Abstract: A system includes a plurality of semiconductor processing tools; a carrier purge station; a carrier repair station; and an overhead transport (OHT) loop for transporting one or more substrate carriers among the plurality of semiconductor processing tools, the carrier purge station, and the carrier repair station. The carrier purge station is configured to receive a substrate carrier from one of the plurality of semiconductor processing tools, purge the substrate carrier with an inert gas, and determine if the substrate carrier needs repair. The carrier repair station is configured to receive a substrate carrier to be repaired and replace one or more parts in the substrate carrier.

Abstract: A tunable plasma exclusion zone in semiconductor fabrication is provided. A semiconductor wafer is provided within a chamber of a plasma processing apparatus between a first plasma electrode and a second plasma electrode. A plasma is generated from a process gas within the chamber and an electric field between the first plasma electrode and the second plasma electrode. The plasma is at least partially excluded from an edge region of the semiconductor wafer by a plasma exclusion zone (PEZ) ring within the chamber. The plasma may be tuned toward a center of the semiconductor wafer by electrically coupling an electrode ring of the PEZ ring to a voltage potential.

Abstract: Ruthenium of a metal gate (MG) and/or a middle end of line (MEOL) structure is annealed to reduce, or even eliminate, seams after the ruthenium is deposited. Because the annealing reduces (or removes) seams in deposited ruthenium, electrical performance is increased because resistivity of the MG and/or the MEOL structure is decreased. Additionally, for MGs, the annealing generates a more even deposition profile, which results in a timed etching process producing a uniform gate height. As a result, more of the MGs will be functional after etching, which increases yield during production of the electronic device.

Abstract: A semiconductor structure includes a substrate, a fin-shaped structure protruding from the substrate and orienting lengthwise along a first direction, an isolation feature disposed over the substrate and along a sidewall of a bottom portion of the fin-shaped structure, and a metal gate structure disposed over the fin-shaped structure and the isolation feature and orienting lengthwise along a second direction perpendicular to the first direction. The metal gate structure includes a bottom portion sandwiched between the isolation feature and the bottom portion of the fin-shaped structure along the second direction.

Abstract: A power supply has a housing, a circuit board, a wire, and a wire securing assembly. The wire securing assembly has a base plate and a securing structure. The securing structure has a first plate and a second plate. A side edge of the first plate is connected to the base plate. The second plate is spaced apart from the first plate. The wire is mounted through and between the first plate and the second plate. The wire securing assembly is modified from the current insulating part, in which the original side plate extends and forms an additional part, or a bent structure is added on the original side plate, and thus the additional structures become the securing structure. Thus, the wire is prevented from moving under vibration or external force and contacting the blades of the fan, or keeps in a position in compliance with safety requirements.

Abstract: An electronic device includes a memory usage identification circuit and a system-level cache (SLC). The memory usage identification circuit obtains a memory usage indicator that depends on memory usage of a storage space allocated in a system memory at which memory access is requested by a physical address. The SLC includes a cache memory and a cache controller. The cache controller performs cache management upon the cache memory according to the physical address and the memory usage indicator.

Abstract: A method for identifying objects by shape in close proximity to other objects of different shapes obtains point cloud information of multiple objects. The objects are arranged in at least two trays and the trays are stacked. A depth image of the objects is obtained according to the point cloud information, and the depth image of the objects is separated and layered to obtain a layer information of all the objects. An object identification system also disclosed. Three-dimensional machine vision is utilized in identifying the objects, improving the accuracy of object identification, and enabling the mechanical arm to accurately grasp the required object.

Abstract: A method of fabricating the semiconductor device includes forming a bit line structure over a substrate, forming a spacer structure on a sidewall of the bit line structure, partially removing an upper portion of the spacer structure to form a slope on the spacer structure slanting to the bit line structure, forming a landing pad material to cover the spacer structure and contact the slope, and removing at least a portion of the landing pad material to form a landing pad against the slope.

Abstract: The present disclosure provides a phosphazene derivative, a composition for an electrochemical device and an electrochemical device containing the composition The composition includes an electrolyte, a non-aqueous solvent and an additive. The additive includes a phosphazene derivative of the formula (I), n, R1 and R2 are as defined herein: The safety characteristics of the electrochemical device provided in the present disclosure are improved by adding the aforementioned additives to the composition in the electrochemical device.

Abstract: A method of forming a semiconductor package includes: forming a first package component including a first and a second conductive bumps; forming a second package component including a third and a fourth conductive bumps, where dimensions of the first and second conductive bumps are less than dimensions of the third and fourth conductive bumps; and forming a first and a second joint structures to bond the second package component to the first package component. A first angle between an exposed sidewall of the first conductive bump and a tangent line at an end point of a boundary of the first joint structure on the sidewall of the first conductive bump is less than a second angle between an exposed sidewall of the second conductive bump and a tangent line at an end point of a boundary of the second joint structure on the sidewall of the second conductive bump.

Abstract: A barrier configured to be located at a door a vehicle having a lift platform to enable an individual using a mobility device to exit and to enter an interior of the vehicle. The barrier includes a support base configured to be fixedly coupled to the vehicle. A first side and a second side each extend from the support base are spaced apart to define an access location for the individual using the mobility device. A barrier gate or a barrier plate include an entry position and a blocking position wherein, in at least one embodiment, movement of the lift platform moves the barrier plate from the entry position to the blocking position.

Abstract: A method of forming a semiconductor structure includes forming a fin structure having a stack of alternating first semiconductor layers and second semiconductor layers over a substrate, forming cladding layers along sidewalls of the fin structure, forming a dummy gate stack over the cladding layers, and forming source/drain (S/D) features in the fin structure and adjacent to the dummy gate stack. The method further includes removing the dummy gate stack to form a gate trench adjacent to the S/D features, removing the cladding layers to form first openings along the sidewalls of the fin structure, where the first openings extend to below the stack, removing the first semiconductor layers to form second openings between the second semiconductor layers and adjacent to the first openings, and subsequently forming a metal gate stack in the gate trench, the first openings, and the second openings.

Abstract: A semiconductor package includes first and second package components stacked upon and electrically connected to each other, and first and second joint structures. The first package component includes first and second conductive bumps, the second package component includes third and fourth conductive bumps having dimensions greater than those of the first and second conductive bumps. The first joint structure partially covers the first and third conductive bumps. The second joint structure partially covers the second and the fourth conductive bumps. A first angle between a sidewall of the first conductive bump and a tangent line at an end point of a boundary of the first joint structure on the first conductive bump is greater than a second angle between a sidewall of the second conductive bump and a tangent line at an end point of a boundary of the second joint structure on the second conductive bump.

Abstract: A control method for an optical device includes a detector detecting a current position of a lens, a processor calculating a distance between the current position and a target position, the processor determining whether the current position is within a predetermined range according to the distance, and the processor controlling a driving device to move the lens into an allowable range according to whether the current position is within the predetermined range. The predetermined range and the allowable range are corresponding to the target position.

Abstract: A barrier configured to be located at a door a vehicle having a lift platform to enable an individual using a mobility device to exit and to enter an interior of the vehicle. The barrier includes a support base configured to be fixedly coupled to the vehicle. A first side and a second side each extend from the support base are spaced apart to define an access location for the individual using the mobility device. A barrier gate or a barrier plate include an entry position and a blocking position wherein, in at least one embodiment, movement of the lift platform moves the barrier plate from the entry position to the blocking position.

Abstract: This disclosure is directed to a sunroof device having a window frame assembly, a pair of linkage assemblies, a panel assembly, a first electrical connector and a second electrical connector. The window frame assembly has a pair of rails. The linkage assemblies are disposed on the rails respectively. The panel assembly is disposed on the pair of linkage assemblies. The first electrical connector on the window frame assembly has a plugging slot and an opening, the opening is located at a side of the first electrical connector and extended to a top of the first electrical connector. The second electrical connector on the panel assembly has a conductive terminal. When the panel assembly rotates, the conductive terminal is plugged in the plugging slot through the opening and movable with the panel assembly in the opening.

Abstract: A method for determining a standard depth value of a marker includes obtaining a maximum depth value of the marker. A reference depth value of the marker is obtained based on a depth image of the marker, and a Z-axis coordinate value of the marker is obtained based on a color image of the marker. When the reference depth value and the Z-axis coordinate value are both less than the maximum depth value, and a difference between the reference depth value and the Z-axis coordinate value is not greater than 0, the depth reference value is set as the standard depth value of the marker; and when the difference is greater than 0, the Z-axis coordinate value is set as the standard depth value of the marker.

Abstract: A system and a method for picking and placing objects, includes capturing at least one first image of the object at a first time point and at least one second image at a second time point; identifying the object in the first image and the second image, obtaining first position information, second position information, and object attribute of the object; based on the first position information, the second position information, the first time point, and the second time point, calculating a moving speed of the object; based on the object attribute, determining whether the object is a target object; if so, calculating a target position and a target time point of the target object based on the first and second position information and the moving speed; controlling a target machine arm to move at or to the target position at the target time point to pick the target object.

Abstract: The present invention discloses a mesh laundry bag, which comprises a mesh container and an elastic closure unit. The mesh container comprises an opening. The elastic closure unit is disposed on the opening to maintain its closed state. By replacing the traditional closure units like zippers with the elastic closure unit, the mesh laundry bag enables one-handed operation for opening and closing, allowing users to use their other hand to place laundry inside the bag. Moreover, the absence of closure units such as zippers significantly reduces the risk of clothing damage.

Abstract: A system and a method for picking and placing objects, includes capturing at least one first image of at least one object at a first time point and at least one second image at a second time point; identifying the object in the first image and the second image; and obtaining first position information and second position information of the object; based on the first position information, the second position information, the first time point, and the second time point, calculating a moving speed of the object; calculating a target position and a target time point of the object based on the first position information, the second position information, and the moving speed; and controlling the machine arm to move at or to the target position at the target time point to pick the object.