Abstract: A memory device includes a first stack structure including first gate layers and first insulating layers alternately stacked with each other. A first channel pillar extends through the first stack structure. A second stack structure is located on the first stack structure and includes second gate layers and second insulating layers alternately stacked with each other. A second channel pillar extends through the second stack structure and is separated from the first channel pillar. A first conductive pillar and a second conductive pillar are located in and electrically connecting with the first channel pillar and the second channel pillar. A charge storage structure is located between the first gate layers and the first channel pillar, and between the second gate layers and the second channel pillar. The memory device may be applied to a 3D AND flash memory.

Abstract: An optical system is provided. The optical system includes a light source assembly, a sensing element, and a light guiding element. The light source assembly is used for generating first light and second light. The sensing element is used for sensing third light from the second light reflected by an eye. The light guiding element is used for transporting the first light, the second light, and the third light. Wavelengths of the first light and the second light are different.

Abstract: An optical system is provided. The optical system includes a light source assembly, a light guiding element, and a first optical assembly. The light source assembly is used for generating first light and second light. The light guiding element is used for transporting the first light and the second light. The first optical assembly is disposed between the light guiding element and the light source assembly and used for transporting the first light and the second light. Wavelengths of the first light and the second light are different.

Abstract: An optical system used for displaying a target image is provided. The optical system includes a light source assembly used for generating an initial image, an optical path adjustment assembly used for transferring the initial image to the target image, a control element used for providing a first control signal to the light source assembly, and a sensing assembly used for providing a sensing signal to the control element. The control element provides the first control signal based on the sensing signal.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: An optical system is provided. The optical system includes a light source used for generating light, a fixed portion, an optical assembly having an equivalent focal length to the light and including a first optical element and a second optical element, and a driving assembly used for driving the second optical element to move relative to the first optical element. The driving assembly includes a first driving element used for driving the second optical element to move relative to the first optical element in a first axis, and a second driving element used for driving the second optical element to move relative to the first optical element in a second axis. The first axis and the second axis are different.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: An electronic device includes a metal back cover, a metal frame, and a first, second, third, and fourth radiators. The metal frame includes a discrete part and two connection parts. The connection parts are located by two sides of the discrete part, separated from the discrete part, and connected to the metal back cover. A U-shaped slot is formed between the discrete part and the metal back cover and between the discrete part and the connection parts. The first radiator is separated from the discrete part and includes a feed end. The second, third, and fourth radiators are connected to the discrete part and the metal back cover. The third radiator is located between the first and second radiators. The first radiator is located between the third and fourth radiators. The discrete part and the first, second, third, and fourth radiators form an antenna module together.

Abstract: The present disclosure provides an optical element driving mechanism, which includes a movable part, a fixed assembly, and a driving assembly. The movable part is configured to be connected to an optical element. The movable part is movable relative to the fixed assembly. The driving assembly is configured to drive the movable part to move relative to the fixed assembly. The movable part includes a connecting assembly configured to position the optical element.

Abstract: An optical element driving mechanism is provided in the present disclosure. The optical element driving mechanism includes a fixed portion and a movable portion. The movable portion moves relative to the fixed portion. The movable portion includes a first movable assembly and a second movable assembly. The first movable assembly is connected to a first optical element. The second movable assembly is connected to a second optical element. The first movable assembly and the second movable assembly are movable relative to each other.

Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.

Abstract: An optical system for receiving rays of light is provided in the present disclosure, including a first optical module. The first optical module includes a first optical element and a first optical path-adjusting element. The first optical element has a first optical axis. The rays of light pass through the first optical element in a first direction. The first optical path-adjusting element corresponds to the first optical element. The rays of light are redirected to a second direction by the first optical path-adjusting element. The first optical element and the first optical path-adjusting element are arranged along the first optical axis.

Abstract: A memory device includes a stacked structure and at least one first element structure. The stacked structure is in a memory array region and a staircase contact region. The stacked structure includes first conductive layers and a second conductive layer arranged in a longitudinal direction. The memory array region and the staircase contact region are arranged in a first lateral direction. The at least one first element structure passes through the first conductive layers and the second conductive layer along the longitudinal direction. The first conductive layers surround a sidewall surface of the at least one first element structure. The second conductive layer includes conductive portions arranged in a second lateral direction. The conductive portions are completely separated from each other by the at least one first element structure. The first lateral direction is different from the second lateral direction.

Abstract: A 3D AND flash memory device includes a gate stack structure, a channel pillar, a source pillar, a charge storage structure, a first transistor and a second transistor. The gate stack structure is located on a dielectric substrate, wherein the gate stack structure includes a plurality of gate layers and a plurality of insulating layers alternately stacked. The channel pillar extends through the gate stack structure. The source pillar and the drain pillar are disposed in the channel pillar and electrically connected to the channel pillar. The charge storage structure is located between the plurality of gate layers and the channel pillar. The first transistor is located above the gate stack structure and electrically connected to the drain pillar. The second transistor is located above the gate stack structure and electrically connected to the source pillar.

Abstract: A three-dimensional AND flash memory device includes a stack structure, isolators, channel pillars, source pillars and drain pillars, and charge storage structures. The stack structure is located on a dielectric substrate and includes gate layers and insulating layers alternately stacked with each other. The isolators divide the stack structure into sub-blocks and include walls and slits. The walls include isolation layers and the insulating layers stacked alternately with each other, and the isolation layers are buried in the gate layers. The slits alternate with the walls, and each of the slits extends through the stack structure. The channel pillars extend through the stack structure in each of the sub-blocks. The source pillars and the drain pillars are located in the channel pillars. The charge storage structures are located between the gate layers and the channel pillar.

Abstract: A semiconductor structure includes a stack of memory cells and a CMOS structure. The CMOS structure is located below the stack of memory cells. The CMOS structure includes a source line transistor and a bit line transistor.

Abstract: An electronic device includes a first connection module, a second connection module, and a positioning assembly. The positioning assembly includes a guide pin, a guide post, a guide bar, and an elastic component. The guide pin is fixed on a first surface of the first connection module, and the guide post is fixed on a second surface of the second module. The electronic device includes a positioning assembly which serves to position components during the installation of the electronic device. The positioning assembly provides space for positional adjustment to the first component and the second component and the elasticity of the elastic component avoids crushing or handling damage to the first component and the second component.

Abstract: A memory device includes a stacked structure and at least one first element structure. The stacked structure is in a memory array region and a staircase contact region. The stacked structure includes first conductive layers and a second conductive layer arranged in a longitudinal direction. The memory array region and the staircase contact region are arranged in a first lateral direction. The at least one first element structure passes through the first conductive layers and the second conductive layer along the longitudinal direction. The first conductive layers surround a sidewall surface of the at least one first element structure. The second conductive layer includes conductive portions arranged in a second lateral direction. The conductive portions are completely separated from each other by the at least one first element structure. The first lateral direction is different from the second lateral direction.

Abstract: A method and an apparatus for rendering three-dimensional objects in an XR environment are provided. The first part of a first object is presented on a first render pass with a second object and without the second part of the first object. The first part is nearer to the user side than the second object. The second object is nearer to the user side than the second part. The second part is presented on a second render pass with the second object and without the first part. A final frame is generated based on the first render pass and the second render pass. The first and the second parts of the first object and the second object are presented in the final frame, and the final frame is used to be displayed on a display. Accordingly, a flexible way to render three-dimensional objects is provided.

Abstract: A hammer tacker is provided, including a grip portion and a body portion; a magazine, including a rail, at least partially received in the housing, being movable relative to the housing between a stapling position and a staple-installing position, including an outlet disposed at a front end of the body portion; a biasing mechanism, including a push member movably mounted to the rail and a constant force spring which is rollable, the constant force spring being positionally attached to the rail through a connection portion and located at a front end of the magazine, and the constant force spring being attached to an inner face of the push member, the push member being movable to be correspondingly above or beyond the connection portion; a striking mechanism, mounted to the body portion and configured to strike at least one staple installed in the magazine.