Abstract: A photomask cleaning tool includes various components to automatically remove a particle from a pellicle, such as a multi-jet nozzle to standardize and control the use of a gas to remove the particle, an ultrasonic probe to loosen the particle from the surface of the pellicle, a plurality of multi-jet nozzles to direct gas toward the particle from different directions, a control system to control the automated blower for various sizes and shapes of photomasks and for optimized particle removal techniques, and/or the like. In this way, the photomask cleaning tool is capable of removing a particle from a pellicle of a photomask in a manner that increases the effectiveness of removing the particle and reduces the likelihood of damage to the pellicle, which would otherwise result in expensive and time-consuming photomask rework.

Abstract: A method for cleaning a reflective photomask, a method of manufacturing a semiconductor structure, and a system for forming a semiconductor structure are provided. The method for cleaning a reflective photomask includes placing a photomask in a first chamber, and performing a dry cleaning operation on the photomask in the first chamber, wherein the dry cleaning operation includes providing hydrogen radicals to the first chamber, generating hydrocarbon gases as a result of reactions of the hydrogen radicals, and removing the hydrocarbon gases from the first chamber.

Abstract: A dis-pellicle tool or pellicle removal tool that includes one or more clamp structures that each include a respective group of pins. The respective pins of the groups of pins of the one or more clamp structures are configured to, in operation, be inserted into holes that are present within a pellicle frame of a pellicle. Once the respective pins of the groups of pins are inserted into the holes of the pellicle frame, a removal force may be applied to the pellicle frame to remove the pellicle from a photomask to which the pellicle is coupled to by an adhesive, glue, or some other similar type of coupling material.

Abstract: A method for cleaning a reflective photomask, a method of manufacturing a semiconductor structure, and a system for forming a semiconductor structure are provided. The system for forming a semiconductor structure includes a photomask comprises a photomask substrate and a pellicle; an exposure tool configured to perform an exposure operation to transfer a pattern of the photomask to a semiconductive substrate, and a cleaning tool configured to perform a cleaning operation on the photomask. The cleaning tool includes a processing chamber configured to accommodate the photomask for a cleaning operation, and a hydrogen radical producer configured to produce hydrogen radicals into the processing chamber and having the hydrogen radicals reacting with contaminants attached on the photomask. The pellicle is attached on the photomask substrate during the cleaning operation.

Abstract: A cleaning apparatus for cleaning a surface of a photomask includes a housing defining a chamber, a photomask holder disposed within the chamber, and a gas dispenser disposed within the chamber to direct gas toward the photomask holder. The gas dispenser has two or more gas dispensing outlets. A driver is coupled to at least one of the photomask holder or the gas dispenser to establish relative movement between the photomask holder and the gas dispenser.

Abstract: A method includes forming a first fin structure and a second fin structure protruding from a substrate, forming a dielectric fin between the first fin structure and the second fin structure, recessing the dielectric fin to form a trench between the first fin structure and the second fin structure, and depositing a first dielectric layer on sidewall surfaces of the trench and on a top surface of the recessed dielectric fin. After the depositing the first dielectric layer, a second dielectric layer is deposited in the trench. The method further includes depositing a third dielectric layer to cap the second dielectric layer in the trench, and forming a gate structure on the first fin structure, the second fin structure, and the third dielectric layer.

Abstract: A method for identifying objects by shape in close proximity to other objects of different shapes obtains point cloud information of multiple objects. The objects are arranged in at least two trays and the trays are stacked. A depth image of the objects is obtained according to the point cloud information, and the depth image of the objects is separated and layered to obtain a layer information of all the objects. An object identification system also disclosed. Three-dimensional machine vision is utilized in identifying the objects, improving the accuracy of object identification, and enabling the mechanical arm to accurately grasp the required object.

Abstract: A semiconductor device includes a pair of fin structures on a semiconductor substrate, each including a vertically stacked plurality of channel layers, a dielectric fin extending in parallel to and between the fin structures, and a gate structure on and extending perpendicularly to the fin structures, the gate structure engaging with the plurality of channel layers. The dielectric fin includes a fin bottom and a fin top over the fin bottom. The fin bottom has a top surface extending above a bottom surface of a topmost channel layer. The fin top includes a core and a shell, the core having a first dielectric material, the shell surrounding the core and having a second dielectric material different from the first dielectric material.

Abstract: A power supply circuit and a power distribution method thereof are provided. The power supply circuit includes a power input switch block, a power supply measurement block, a power supply conversion block and a power supply control block. The power input switch block provides a first power supply voltage to a load circuit based on an external power supply voltage from an adapter. The power supply measurement block measures a current of the first power supply voltage. The power supply conversion block is coupled to the battery module to provide a second power supply voltage to the load circuit. When a battery temperature of the battery module is higher than a critical temperature and a battery power of the battery module is higher than or equal to a critical power, the power supply control block limits the second power supply voltage provided to the load circuit.

Abstract: A photomask cleaning tool includes various components to automatically remove a particle from a pellicle, such as a multi-jet nozzle to standardize and control the use of a gas to remove the particle, an ultrasonic probe to loosen the particle from the surface of the pellicle, a plurality of multi-jet nozzles to direct gas toward the particle from different directions, a control system to control the automated blower for various sizes and shapes of photomasks and for optimized particle removal techniques, and/or the like. In this way, the photomask cleaning tool is capable of removing a particle from a pellicle of a photomask in a manner that increases the effectiveness of removing the particle and reduces the likelihood of damage to the pellicle, which would otherwise result in expensive and time-consuming photomask rework.

Abstract: A method for preparing a carbide protective layer comprises: (A) mixing a carbide powder, an organic binder, an organic solvent and a sintering aid to form a slurry; (B) spraying the slurry on a surface of a graphite component to form a composite component; (C) subjecting the composite component to a cold isostatic pressing densification process; (D) subjecting the composite component to a constant temperature heat treatment; (E) repeating steps (B)-(D) until a coating is formed on a surface of the composite component; (F) subjecting the coating to a segmented sintering process; (G) obtaining a carbide protective layer used for the surface of the composite component. Accordingly, while the carbide protective layer can be completed by using the wet cold isostatic pressing densification process and the cyclic multiple superimposition method, so that it can improve the corrosion resistance in the silicon carbide crystal growth process environment.

Abstract: A method for preparing a carbide protective layer comprises: (A) mixing a carbide powder, an organic binder, an organic solvent and a sintering aid to form a slurry; (B) spraying the slurry on a surface of a graphite component to form a composite component; (C) subjecting the composite component to a cold isostatic pressing densification process; (D) subjecting the composite component to a constant temperature heat treatment; (E) repeating steps (B)-(D) until a coating is formed on a surface of the composite component; (F) subjecting the coating to a segmented sintering process; (G) obtaining a carbide protective layer used for the surface of the composite component. Accordingly, while the carbide protective layer can be completed by using the wet cold isostatic pressing densification process and the cyclic multiple superimposition method, so that it can improve the corrosion resistance in the silicon carbide crystal growth process environment.

Abstract: A neural network is used to place macros on a chip canvas in an integrated circuit (IC) design. The macros are first clustered into multiple macro clusters. Then the neural network generates a probability distribution over locations on a grid and aspect ratios of a macro cluster. The grid represents the chip canvas and is formed by rows and columns of grid cells. The macro cluster is described by at least an area size, aspect ratios, and wire connections. Action masks are generated for respective ones of the aspect ratios to block out a subset of unoccupied grid cells based on design rules that optimize macro placement. Then, by applying the action masks on the probability distribution, a masked probability distribution is generated. Based on the masked probability distribution, a location on the grid is selected for placing the macro cluster with a chosen aspect ratio.

Abstract: A diagnosis circuit comprises: a logic circuit, wherein the logic circuit comprises a set having a gate voltage terminal of an arm of a phase logical OR a dead time voltage terminal, and the set logical XOR a drain-source voltage terminal of another arm of the phase; a filter circuit coupled to the logic circuit, wherein the filter circuit is configured to filter transient noises; a comparison circuit coupled to the filter circuit, wherein the comparison circuit is configured to determine whether a phase current of a phase current terminal of the phase is greater than zero; and a latch coupled to the comparison circuit, wherein the latch is configured to store diagnosis signals temporarily.

Abstract: A soft-switching auxiliary circuit is provided, which may be applicable to a converter including a first main switch and a second main switch. The soft-switching auxiliary circuit may include a first auxiliary switch, a second auxiliary switch, a first energy adjustment module and a second energy adjustment module. By means of the first auxiliary switch and a second auxiliary switch, the first energy adjustment module and the second energy adjustment may properly store and adjust the energy of the converter; therefore, both the first main switch and the second main switch of the converter can achieve soft-switching.

Abstract: A diagnosis circuit comprises: a logic circuit, wherein the logic circuit comprises a set having a gate voltage terminal of an arm of a phase logical OR a dead time voltage terminal, and the set logical XOR a drain-source voltage terminal of another arm of the phase; a filter circuit coupled to the logic circuit, wherein the filter circuit is configured to filter transient noises; a comparison circuit coupled to the filter circuit, wherein the comparison circuit is configured to determine whether a phase current of a phase current terminal of the phase is greater than zero; and a latch coupled to the comparison circuit, wherein the latch is configured to store diagnosis signals temporarily.

Abstract: A soft-switching auxiliary circuit is provided, which may be applicable to a converter including a first main switch and a second main switch. The soft-switching auxiliary circuit may include a first auxiliary switch, a second auxiliary switch, a first energy adjustment module and a second energy adjustment module. By means of the first auxiliary switch and a second auxiliary switch, the first energy adjustment module and the second energy adjustment may properly store and adjust the energy of the converter; therefore, both the first main switch and the second main switch of the converter can achieve soft-switching.

Abstract: A wireless system includes: a paging chip arranged to selectively generate a notification signal according to a paging signal; and a processing chip arranged to switch from a first mode to a second mode upon receiving the notification signal, wherein power consumption of the processing chip in the first mode is lower than power consumption of the processing chip in the second mode, and the paging chip and the processing chip are externally coupled with each other.

Abstract: Methods for generating an embedded target image to be stored in a non-volatile memory device of an embedded system as firmware thereof are disclosed. A graphical user interface (GUI) editor is generated to facilitate a user in providing settings information for multiple pins of a chip installed in the embedded system. Source code is generated in response to operating results of the user of the GUI editor. Linking an object file compiled from the generated source code generates the embedded target image.

Abstract: A system for real time clock (RTC) calibration includes: a timer counter; a clock generator; and a clock calibration unit coupled between the clock generator and the timer counter. The clock calibration unit receives calibration parameters comprising an average calibration value, a remainder calibration value and a calibration period, counts a plurality of clock cycles generated by the clock generator, calibrates a number of the counted clock cycles according to the average calibration value and remainder calibration value in the calibration period, and increments the timer counter by one second when a predetermined number of clock cycles have been reached.