Patents by Inventor Chih-Wei Chiang

Chih-Wei Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145470
    Abstract: A method for processing an integrated circuit includes forming first and second gate all around transistors. The method forms a dipole oxide in the first gate all around transistor without forming the dipole oxide in the second gate all around transistor. This is accomplished by entirely removing an interfacial dielectric layer and a dipole-inducing layer from semiconductor nanosheets of the second gate all around transistor before redepositing the interfacial dielectric layer on the semiconductor nanosheets of the second gate all around transistor.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 2, 2024
    Inventors: Lung-Kun CHU, Mao-Lin HUANG, Chung-Wei HSU, Jia-Ni YU, Kuo-Cheng CHIANG, Kuan-Lun CHENG, Chih-Hao WANG
  • Patent number: 11961913
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a source/drain feature on a semiconductor fin structure, a first isolation structure surrounding the semiconductor fin structure, source/drain spacers on the first isolation structure and surrounding a lower portion of the source/drain feature, a dielectric fin structure adjoining and in direct contact with the first isolation structure and one of the source/drain spacers, and an interlayer dielectric layer over the source/drain spacers and the dielectric fin structure and surrounding an upper portion of the source/drain feature.
    Type: Grant
    Filed: April 21, 2023
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuo-Cheng Chiang, Shi-Ning Ju, Ching-Wei Tsai, Kuan-Lun Cheng, Chih-Hao Wang
  • Patent number: 11961840
    Abstract: A semiconductor device structure is provided. The device includes one or more first semiconductor layers, each first semiconductor layer of the one or more first semiconductor layers is surrounded by a first intermixed layer, wherein the first intermixed layer comprises a first material and a second material.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Mao-Lin Huang, Lung-Kun Chu, Chung-Wei Hsu, Jia-Ni Yu, Kuo-Cheng Chiang, Kuan-Lun Cheng, Chih-Hao Wang
  • Publication number: 20240120018
    Abstract: A memory device, a failure bits detector, and a failure bits detection method thereof are provided. The failure bits detector includes a current generator, a current mirror, and a comparator. The current generator generates a first current according to a reference code. The current mirror mirrors the first current to generate a second current at a second end of the current mirror. The comparator compares a first voltage at a first input end with a second voltage at a second input end to generate a detection result.
    Type: Application
    Filed: October 5, 2022
    Publication date: April 11, 2024
    Applicant: MACRONIX International Co., Ltd.
    Inventors: Chung-Han Wu, Che-Wei Liang, Chih-He Chiang, Shang-Chi Yang
  • Publication number: 20240120402
    Abstract: A semiconductor device structure, along with methods of forming such, are described. The semiconductor device structure includes a first dielectric feature extending along a first direction, the first dielectric feature comprising a first dielectric layer having a first sidewall and a second sidewall opposing the first sidewall, a first semiconductor layer disposed adjacent the first sidewall, the first semiconductor layer extending along a second direction perpendicular to the first direction, a second dielectric feature extending along the first direction, the second dielectric feature disposed adjacent the first semiconductor layer, and a first gate electrode layer surrounding at least three surfaces of the first semiconductor layer, and a portion of the first gate electrode layer is exposed to a first air gap.
    Type: Application
    Filed: November 19, 2023
    Publication date: April 11, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jia-Ni YU, Kuo-Cheng CHIANG, Mao-Lin HUANG, Lung-Kun CHU, Chung-Wei HSU, Chun-Fu LU, Chih-Hao WANG, Kuan-Lun CHENG
  • Patent number: 11956469
    Abstract: Video processing methods and apparatuses implemented in a video encoding or decoding system with conditional secondary transform signaling. The video encoding system determines and applies a transform operation to residuals of a transform block to generate final transform coefficients, and adaptively signals a secondary transform index according to a position of a last significant coefficient in the transform block. A value of the secondary transform index is determined according to the transform operation.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: April 9, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Man-Shu Chiang, Chih-Wei Hsu, Tzu-Der Chuang, Ching-Yeh Chen
  • Patent number: 11956421
    Abstract: Method and apparatus of video coding are disclosed. According to one method, in the decoder side, a predefined Intra mode is assigned to a neighboring block adjacent to the current luma block when the neighboring block satisfies one or more conditions. An MPM (Most Probable Mode) list is derived based on information comprising at least one of neighboring Intra modes. A current Intra mode is derived utilizing the MPM list. The current luma block is decoded according to the current Intra mode According to another method, a predefined Intra mode is assigned to a neighboring block adjacent to the current luma block if the neighboring block is coded in BDPCM (Block-based Delta Pulse Code Modulation) mode, where the predefined Intra mode is set to horizontal mode or vertical mode depending on prediction direction used by the BDPCM mode.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: April 9, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Man-Shu Chiang, Chih-Wei Hsu, Tzu-Der Chuang, Ching-Yeh Chen, Yu-Wen Huang, Shih-Ta Hsiang
  • Publication number: 20240113195
    Abstract: Semiconductor structures and methods for forming the same are provided. The semiconductor structure includes a plurality of first nanostructures formed over a substrate, and a dielectric wall adjacent to the first nanostructures. The semiconductor structure also includes a first liner layer between the first nanostructures and the dielectric wall, and the first liner layer is in direct contact with the dielectric wall. The semiconductor structure also includes a gate structure surrounding the first nanostructures, and the first liner layer is in direct contact with a portion of the gate structure.
    Type: Application
    Filed: February 22, 2023
    Publication date: April 4, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jia-Ni YU, Lung-Kun CHU, Chun-Fu LU, Chung-Wei HSU, Mao-Lin HUANG, Kuo-Cheng CHIANG, Chih-Hao WANG
  • Patent number: 11948987
    Abstract: A semiconductor device according to the present disclosure includes a source feature and a drain feature, a plurality of semiconductor nanostructures extending between the source feature and the drain feature, a gate structure wrapping around each of the plurality of semiconductor nanostructures, a bottom dielectric layer over the gate structure and the drain feature, a backside power rail disposed over the bottom dielectric layer, and a backside source contact disposed between the source feature and the backside power rail. The backside source contact extends through the bottom dielectric layer.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: April 2, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Lung-Kun Chu, Mao-Lin Huang, Chung-Wei Hsu, Jia-Ni Yu, Kuo-Cheng Chiang, Kuan-Lun Cheng, Chih-Hao Wang
  • Patent number: 11943476
    Abstract: Video processing methods and apparatuses implemented in a video encoding or decoding system with conditional secondary transform signaling. The video encoding system determines and applies a transform operation to residuals of one or more transform blocks to generate final transform coefficients, and skip signaling a secondary transform index if a position of a last significant coefficient in each considered transform block is less than or equal to a predefined position; otherwise, the video encoding system signals a secondary transform index according to the transform operation.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: March 26, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Man-Shu Chiang, Chih-Wei Hsu, Tzu-Der Chuang, Ching-Yeh Chen
  • Publication number: 20240096880
    Abstract: In some embodiments, the present disclosure relates to an integrated chip. The integrated chip includes a first channel structure configured to transport charge carriers within a first transistor device and a first gate electrode layer wrapping around the first channel structure. A second channel structure is configured to transport charge carriers within a second transistor device. A second gate electrode layer wraps around the second channel structure. The second gate electrode layer continuously extends from around the second channel structure to cover the first gate electrode layer. A third channel structure is configured to transport charge carriers within a third transistor device. A third gate electrode layer wraps around the third channel structure. The third gate electrode layer continuously extends from around the third channel structure to cover the second gate electrode layer.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 21, 2024
    Inventors: Mao-Lin Huang, Chih-Hao Wang, Kuo-Cheng Chiang, Jia-Ni Yu, Lung-Kun Chu, Chung-Wei Hsu
  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Publication number: 20240080490
    Abstract: A video codec receives data for a block of pixels to be encoded or decoded as a current block of a current picture of a video. The video codec signals or parses a first syntax element for a first coding mode in a particular set of two or more coding modes. Each of coding mode of the particular set of coding modes modifies a merge candidate or an inter-prediction that is generated based on the merge candidate. The video codec enables the first coding mode and disables one or more other coding modes in the particular set of coding modes. The disabled one or more coding modes in the particular set of coding modes are disabled without parsing syntax elements for the disabled coding modes. The video codec encodes or decodes the current block by using the enabled first coding mode and bypassing the disabled coding modes.
    Type: Application
    Filed: November 10, 2023
    Publication date: March 7, 2024
    Applicant: HFI Innovation Inc.
    Inventors: Man-Shu Chiang, Chih-Wei Hsu, Ching-Yeh Chen
  • Publication number: 20240079758
    Abstract: An electronic device includes a metal back cover, a metal frame, and a first, second, third, and fourth radiators. The metal frame includes a discrete part and two connection parts. The connection parts are located by two sides of the discrete part, separated from the discrete part, and connected to the metal back cover. A U-shaped slot is formed between the discrete part and the metal back cover and between the discrete part and the connection parts. The first radiator is separated from the discrete part and includes a feed end. The second, third, and fourth radiators are connected to the discrete part and the metal back cover. The third radiator is located between the first and second radiators. The first radiator is located between the third and fourth radiators. The discrete part and the first, second, third, and fourth radiators form an antenna module together.
    Type: Application
    Filed: August 2, 2023
    Publication date: March 7, 2024
    Applicant: PEGATRON CORPORATION
    Inventors: Chien-Yi Wu, Chao-Hsu Wu, Chih-Wei Liao, Hau Yuen Tan, Shih-Keng Huang, Wen-Hgin Chuang, Lin-Hsu Chiang, Chang-Hua Wu, Han-Wei Wang, Chun-Jung Hu
  • Patent number: 11924413
    Abstract: A video decoder that decodes a current block of pixels by using multi-hypothesis combined prediction mode is provided. The video decoder generates a first prediction of the current block based on an inter prediction mode. The video decoder enables the combined prediction mode for the current block based on a block size of the current block determined according to a width and a height of the current block. The combined prediction mode is disabled when the width of or the height of the current block is greater than a threshold length. When the combined prediction mode is enabled, the video decoder generates a second prediction based on an intra prediction mode that is inferred to be a planar mode, and subsequently a combined prediction for the current block based on the first prediction and the second prediction. The video decoder reconstructs the current block by using the combined prediction.
    Type: Grant
    Filed: March 6, 2023
    Date of Patent: March 5, 2024
    Assignee: MediaTek Inc.
    Inventors: Man-Shu Chiang, Chih-Wei Hsu
  • Publication number: 20240071953
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20240071954
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Patent number: 11917185
    Abstract: A method and apparatus of Inter prediction for video coding using Multi-hypothesis (MH) are disclosed. If an MH mode is used for the current block: at least one MH candidate is derived using reduced reference data by adjusting at least one coding-control setting; an Inter candidate list is generated, where the Inter candidate list comprises said at least one MH candidate; and current motion information associated with the current block is encoded using the Inter candidate list at the video encoder side or the current motion information associated with the current block is decoded at the video decoder side using the Merge candidate list. The coding control setting may correspond to prediction direction setting, filter tap setting, block size of reference block to be fetched, reference picture setting or motion limitation setting.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: February 27, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Man-Shu Chiang, Chih-Wei Hsu, Tzu-Der Chuang, Ching-Yeh Chen, Yu-Wen Huang
  • Publication number: 20230237616
    Abstract: The present application discloses an image processing system. The image processing system comprises a first processing unit and a memory. The first processing unit receives a three-dimensional scene comprising a plurality of objects, generates a depth map according to distances between the objects and a viewpoint, renders a normal-resolution image of the scene observed from the viewpoint according to the depth map, appends depth information to the normal-resolution image to generate a normal-resolution image layer, and outputs the normal-resolution image layer. The normal-resolution image layer comprises three color channels and one alpha channel, in which color values of each of pixels of the normal-resolution image are stored in the three color channels of the normal-resolution image layer, and first depth values of the pixels of the normal-resolution image are stored in the alpha channel of the normal-resolution image layer. The memory stores the normal-resolution image layer.
    Type: Application
    Filed: January 27, 2022
    Publication date: July 27, 2023
    Inventor: CHIH-WEI CHIANG
  • Publication number: 20230155007
    Abstract: Fins for use in gate all-around field effect transistors (GAAFETs) can be manufactured to have substantially uniform profiles, so the shapes of the fins are independent of size and pitch. Fin profile optimization from a tapered profile to a substantially uniform profile can be achieved via fin height control modulation using additional physical shaping operations to reduce pattern loading. These improvements in the fin profile can be accomplished by stacking and refilling a flowable chemical vapor deposition (FCVD) film multiple times and by using composition tuning during the FCVD process to further modulate fin profiles.
    Type: Application
    Filed: June 9, 2022
    Publication date: May 18, 2023
    Applicant: Taiwan Semiconductor Manufacturing CO., Ltd.
    Inventor: Chih-Wei CHIANG