Abstract: An imaging lens assembly includes a plurality of optical elements and an accommodating assembly, wherein the accommodating assembly is for containing the optical elements. The accommodating assembly includes a conical-shaped light blocking sheet and a lens barrel. The conical-shaped light blocking sheet includes an out-side portion and a conical portion, and the conical portion is connected to the out-side portion. The conical portion includes a conical structure tapered from the out-side portion toward one of an object-side and an image-side along the optical axis. The lens barrel is disposed on one side of the conical portion. The optical elements include a most object-side optical element, a most image-side optical element and at least one optical element. The conical structure of the conical-shaped light blocking sheet is physically contacted with only one of the lens barrel, the most object-side optical element and the most image-side optical element.

Abstract: An electronic device includes a monitor stand, a hinge mechanism, and an operation element. The hinge mechanism includes a back plate, a speed reduction assembly, and a friction assembly. The back plate is fixed to the monitor stand. The speed reduction assembly includes an input plate and a speed reduction member. The speed reduction member is arranged on the input plate. The friction assembly is arranged between the back plate and the input plate. The operation element is connected to the speed reduction member. A rotation center of the operation element coincides with an axis of the back plate and the speed reduction member are coaxially arranged.

Abstract: An aiming system includes a positioner, an aiming device, and a processor. The positioner has a function of acquiring spatial information, and the aiming device is connected to the positioner, and the processor is connected to the positioner or the aiming device. A method of using the aiming system is also provided. Surgical guidance is more intuitive by directly combining the positioner with the aiming device.

Abstract: A leak check is performed on a semiconductor wafer processing tool that includes a process chamber and process gas lines, and a semiconductor wafer is processed using the semiconductor wafer processing tool if the leak check passes. Each gas line includes a mass flow controller (MFC) and normally closed valves including an upstream and downstream valves upstream and downstream of the MFC. Leak checking includes: leak checking up to the downstream valves of the gas lines with the upstream valves closed and the downstream valves of the gas lines closed; and leak checking up to the upstream valve of each the process gas line with the upstream valves of the of the process gas lines closed and with the downstream valve of the of the process gas line being leak checked open and the downstream valve of every other process gas line closed.

Abstract: A semiconductor device and method of formation are provided. The semiconductor device comprises a silicide layer over a substrate, a metal plug in an opening defined by a dielectric layer over the substrate, a first metal layer between the metal plug and the dielectric layer and between the metal plug and the silicide layer, a second metal layer over the first metal layer, and an amorphous layer between the first metal layer and the second metal layer.

Abstract: The present disclosure is directed to a transfer blade including a first end segment, a second end segment opposite to the first end segment, and an intermediate segment extending from the first end segment to the second end segment. The first end segment includes a first contact region and the second end segment includes a second contact region. The first and second contact regions are configured to contact locations of a surface of a workpiece that do not overlap or are not aligned with a sensitive area of the workpiece. The sensitive area of the workpiece may be an EUV frame or a reticle of the workpiece. A non-contact region extends continuously along the first end segment, the intermediate segment, and the second end segment, and the non-contact region overlaps the sensitive area of the workpiece and is spaced apart from the sensitive area of the workpiece.

Abstract: A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.

Abstract: A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.

Abstract: An apparatus for performing a deposition process on a semiconductor wafer includes a chamber, a wafer holder, and a shielding structure. The chamber contains a reaction area, the wafer holder is disposed in the chamber to hold the semiconductor wafer, and the reaction area is above the semiconductor wafer. The shielding structure is disposed in the chamber and isolates an inner sidewall of the chamber from the reaction area. The shielding structure includes a base member, a first member, and a second member. The base member is disposed between the inner sidewall of the chamber and the wafer holder. The first member is disposed on the base member and is windowless. The second member is disposed on the base member and within the first member, and the second member includes a sidewall provided with a first window to transfer the semiconductor wafer.

Abstract: A clamp ring including an inner periphery of increased diameter at locations where inwardly extending tabs are not located reduces the risk a workpiece that is placed in close proximity to the clamp ring or which contacts the clamp ring during processing will stick to the clamp ring.

Abstract: A wafer pod transfer assembly is provided. The wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.

Abstract: A deposition tool includes a power cable pedestal including a pedestal body with a first surface and a second surface and a guide hole that extends through the pedestal body from the first surface to the second surface, where at least a portion of a sidewall of the guide hole has a slanted surface, and where the pedestal body is formed from a first material with a melting point that is higher than a melting point of Polyoxymethylene (POM). The deposition tool includes a bushing arranged over the guide hole, where the bushing is formed from a second material with a melting point that is higher than the melting point of POM.

Abstract: Board member fastener used to rivet first board member and second board member. First and second board members each have drilled therein a different diameter of hole. First board member provides first through hole. Second board member provides second through hole. Top of first through hole of first board member is formed with stop surface that tapers toward outer diameter so that when board member fastener is punch impacted, board member fastener sinks into interior of first through hole to cut second board member and to deform, and first board member is forced by sinking stress of board member fastener and tightly pressed on second board member upon punch impact, and thus, board member fastener, first board member and second board member are deformed and fitted to each other, achieving a riveting structure that can be applied to different materials and can overcome deformation caused by heat expansion and contraction.

Abstract: Board member fastener used to rivet first board member and second board member. First and second board members each have drilled therein a different diameter of hole. First board member provides first through hole. Second board member provides second through hole. Top of first through hole of first board member is formed with stop surface that tapers toward outer diameter so that when board member fastener is punch impacted, board member fastener sinks into interior of first through hole to cut second board member and to deform, and first board member is forced by sinking stress of board member fastener and tightly pressed on second board member upon punch impact, and thus, board member fastener, first board member and second board member are deformed and fitted to each other, achieving a riveting structure that can be applied to different materials and can overcome deformation caused by heat expansion and contraction.

Abstract: A board member fastener used to rivet first and second board members including a first board member and a second board member. When the board member faster is punch impacted, it sinks into the interior of the through hole of the first board member to cut the second board member and to deform, and the first board member is forced by the sinking stress of the board member faster and tightly pressed on the second board member upon the punch impact, and thus, the board member faster and the first and second board members are deformed and fitted to each other, achieving a riveting structure that can be applied to different materials and can overcome the deformation caused by heat expansion and contraction.

Abstract: A method for preparing polysaccharide nanocomposite particles is provided. The method comprises providing a first solution comprising an active component and a polysaccharide; adding a cross-linking agent to the first solution to provide a second solution; and allowing the second solution to conduct the reaction to form polysaccharide nanocomposite particles. The polysaccharide nanocomposite particles thus prepared show good coating ratio and enhanced applicability. Also provided is a method for inducing cancer cell apoptosis in a subject, comprising administrating to the subject an effective amount of the polysaccharide nanocomposite particles.

Abstract: A nanometal dispersion and a method for preparing a nanometal dispersion are provided. The method comprises mixing a metal seed crystal aqueous solution, a polysaccharide aqueous solution, and a metal compound aqueous solution, followed by allowing the resulting mixture to conduct a reduction-oxidation reaction to form a nanometal. The produced nanometal dispersion comprises a polysaccharide and a nanometal. The polysaccharide is composed of N-actyl-D-glucosamine and glucuronic acid, and the nanometal has multimorphology.

Abstract: A server includes a casing, a motherboard, a power supply unit and a pair of expansion modules. The motherboard is disposed in the casing, and the motherboard includes two slots disposed in the casing. The power supply unit is disposed in the casing and under the motherboard. The expansion modules are disposed in the casing, and each of the expansion modules includes a connecting card and a plurality of expansion cards. When the connecting card is electrically coupled to one of the slots of the motherboard, the expansion modules are disposed at two opposite sides of the motherboard correspondingly.