Patents by Inventor Chih-Wei Chiang

Chih-Wei Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250133678
    Abstract: An electronic device includes a chassis, a primary system board mounted to the chassis, first and second connectors, and a set of support members coupled to the chassis. The first connector is directly mounted and electrically connected to the primary system board, and includes first and second support walls, and a first pin protruding from the first support wall. The second connector includes a cable electrically connected to the primary system board, and includes third and fourth support walls, a first hole formed in the third support wall, and a second hole formed in the fourth support wall. A support member of the set of support members includes a second pin. The first pin protrudes into the first hole to couple the second connector to the first connector, and the second pin protrudes into the second hole to further couple the second connector to the first support member.
    Type: Application
    Filed: October 20, 2023
    Publication date: April 24, 2025
    Inventors: Chih-Wei Chiang, Chui Ching Chiu, Hsueh Yu Chao
  • Publication number: 20230237616
    Abstract: The present application discloses an image processing system. The image processing system comprises a first processing unit and a memory. The first processing unit receives a three-dimensional scene comprising a plurality of objects, generates a depth map according to distances between the objects and a viewpoint, renders a normal-resolution image of the scene observed from the viewpoint according to the depth map, appends depth information to the normal-resolution image to generate a normal-resolution image layer, and outputs the normal-resolution image layer. The normal-resolution image layer comprises three color channels and one alpha channel, in which color values of each of pixels of the normal-resolution image are stored in the three color channels of the normal-resolution image layer, and first depth values of the pixels of the normal-resolution image are stored in the alpha channel of the normal-resolution image layer. The memory stores the normal-resolution image layer.
    Type: Application
    Filed: January 27, 2022
    Publication date: July 27, 2023
    Inventor: CHIH-WEI CHIANG
  • Publication number: 20230155007
    Abstract: Fins for use in gate all-around field effect transistors (GAAFETs) can be manufactured to have substantially uniform profiles, so the shapes of the fins are independent of size and pitch. Fin profile optimization from a tapered profile to a substantially uniform profile can be achieved via fin height control modulation using additional physical shaping operations to reduce pattern loading. These improvements in the fin profile can be accomplished by stacking and refilling a flowable chemical vapor deposition (FCVD) film multiple times and by using composition tuning during the FCVD process to further modulate fin profiles.
    Type: Application
    Filed: June 9, 2022
    Publication date: May 18, 2023
    Applicant: Taiwan Semiconductor Manufacturing CO., Ltd.
    Inventor: Chih-Wei CHIANG
  • Publication number: 20200289648
    Abstract: The present disclosure relates to a complex having a core-shell structure, a composition and a textile comprising the same, and a method for treating thrombosis, cancer, or wounds using the same. The complex having the core-shell structure comprises a core; and a shell layer covering a surface of the core; wherein the core is made of polypyrrole.
    Type: Application
    Filed: February 27, 2020
    Publication date: September 17, 2020
    Inventors: Er-Yuan CHUANG, Chih-Hwa CHEN, Chih-Wei CHIANG, Pei-Ru JHENG, Nyambat BATZAYA, Mantosh Kumar SATAPATHY, Shao-Chan HUANG, Er-Chen CHO, Ting-Han CHEN
  • Publication number: 20200132095
    Abstract: A fool-proof housing is configured for a first mounting piece which includes a first fool-proof recess or a second mounting piece which includes a second fool-proof recess to be disposed thereon. The fool-proof housing includes a casing and a fool-proof element. The fool-proof element includes a fool-proof protrusion. The fool-proof element is movably disposed on the casing and includes a first position and a second position. When the fool-proof element is in the first position, the casing is configured for the first mounting piece to be mounted thereon, and the fool-proof protrusion blocks the second mounting piece from mounted on the casing. When the fool-proof element is in the second position, the casing is configured for the second mounting piece to be mounted thereon, and the fool-proof protrusion blocks the first mounting piece from mounted on the casing.
    Type: Application
    Filed: December 1, 2018
    Publication date: April 30, 2020
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Hsin-Liang CHEN, Chih-Wei CHIANG, Yu Wen LEE
  • Patent number: 10555433
    Abstract: A chassis includes a bottom plate, a fastener and a supporting component. The bottom plate includes a screw hole. The fastener comprises a threaded portion and a smooth portion that are connected to each other, and the threaded portion is configured to be screwed into the screw hole. The supporting component includes a through hole. The smooth portion of the fastener is configured to be disposed through the through hole so that the supporting component is rotatably disposed on the bottom plate so as to include a supporting position and a stored position. The supporting component is integrated.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: February 4, 2020
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Chih-Wei Chiang, Yuan-Chang Yang, Shih-Wei Chen, Jeng-Ting Pan
  • Patent number: 10345872
    Abstract: This disclosure relates to a computer case configured to fix an interface card. The computer case includes a main body, a plurality of mount brackets and a framework. The main body includes a first hole and a plurality of second holes. The plurality of second holes are located at a side of the first hole. The plurality of mount brackets are located at the first hole. The framework is conductive. The framework includes a plurality of protrusion portions and a plurality of main portions. The plurality of protrusion portions are connected to the plurality of main portions and are respectively inserted in the plurality of second holes. The framework is disposed on the main body via the plurality of protrusion portions. The plurality of main portions are respectively in contact with the plurality of mount brackets.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: July 9, 2019
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Shih-Wei Chen, Yuan-Chang Yang, Chih-Wei Chiang, Jeng-Ting Pan
  • Patent number: 10314190
    Abstract: A power adapting box and a fan module are provided. The power adapting box includes a box body, a plurality of first power adapters, an expansion socket and a plurality of second power adapters. The first power adapters are disposed in the box body. The expansion socket is detachably disposed in the box body. The second power adapters are disposed in the expansion socket.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: June 4, 2019
    Assignees: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Chih-Wei Chiang, Yuan-Chang Yang, Shih-Wei Chen
  • Patent number: 10164063
    Abstract: The method for forming a semiconductor structure includes forming a protection layer having a first portion and a second portion over a substrate and forming a dummy gate layer over the first portion and the second portion of the protection layer. The method for forming a semiconductor structure further includes patterning the dummy gate layer to form a dummy gate structure over the first portion of the protection layer and forming a spacer on a sidewall of the dummy gate structure over a second portion of the protection layer. The method for forming a semiconductor structure further includes replacing the first portion of the protection layer and the dummy gate structure by a gate dielectric layer and a gate electrode layer. In addition, a thickness of the protection layer is greater than a thickness of the gate dielectric layer.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: December 25, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Wei Chiang, Po-Hsiung Leu, Ding-I Liu
  • Publication number: 20180166560
    Abstract: The method for forming a semiconductor structure includes forming a protection layer having a first portion and a second portion over a substrate and forming a dummy gate layer over the first portion and the second portion of the protection layer. The method for forming a semiconductor structure further includes patterning the dummy gate layer to form a dummy gate structure over the first portion of the protection layer and forming a spacer on a sidewall of the dummy gate structure over a second portion of the protection layer. The method for forming a semiconductor structure further includes replacing the first portion of the protection layer and the dummy gate structure by a gate dielectric layer and a gate electrode layer. In addition, a thickness of the protection layer is greater than a thickness of the gate dielectric layer.
    Type: Application
    Filed: February 16, 2017
    Publication date: June 14, 2018
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Wei CHIANG, Po-Hsiung LEU, Ding-I LIU
  • Publication number: 20180116064
    Abstract: A power adapting box and a fan module are provided. The power adapting box includes a box body, a plurality of first power adapters, an expansion socket and a plurality of second power adapters. The first power adapters are disposed in the box body. The expansion socket is detachably disposed in the box body. The second power adapters are disposed in the expansion socket.
    Type: Application
    Filed: March 27, 2017
    Publication date: April 26, 2018
    Inventors: Chih-Wei Chiang, Yuan-Chang Yang, Shih-Wei Chen
  • Patent number: 9875005
    Abstract: A method of unlocking an electronic device having a touch-sensitive display includes at least the following steps: controlling the touch-sensitive display to have unlocking objects displayed at different locations for different time points; and when at least one contact is detected on the touch-sensitive display, determining whether to unlock the electronic device by referring to a contact status on the touch-sensitive display. Besides, a computer readable medium storing a program code is also provided, where the program code causes a processor to perform following steps when executed by the processor: controlling the touch-sensitive display to have unlocking objects displayed at different locations for different time points; and when at least one contact is detected on the touch-sensitive display, determining whether to unlock an electronic device by referring to a contact status on the touch-sensitive display.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: January 23, 2018
    Assignee: MEDIATEK INC.
    Inventor: Chih-Wei Chiang
  • Publication number: 20170150658
    Abstract: EMI-proof server chassis preventing EMI on an electronic component, includes a chassis and a double aperture flexible piece. The chassis includes a connection portion connected to the chassis, a first engagement portion and a second engagement portion. The first engagement portion and the second engagement portion are connected to and disposed on two sides of the connection portion. The first engagement portion and the second engagement portion are parallelly prolonged, and substantially opposite to each other. The double aperture flexible piece, shaped as a curvature plate, has a first aperture and a second aperture on two sides. The first engagement portion and the second engagement portion are engaged to the first aperture and the second aperture respectively, and the portion of the double aperture flexible piece between the first aperture and the second aperture is curved toward the electronic component, and contact with the electronic component.
    Type: Application
    Filed: May 17, 2016
    Publication date: May 25, 2017
    Inventors: Ying-Chao PENG, Chi-Cheng HSIAO, Kuo-En CHANG, Chih-Wei CHIANG
  • Patent number: 9642291
    Abstract: EMI-proof server chassis preventing EMI on an electronic component, includes a chassis and a double aperture flexible piece. The chassis includes a connection portion connected to the chassis, a first engagement portion and a second engagement portion. The first engagement portion and the second engagement portion are connected to and disposed on two sides of the connection portion. The first engagement portion and the second engagement portion are parallelly prolonged, and substantially opposite to each other. The double aperture flexible piece, shaped as a curvature plate, has a first aperture and a second aperture on two sides. The first engagement portion and the second engagement portion are engaged to the first aperture and the second aperture respectively, and the portion of the double aperture flexible piece between the first aperture and the second aperture is curved toward the electronic component, and contact with the electronic component.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: May 2, 2017
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Ying-Chao Peng, Chi-Cheng Hsiao, Kuo-En Chang, Chih-Wei Chiang
  • Patent number: 9513674
    Abstract: An electronic device includes a casing and a rotary flap door device. The rotary flap door device is installed inside the casing and includes a base plate and a door member. The base plate is mounted on the casing. A base constraining structure and a base engaging structure are formed on the base plate. The door member includes a door body, a door limit part and a door engaging portion. The door body is rotably disposed on the base plate. The door limit part extends from the door body and is for embedding into the base limit part. The door engaging portion protrudes from the door body and is for engaging with the base engaging portion.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: December 6, 2016
    Assignees: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Yuan-Chang Yang, Shih-Wei Chen, Shih-Cheng Yeh, Chih-Wei Chiang
  • Publication number: 20160157369
    Abstract: An electronic device includes a casing and a rotary flap door device. The rotary flap door device is installed inside the casing and includes a base plate and a door member. The base plate is mounted on the casing. A base constraining structure and a base engaging structure are formed on the base plate. The door member includes a door body, a door limit part and a door engaging portion. The door body is rotably disposed on the base plate. The door limit part extends from the door body and is for embedding into the base limit part. The door engaging portion protrudes from the door body and is for engaging with the base engaging portion.
    Type: Application
    Filed: March 31, 2015
    Publication date: June 2, 2016
    Inventors: Yuan-Chang Yang, Shih-Wei Chen, Shih-Cheng Yeh, Chih-Wei Chiang
  • Patent number: 9048185
    Abstract: Some embodiments relate to an integrated circuit (IC). The IC includes a semiconductor substrate having an upper surface with a source region and drain region proximate thereto. A channel region is disposed in the substrate between the source region and the drain region. A gate electrode is disposed over the channel region and separated from the channel region by a gate dielectric. Sidewall spacers are formed about opposing sidewalls of the gate electrode. Upper outer edges of the sidewall spacers extend outward beyond corresponding lower outer edges of the sidewall spacers. A liner is disposed about opposing sidewalls of the sidewall spacers and has a first thickness at an upper portion of liner and a second thickness at a lower portion of the liner. The first thickness is less than the second thickness. Other embodiments are also disclosed.
    Type: Grant
    Filed: August 11, 2014
    Date of Patent: June 2, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Wei Chiang, Kuang-Cheng Wu, Wen-Long Lee, Po-Hsiung Leu, Ding-I Liu
  • Patent number: 9001412
    Abstract: A microelectromechanical (MEMS) device includes a substrate, a movable element over the substrate, and an actuation electrode above the movable element. The movable element includes a deformable layer and a reflective element. The deformable layer is spaced from the reflective element.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: April 7, 2015
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Clarence Chui, William Cummings, Brian James Gally, Lior Kogut, Ming-Hau Tung, Yeh-Jiun Tung, Chih-Wei Chiang, Denis Endisch
  • Publication number: 20140349471
    Abstract: Some embodiments relate to an integrated circuit (IC). The IC includes a semiconductor substrate having an upper surface with a source region and drain region proximate thereto. A channel region is disposed in the substrate between the source region and the drain region. A gate electrode is disposed over the channel region and separated from the channel region by a gate dielectric. Sidewall spacers are formed about opposing sidewalls of the gate electrode. Upper outer edges of the sidewall spacers extend outward beyond corresponding lower outer edges of the sidewall spacers. A liner is disposed about opposing sidewalls of the sidewall spacers and has a first thickness at an upper portion of liner and a second thickness at a lower portion of the liner. The first thickness is less than the second thickness. Other embodiments are also disclosed.
    Type: Application
    Filed: August 11, 2014
    Publication date: November 27, 2014
    Inventors: Chih-Wei Chiang, Kuang-Cheng Wu, Wen-Long Lee, Po-Hsiung Leu, Ding-I Liu
  • Publication number: 20140289843
    Abstract: A method of unlocking an electronic device having a touch-sensitive display includes at least the following steps: controlling the touch-sensitive display to have unlocking objects displayed at different locations for different time points; and when at least one contact is detected on the touch-sensitive display, determining whether to unlock the electronic device by referring to a contact status on the touch-sensitive display. Besides, a computer readable medium storing a program code is also provided, where the program code causes a processor to perform following steps when executed by the processor: controlling the touch-sensitive display to have unlocking objects displayed at different locations for different time points; and when at least one contact is detected on the touch-sensitive display, determining whether to unlock an electronic device by referring to a contact status on the touch-sensitive display.
    Type: Application
    Filed: September 12, 2012
    Publication date: September 25, 2014
    Inventor: Chih-Wei Chiang