Patents by Inventor Chih-Wei Hu

Chih-Wei Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11187965
    Abstract: An optical element driving mechanism is provided, including a fixed part, a movable part, a driving assembly, and a stopping assembly. The movable part is movably disposed on the fixed part, and the movable part is connected to a first optical element. The driving assembly is at least partially disposed on the fixed part. The stopping assembly is disposed between the movable part and the fixed part. The stopping assembly limits the range of motion of the movable part relative to the fixed part.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: November 30, 2021
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chao-Hsi Wang, Chih-Wei Weng, He-Ling Chang
  • Patent number: 11183511
    Abstract: A memory device and a manufacturing method for the same are provided. The memory device comprises a stack structure and a channel structure. The stack structure is on a substrate and comprises gate electrodes and insulating films stacked alternately. The channel structure is electrically coupled to the gate electrodes, and is on sidewall surfaces of the gate electrodes. The channel structure comprises a first channel structure and a second channel structure. The second channel structure is on an upper surface of the first channel structure. The first channel structure and/or the second channel structure has a ring shape.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: November 23, 2021
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Chih-Wei Hu, Teng-Hao Yeh
  • Patent number: 11181669
    Abstract: An optical system is provided and includes a fixed assembly, a movable element and a driving module. The fixed assembly has a main axis. The movable element is movable relative to the fixed assembly and has a surface facing a first optical element. The driving module is configured to drive the movable element to move relative to the fixed assembly.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: November 23, 2021
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Che-Wei Chang, Chih-Wen Chiang, Chen-Er Hsu, Fu-Yuan Wu, Shou-Jen Liu, Chih-Wei Weng, Mao-Kuo Hsu, Hsueh-Ju Lu, Che-Hsiang Chiu
  • Publication number: 20210358821
    Abstract: A forming method of a semiconductor package includes the following steps. A first die is provided. The first die includes a first bonding structure and a first seal ring, the first bonding structure is formed at a first side of the first die, a first portion of the first seal ring is formed between the first side and the first bonding structure, and a width of the first portion is smaller than a width of a second portion of the first seal ring. A second die is provided. The second die includes a second bonding structure. The first die and the second die are bonded onto an integrated circuit through the first bonding structure and the second bonding structure.
    Type: Application
    Filed: July 27, 2021
    Publication date: November 18, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Wei Chen, Jie Chen, Ming-Fa Chen, Chih-Chia Hu
  • Patent number: 11175475
    Abstract: A multiple-lens camera system is provided, including a first lens driving module, a second lens driving module, and a shielding member. The first and second lens driving modules respectively include a frame, a lens holder movably disposed in the frame for holding a lens, a magnetic element disposed on a side of the lens holder and a driving board, wherein the driving board has a first coil corresponding to the magnetic element, to generate a magnetic force for moving the lens holder and the lens relative to the driving board. The shielding member is disposed in the first lens driving module and between the two magnetic elements of the first and second lens driving modules which are adjacent to each other, to suppress magnetic interference between the first and second lens driving modules.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: November 16, 2021
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Bing-Ru Song, Chih-Wei Weng, Shu-Shan Chen
  • Patent number: 11169429
    Abstract: An optical system is provided, including a light path adjustment module, an optical element driving module and a light flux adjustment module, The light path adjustment module is used for receiving light traveling in a first direction and adjusting the path of the light. The optical element driving module is used for receiving light. The light flux adjustment module is used for adjusting the light flux of the light, wherein the light flux adjustment module is disposed between the light path adjustment module and the optical element driving module.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: November 9, 2021
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Hsi Wang, Chao-Chang Hu, Chih-Wei Weng, Sin-Jhong Song
  • Publication number: 20210335804
    Abstract: A semiconductor structure and a method for manufacturing the same. The semiconductor structure includes a first staircase structure, a second staircase structure, a conductive pillar, and a contact pillar. The first staircase structure includes conductive stair layers. The conductive pillar passes through the second staircase structure. The conductive pillar has an upper conductive pillar end and a lower conductive pillar end opposing to the upper conductive pillar end. The contact pillar is electrically connected on one conductive stair layer of the conductive stair layers. The contact pillar has an upper contact end and a lower contact end opposing to the upper contact end. The upper contact end and the lower contact end are respectively electrically connected to the upper conductive pillar end of the conductive pillar and the one conductive stair layer.
    Type: Application
    Filed: April 24, 2020
    Publication date: October 28, 2021
    Inventors: Teng-Hao YEH, Hang-Ting LUE, Chih-Wei HU
  • Patent number: 11156899
    Abstract: A light flux adjustment module is provided for adjusting light flux of light having an optical axis, including a fixed portion, a connecting element, a first blade, and a drive assembly. The fixed portion includes a window, and the light passes through the window. The connecting element is movably connected to the fixed portion. The first blade is movably connected to the connecting element and the fixed portion, and the first blade is adjacent to the window. The drive assembly is used for driving the connecting element to move relative to the fixed portion in a first moving dimension. When the connecting element is moved relative to the fixed portion in the first direction, the first blade is driven by the connecting element to move relative to the fixed portion in a second moving dimension, and the first moving dimension and the second moving dimension are different.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: October 26, 2021
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Hsi Wang, Chao-Chang Hu, Chih-Wei Weng, Sin-Jhong Song
  • Publication number: 20210327789
    Abstract: A manufacturing method of a semiconductor structure includes at least the following steps. Forming a first tier includes forming a conductive via extending from a lower portion of a first interconnect structure into a first semiconductor substrate underlying the lower portion; forming an upper portion of the first interconnect structure on the conductive via and the lower portion; forming a first surface dielectric layer on the upper portion; and forming a first and a second bonding connectors in the first surface dielectric layer. The first bonding connector extends to be in contact with an upper-level interconnecting layer of the first interconnect structure, the second bonding connector is narrower than the first bonding connector and extends to be in contact with a lower-level interconnecting layer of the first interconnect structure, and a top surface of the conductive via is between the upper-level interconnecting layer and the first semiconductor substrate.
    Type: Application
    Filed: July 2, 2021
    Publication date: October 21, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chia Hu, Hsien-Wei Chen, Ming-Fa Chen, Sen-Bor Jan
  • Patent number: 11133274
    Abstract: A method embodiment includes forming a sacrificial film layer over a top surface of a die, the die having a contact pad at the top surface. The die is attached to a carrier, and a molding compound is formed over the die and the sacrificial film layer. The molding compound extends along sidewalls of the die. The sacrificial film layer is exposed. The contact pad is exposed by removing at least a portion of the sacrificial film layer. A first polymer layer is formed over the die, and a redistribution layer (RDL) is formed over the die and electrically connects to the contact pad.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: September 28, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu, Chien Ling Hwang, Chih-Wei Lin, Chen-Shien Chen
  • Patent number: 11126068
    Abstract: An optical system is provided, including a fixed part, a movable part, a first optical element, a driving assembly, and a circuit assembly. The movable part is movable relative to the fixed part. The first optical element is connected to the movable part. The driving assembly is configured for driving the movable part to move relative to the fixed part. The circuit assembly is electrically connected to the driving assembly.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: September 21, 2021
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Sung-Mao Tsai, Liang-Ting Ho, Chih-Wei Weng, Chia-Che Wu, Sin-Jhong Song
  • Patent number: 11125920
    Abstract: An optical system is provided, including a first optical member driving mechanism, a second optical member driving mechanism, and a first fixing component. The first optical member driving mechanism includes a first fixed portion, a first movable portion, a plurality of elastic members, and a first driving module. Each of the elastic members is elastically connected to the first fixed portion and the first movable portion. The second optical member driving mechanism includes a second fixed portion, a second movable portion, and a second driving module. The second movable portion is movably connected to the second fixed portion. The second driving module can drive the second movable portion to rotate relative to the second fixed portion. The first fixing component affixes the first optical member driving mechanism to the second optical member driving mechanism.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: September 21, 2021
    Assignee: TDK TAIWAN CORP.
    Inventors: Chen-Hsien Fan, Chao-Chang Hu, Sung-Mao Tsai, Liang-Ting Ho, Chih-Wei Weng, Shiang-Ming Yu, Kuen-Wang Tsai, Sin-Jhong Song
  • Publication number: 20210288428
    Abstract: An electronic device includes a first connection module, a second connection module, and a positioning assembly. The positioning assembly includes a guide pin, a guide post, a guide bar, and an elastic component. The guide pin is fixed on a first surface of the first connection module, and the guide post is fixed on a second surface of the second module. The electronic device includes a positioning assembly which serves to position components during the installation of the electronic device. The positioning assembly provides space for positional adjustment to the first component and the second component and the elasticity of the elastic component avoids crushing or handling damage to the first component and the second component.
    Type: Application
    Filed: May 26, 2020
    Publication date: September 16, 2021
    Inventor: CHIH-WEI HU
  • Publication number: 20210287966
    Abstract: A semiconductor package includes a substrate. The semiconductor package further includes a plurality of metal pillars on a top surface of the substrate. The semiconductor package further includes a semiconductor component on the substrate, wherein the semiconductor component includes one or more dies, and the semiconductor component has a top surface. The semiconductor package further includes a mold compound encapsulating the plurality of metal pillars and the semiconductor component, wherein the mold compound has a top surface above the top surface of the semiconductor component. The semiconductor package further includes an interposer coupled to the plurality of metal pillars.
    Type: Application
    Filed: June 1, 2021
    Publication date: September 16, 2021
    Inventors: Hui-Min HUANG, Chen-Shien CHEN, Chung-Shi LIU, Chih-Wei LIN, Ming-Da CHENG, Shou-Cheng HU
  • Publication number: 20210278627
    Abstract: An optical element driving mechanism is provided in the present disclosure. The optical element driving mechanism includes a fixed portion, a movable portion, a driving assembly and a first connecting assembly. The movable portion is connected to an optical element. The movable portion moves relative to the fixed portion. The driving assembly drives the movable portion to move relative to the fixed portion. The movable portion is movably connected to the fixed portion via the first connecting assembly.
    Type: Application
    Filed: March 5, 2021
    Publication date: September 9, 2021
    Inventors: Yi-Ho CHEN, Chao-Chang HU, Mao-Kuo HSU, Shu-Shan CHEN, Chih-Wei WENG, Kai-Jing FU, Sung-Mao TSAI
  • Patent number: 11106000
    Abstract: A driving mechanism for supporting an optical member is provided, including a base, a frame, a movable portion, a driving module, and an adhesive member. The base includes a plurality of first sidewalls, and at least one recess is formed on the first sidewalls. The frame includes a plurality of second sidewalls, and at least one opening is formed on the second sidewalls. The base and the frame form a hollow box, and the opening corresponds to the recess. The movable portion and the driving module are disposed in the hollow box. The driving module can drive the movable portion to move relative to the base. The adhesive member is accommodated in the opening and the recess, and extended along the first sidewalls. The adhesive member is disposed between the first sidewalls and the second sidewalls.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: August 31, 2021
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Bing-Ru Song, Yi-Ho Chen, Chia-Pin Hsu, Chih-Wei Weng, Shin-Hua Chen, Chien-Lun Huang, Chao-Chun Chang, Shou-Jen Liu, Kun-Shih Lin, Nai-Wen Hsu, Yu-Cheng Lin, Shang-Yu Hsu, Yu-Huai Liao, Yi-Hsin Nieh, Shih-Ting Huang, Kuo-Chun Kao, Fu-Yuan Wu
  • Patent number: 11107779
    Abstract: A semiconductor package includes a first die and a second die. The first die includes a first spiral section and first bonding metallurgies of an inductor. The first bonding metallurgies are connected to the first spiral section. The second die is bonded to the first die. The second die includes a second spiral section and second bonding metallurgies of the inductor. The second bonding metallurgies are connected to the second spiral section. The inductor extends from the first die to the second die.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: August 31, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Wei Chen, Ming-Fa Chen, Sen-Bor Jan, Chih-Chia Hu
  • Patent number: 11101287
    Abstract: A three-dimensional memory device includes a plurality of conductive layers and insulating layers alternately formed to define a multi-layer stacked structure. The multi-layer stacked structure includes a stair region and an non-stair region, the stair region includes a plurality of steps, each step includes an immediately-adjacent pair of the conductive layers and insulating layers. A plurality of memory structures are located in the non-stair region, and each memory structure passes through the conductive layers and the insulating layers. A fishbone dielectric structure includes a main bone and a plurality of side bones extending from the main bone in the stair region, wherein the main bone crosses the memory structures in the non-stair region.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: August 24, 2021
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Chih-Wei Hu, Teng-Hao Yeh
  • Publication number: 20210242228
    Abstract: A memory device comprises a stack of patterned conductor layers, at least a plurality of the layers comprising conductive strips including strips continuous with a pad and other strips isolated from the pad. An array of vertical pillars extends through the stack of patterned conductor layers, wherein memory cells are disposed at cross-points between the vertical pillars and patterned conductor layers. The array has an array boundary proximal to the pad. A first set of isolation blocks extends through the plurality of patterned conductor layers separating the strips continuous with the pad from the other strips isolated from the pad. A second set of isolation blocks inside the array boundary extends through the plurality of patterned conductor layers isolating the other strips from the pad.
    Type: Application
    Filed: February 5, 2020
    Publication date: August 5, 2021
    Applicant: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Chih-Wei HU, Teng-Hao YEH, Yu-Wei JIANG
  • Patent number: 11065752
    Abstract: A staple gun is provided, including: a main body, including a bottom side, and an abutting portion, a staple outlet and a notch which are disposed on the bottom side; a staple magazine, being withdrawably received within the main body; a lock mechanism, including a pressed member disposed on the staple magazine and having a restricting portion movable between a restricting position and a releasing position; wherein when the restricting portion is in the restricting position, the pressed member is located within the notch, the restricting portion is blocked with the abutting portion and the staple magazine is non-withdrawable from the main body; when the pressed member is pressed and moved toward an interior of the main body and the restricting portion is in the releasing position, the restricting portion is unlocked from the abutting portion and the staple magazine is withdrawable from the main body.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: July 20, 2021
    Assignee: APEX MFG. CO., LTD.
    Inventors: Chih-Wei Hu, Pei-Hung Cheng