Abstract: A three-dimensional AND flash memory device includes a stack structure, isolators, channel pillars, source pillars and drain pillars, and charge storage structures. The stack structure is located on a dielectric substrate and includes gate layers and insulating layers alternately stacked with each other. The isolators divide the stack structure into sub-blocks and include walls and slits. The walls include isolation layers and the insulating layers stacked alternately with each other, and the isolation layers are buried in the gate layers. The slits alternate with the walls, and each of the slits extends through the stack structure. The channel pillars extend through the stack structure in each of the sub-blocks. The source pillars and the drain pillars are located in the channel pillars. The charge storage structures are located between the gate layers and the channel pillar.

Abstract: A prediction processing system includes a processing circuit and a reference data buffer. The processing circuit performs a first inter prediction operation upon a first prediction block in a frame to generate a first inter prediction result, and further performs a second inter prediction operation upon a second prediction block during a first period. The reference data buffer buffers a reference data derived from the first inter prediction result. The processing circuit further fetches the reference data from the reference data buffer, and performs a non-inter prediction operation according to at least the reference data during a second period, wherein the second period overlaps the first period.

Abstract: A video processing apparatus implemented in a chip includes an on-chip prediction buffer and a processing circuit. The on-chip prediction buffer is shared by a plurality of coding tools for prediction, and is used to store reference data. The processing circuit supports the coding tools for prediction, reads a plurality of first reference data from the on-chip prediction buffer as input data of a first coding tool that is included in the coding tools and enabled by the processing circuit, and writes output data of the first coding tool enabled by the processing circuit into the on-chip prediction buffer as a plurality of second reference data.

Abstract: A reflective element driving module includes a first reflective element, a second reflective element, and a driving assembly. The first reflective element has a first reflective surface, disposed to correspond to the incident light, wherein the light has an optical axis. The second reflective element has a second reflective surface, disposed to correspond to the light reflected by the first reflective element, and is movable relative to the first reflective element. The driving assembly is configured to drive the second reflective element to move relative to the first reflective element, wherein the first reflective surface and the second reflective surface face different directions.

Abstract: An optical member driving mechanism is provided. The optical member driving mechanism includes a movable portion and a fixed portion. The movable portion includes a holder for holding an optical member with an optical axis. The movable portion is movable relative to the fixed portion. The fixed portion has a housing and a base. The housing is disposed on the base, and includes a top surface and a side surface. The top surface extends in a direction that is parallel to the optical axis. The side surface extends from an edge of the top surface in a direction that is not parallel to the optical axis. The side surface has a rectangular opening.

Abstract: An optical element driving mechanism is provided and includes a movable portion and a fixed portion. The movable portion includes a carrier for carrying an optical member with a first optical axis. The fixed portion has a top surface, a first side surface and a second side surface. The top surface extends in a direction that is parallel to the first optical axis. The first side surface and the second side surface extend in a direction that is not parallel to the first optical axis from the edge of the top surface and face different sides of the optical member. The shortest distance between the optical member and the first side surface is shorter than the shortest distance between the optical member and the second side surface.

Abstract: A forming method of a semiconductor package includes the following steps. A first die is provided. The first die includes a first bonding structure and a first seal ring, the first bonding structure is formed at a first side of the first die, a first portion of the first seal ring is formed between the first side and the first bonding structure, and a width of the first portion is smaller than a width of a second portion of the first seal ring. A second die is provided. The second die includes a second bonding structure. The first die and the second die are bonded onto an integrated circuit through the first bonding structure and the second bonding structure.

Abstract: An optical system is provided and includes a fixed assembly, a movable element, a movable assembly, a driving module and a stopping assembly. The fixed assembly defines a main axis. The movable element is movable relative to the fixed assembly and is connected to a first optical element. The movable assembly is connected to the movable element. The driving module is configured to drive the movable assembly so as to drive the movable element to move relative to the fixed assembly. The stopping assembly is configured to limit the range of motion of the movable element.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a fixed portion, a movable portion, a first driving assembly, and a positioning element. The movable portion is movably disposed on the fixed portion and comprising an optical element. The optical element moves in a first direction. The first driving assembly is at least partially disposed on the fixed portion. The positioning element is rotatably disposed on the fixed portion or the movable portion. When the first driving assembly is not activated, the positioning element is used to limit the position of the movable portion relative to the fixed portion to a limit position, and the positioning element comprises a main body and a limiting portion extending from the main body in a second direction that is perpendicular to the first direction. The limiting portion passes through the optical element.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a fixed portion, a movable portion, and a driving assembly. The fixed portion includes a limiting portion. The movable portion is movably disposed on the fixed portion and includes an optical element and a connecting assembly. The optical element has a main axis. The connecting assembly is connected to the optical element. The driving assembly is at least partially disposed on the fixed portion, wherein the limiting portion is used for limiting the range of motion of the movable portion relative to the fixed portion.

Abstract: A thin-plate-typed rotating module includes a rotating element, a driving unit and a base board. The rotating element is rotatable about a first axial direction and a second axial direction in a limited degree. The driving unit connects the rotating element for driving the rotating element to rotate about the first and second axial directions. The base board is furnished with a control module which is connected with the driving unit for controlling the driving unit to operate.

Abstract: A prediction method and system of a low blood pressure is provided, including: obtaining a plurality of feature sequence values; selecting two of the feature sequence values from the feature sequence values according to a time ratio relationship; calculating a relation coefficient according to the selected two feature sequence values by a weighting process; repeating to select the new feature sequence values and the corresponding relation coefficient and to assign the new feature sequence values and the relation coefficient into the input group until the feature sequence values conforming to the time ratio relationship are traversed; and obtaining a training result by substituting the input group into a low blood pressure prediction model.

Abstract: A structure includes a first die and a second die. The first die includes a first bonding layer having a first plurality of bond pads disposed therein and a first seal ring disposed in the first bonding layer. The first bonding layer extends over the first seal ring. The second die includes a second bonding layer having a second plurality of bond pads disposed therein. The first plurality of bond pads is bonded to the second plurality of bond pads. The first bonding layer is bonded to the second bonding layer. An area interposed between the first seal ring and the second bonding layer is free of bond pads.

Abstract: A semiconductor device including a test pad contact and a method of manufacturing the semiconductor device are disclosed. In an embodiment, a semiconductor device may include a first metal feature and a second metal feature disposed in a single top metal layer over a substrate. A test pad may be formed over and electrically connected to the first metal feature. A first passivation layer may be formed over the second metal feature and the test pad and may cover top and side surfaces of the test pad. A first via may be formed penetrating the first passivation layer and contacting the test pad and a second via may be formed penetrating the first passivation layer and contacting the second metal feature.

Abstract: A distance measuring device for measuring the distance to an object is provided, including a light-emitting module, a driving assembly disposed in the light-emitting module, and a light-receiving module. The light-emitting module has a housing, a light source disposed in the housing, a light grating element, and an optical path adjuster. The light source emits a measuring light through the optical path adjuster and the light grating element. The driving assembly can drive the optical path adjuster or the light grating element to move relative to the housing. The light-receiving module receives the measuring light which is reflected by the object to obtain distance information of the object.

Abstract: A package structure includes a circuit substrate, a semiconductor package, a lid structure, a passive device and a barrier structure. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package. The lid structure is attached to the circuit substrate through an adhesive material. The passive device is disposed on the circuit substrate in between the semiconductor package and the lid structure. The barrier structure is separating the passive device from the lid structure and the adhesive material, and the barrier structure is in contact with the adhesive material.

Abstract: An optical system is provided, including a fixed assembly, a plurality of movable members, and a plurality of driving assemblies respectively connected to the movable members. The movable members are connected to an optical element and movable relative to the fixed assembly. The driving assemblies respectively drive the movable members to move relative to the fixed assembly in different time intervals.

Abstract: The present disclosure relates to a micro-electromechanical system (MEMS) structure including one or more semiconductor devices arranged on or within a first substrate and a MEMS substrate having an ambulatory element. The MEMS substrate is connected to the first substrate by a conductive bonding structure. A capping substrate is arranged on the MEMs substrate. The capping substrate includes a semiconductor material that is separated from the first substrate by the MEMS substrate. One or more conductive polysilicon vias include a polysilicon material that continuously extends from the conductive bonding structure, completely through the MEMS substrate, and to within the capping substrate. The semiconductor material of the capping substrate covers opposing sidewalls of the polysilicon material and an upper surface of the polysilicon material that is between the opposing sidewalls.

Abstract: An optical element driving mechanism includes a fixed assembly, a movable assembly, a driving assembly and a circuit assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The driving assembly includes a first coil group which has a plurality of first coils and a magnetic module which has a magnetic element and a first conductive element. The circuit assembly includes a first circuit member electrically connected to the first conductive element and a second circuit member electrically connected to the first coils. When the magnetic module is located in different positions relative to the first coil group, the first conductive element is electrically connected to different first coils in sequence, so that the first coil is electrically connected to the first circuit member and the second circuit member, and other first coils remain open.

Abstract: A structure includes a first die and a second die. The first die includes a first bonding layer having a first plurality of bond pads disposed therein and a first seal ring disposed in the first bonding layer. The first bonding layer extends over the first seal ring. The second die includes a second bonding layer having a second plurality of bond pads disposed therein. The first plurality of bond pads is bonded to the second plurality of bond pads. The first bonding layer is bonded to the second bonding layer. An area interposed between the first seal ring and the second bonding layer is free of bond pads.