heat exchange module is provided with at least one channel, and the heat exchange module is assembled inside the outer case. As such, the pressure difference between the low pressure area and the high pressure area can drive the water in each of the inner channels to flow faster toward the low pressure area.

Abstract: A vapor chamber and a heat dissipation device with the vapor chamber are provided. The vapor chamber includes a first plate, a second plate, a first capillary strip, a first communication structure and a working medium. An accommodation space is defined by the first plate and the second plate collaboratively. The first capillary strip is installed in the accommodation space. The accommodation space is divided into a first region and a second region by the first capillary strip. The working medium is accommodated within the accommodation space. The working medium flows between the first region and the second region through the first communication structure. Since the working medium is guided to flow in the accommodation space by the first capillary strip and the first communication structure, the heat dissipating efficacy is enhanced.

Abstract: A composite-type heat pipe includes a working fluid, a first capillary structure, a second capillary structure and a pipe body. The first capillary structure has a smooth surface. The second capillary structure has plural trenches. The pipe body accommodates the working fluid. The pipe body includes a first section and a second section. The second section is connected with the first section. The first capillary structure is formed on a first inner wall of the first section. The second capillary structure with the trenches is formed on a second inner wall of the second section. The trenches extend along an axial direction of the pipe body.

Abstract: A data storage device includes a tray, a circuit board module and two storage units. The tray has a carrying space. The circuit board module includes a circuit board, a pair of adapter slots and a connection slot. The pair of adapter slots are disposed with an interval at one side of the tray, and the storage units are arranged side by side in the carrying space. Each storage unit includes a carrying box and a storage component. The carrying box is pivoted with a handle, and two sides of the handle are pivoted at opposite sides of the carrying box so that the handle is capable of rotating above the carrying box. The storage component is inserted in the adapter slot to electrically connect with the circuit board.

Abstract: A data storage device includes a tray, a circuit board module and two storage units. The tray has a carrying space. The circuit board module includes a circuit board, a pair of adapter slots and a connection slot. The pair of adapter slots are disposed with an interval at one side of the tray, and the storage units are arranged side by side in the carrying space. Each storage unit includes a carrying box and a storage component. The carrying box is pivoted with a handle, and two sides of the handle are pivoted at opposite sides of the carrying box so that the handle is capable of rotating above the carrying box. The storage component is inserted in the adapter slot to electrically connect with the circuit board.

Abstract: A test method for a transmit port of storage devices of a system host, the system host includes a computing module, and the test method includes the steps of: coupling a test storage device to the transmit port of the computing module, wherein the test storage device includes a controller and a cache unit; providing, by the computing module, data to the test storage device through the transmit port to perform a storage testing mode; writing, by the controller, the data to the cache unit to complete the write operation, and then stops the write operation to complete the storage test; reading, by the computing module, the data provided from the test storage device for the computing module requested, performing a reading testing mode, and the controller only transmit the data from the cache unit to the computing module to complete a reading test.

Abstract: A physiological signal processing device is provided. The physiological signal processing device includes a patch, a plurality of electrodes and a processing device. The plurality of electrodes detect an Electrocardiography (ECG) signal. The processing device is configured in the patch and is coupled to the plurality of electrodes to receive the ECG signal. Furthermore, according to the ECG signal, the processing device calculates a first differential value between a voltage of an R wave of the ECG signal and a reference ECG value, and determines whether the first differential value is greater than or equal to a first threshold to determine whether to adjust the positions of the electrodes. When the positions of the electrodes are determined, the processing device obtains heartbeat information and/or breathing information according to the ECG signal.