Patents by Inventor Chih-Wei Liu
Chih-Wei Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240365500Abstract: A heat dissipation device includes an inclined heat pipe and a plurality of inclined heat dissipation fins. The inclined heat pipe includes an inclined heat dissipation area, and each inclined heat dissipation fin includes an inclined heat dissipation portion. In addition, the inclined heat dissipation area of the inclined heat pipe is fixed to the inclined heat dissipation portion so that the inclined heat dissipation area of the inclined heat pipe forms a predetermined angle relative to a horizontal plane.Type: ApplicationFiled: April 11, 2024Publication date: October 31, 2024Inventors: Chih-Wei CHEN, Kang-Ming FAN, Tsung-Han TSAI, Fu-Hsuan HSIEH, Chien-Yu LIU
-
Publication number: 20240365552Abstract: A method of manufacturing an integrated circuit includes following operations. A stack of a plurality pair of first layers and second layers alternately arranged is formed over a substrate. A plurality of first holes is formed in the stack. An isolation layer is formed to cover sidewalls of the first holes. A plurality of conductive features is formed in the first holes. A plurality of second holes are formed in the stack. Each of the second holes exposes a portion of a sidewall of at least one of the conductive features. A channel layer is formed to cover sidewalls of the second holes and the portions of the sidewalls of the conductive features. The second layers of the stack are replaced with a plurality of gate layers.Type: ApplicationFiled: June 24, 2024Publication date: October 31, 2024Inventors: KUO-PIN CHANG, CHIEN HUNG LIU, CHIH-WEI HUNG
-
Patent number: 12131962Abstract: A diaphragm position of a valve may be detected and/or determined such that operation of the diaphragm may be monitored. A sensor included in the valve may generate sensor data that may be used to monitor the position of the diaphragm, which in turn may be used to determine a flow of a fluid through the valve. In this way, the sensor may be used to determine whether the diaphragm is properly functioning, may be used to identify and detect failures of the diaphragm, and/or may be used to quickly terminate operation of an associated deposition tool. This may reduce semiconductor substrate scrap, may reduce device failures on semiconductor substrates that are processed by the deposition tool, may increase semiconductor processing quality of the deposition tool, and/or may increase semiconductor processing yields of the deposition tool.Type: GrantFiled: August 27, 2021Date of Patent: October 29, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kuang-Wei Cheng, Yung-Tsun Liu, Chih-Tsung Lee, Chyi-Tsong Ni
-
Patent number: 12128455Abstract: A method comprising: providing a slurry to a polishing pad that is disposed on a wafer platen, the slurry comprising a plurality of electrically charged abrasive particles having a first electrical polarity; moving a first side of a wafer into contact with the slurry and the polishing pad; applying a first electrical charge having a second electrical polarity, opposite the first electrical polarity, to a first conductive rod; moving the first side of the wafer away from the polishing pad while the first electrical charge is applied to the first conductive rod; moving a first wafer brush into contact with the first side of the wafer; applying a second electrical charge having the second electrical polarity, opposite the first electrical polarity, to a second conductive rod arranged within the first wafer brush; and moving the first wafer brush away from the first side of the wafer.Type: GrantFiled: August 15, 2022Date of Patent: October 29, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Wen Liu, Yeo-Sin Lin, Shu-Wei Hsu, Che-Hao Tu, Hui-Chi Huang, Kei-Wei Chen
-
Patent number: 12131944Abstract: A slurry composition, a semiconductor structure and a method for forming a semiconductor structure are provided. The slurry composition includes a slurry and a precipitant dispensed in the slurry. The semiconductor structure comprises a blocking layer including at least one element of the precipitant. The method includes using the slurry composition with the precipitant to polish a conductive layer and causing the precipitant to flow into the gap.Type: GrantFiled: August 30, 2021Date of Patent: October 29, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Chun-Wei Hsu, Chih-Chieh Chang, Yi-Sheng Lin, Jian-Ci Lin, Jeng-Chi Lin, Ting-Hsun Chang, Liang-Guang Chen, Ji Cui, Kei-Wei Chen, Chi-Jen Liu
-
Publication number: 20240355691Abstract: A semiconductor package including a circuit substrate, an interposer structure, a plurality of dies, and an insulating encapsulant is provided. The interposer structure is disposed on the circuit substrate. The plurality of dies is disposed on the interposer structure, wherein the plurality of dies is electrically connected to the circuit substrate through the interposer structure. The insulating encapsulant is disposed on the circuit substrate, wherein the insulating encapsulant surrounds the plurality of dies and the interposer structure and encapsulates at least the interposer structure, the insulating encapsulant has a groove that surrounds the interposer structure and the plurality of dies, and the interposer structure and the plurality of dies are confined to be located within the groove.Type: ApplicationFiled: July 1, 2024Publication date: October 24, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Cheng Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin
-
Patent number: 12125725Abstract: In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.Type: GrantFiled: July 14, 2023Date of Patent: October 22, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Sheng Kuo, Guan-Wei Huang, Chih-Hung Huang, Yang-Ann Chu, Hsu-Shui Liu, Jiun-Rong Pai
-
Patent number: 12125850Abstract: An integrated circuit includes a semiconductor substrate, an isolation region extending into, and overlying a bulk portion of, the semiconductor substrate, a buried conductive track comprising a portion in the isolation region, and a transistor having a source/drain region and a gate electrode. The source/drain region or the gate electrode is connected to the buried conductive track.Type: GrantFiled: April 19, 2021Date of Patent: October 22, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Pochun Wang, Ting-Wei Chiang, Chih-Ming Lai, Hui-Zhong Zhuang, Jung-Chan Yang, Ru-Gun Liu, Shih-Ming Chang, Ya-Chi Chou, Yi-Hsiung Lin, Yu-Xuan Huang, Guo-Huei Wu, Yu-Jung Chang
-
Patent number: 12127368Abstract: A heat dissipation device of server cabinet heat dissipation device of server cabinet, comprising an outer case and a plurality of heat dissipation devices, the outer case is provided with a plurality of vents on one side, and a plurality of fans are installed on the other side, each of the heat dissipation devices is installed in the outer case, and each of the heat dissipation devices has an included angle toward each of the vents or the directions of the fans, so that the wind can pass through continuously after the fans are activated. Each of the heat dissipation devices is directly discharged after that. Since the heat dissipation devices do not overlap on the air circulation path, even if there is more than one heat dissipation device, it can still ensure that there is no temperature difference between each air, so that the heat dissipation effect is better so as the effect of stabilizing the overall heat dissipation temperature.Type: GrantFiled: October 12, 2022Date of Patent: October 22, 2024Assignee: LDC Precision Engineering CO., Ltd.Inventors: Feng-Shih Liao, Chih-Wei Chen, Wu-Hsiung Liu
-
Patent number: 12113113Abstract: A semiconductor device includes a pair of fin structures on a semiconductor substrate, each including a vertically stacked plurality of channel layers, a dielectric fin extending in parallel to and between the fin structures, and a gate structure on and extending perpendicularly to the fin structures, the gate structure engaging with the plurality of channel layers. The dielectric fin includes a fin bottom and a fin top over the fin bottom. The fin bottom has a top surface extending above a bottom surface of a topmost channel layer. The fin top includes a core and a shell, the core having a first dielectric material, the shell surrounding the core and having a second dielectric material different from the first dielectric material.Type: GrantFiled: July 29, 2021Date of Patent: October 8, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chih-Chung Chang, Sung-En Lin, Chung-Ting Ko, You-Ting Lin, Yi-Hsiu Liu, Po-Wei Liang, Jiun-Ming Kuo, Yung-Cheng Lu, Chi On Chui, Yuan-Ching Peng, Jen-Hong Chang
-
Patent number: 12113132Abstract: The present disclosure describes various non-planar semiconductor devices, such as fin field-effect transistors (finFETs) to provide an example, having one or more metal rail conductors and various methods for fabricating these non-planar semiconductor devices. In some situations, the one or more metal rail conductors can be electrically connected to gate, source, and/or drain regions of these various non-planar semiconductor devices. In these situations, the one or more metal rail conductors can be utilized to electrically connect the gate, the source, and/or the drain regions of various non-planar semiconductor devices to other gate, source, and/or drain regions of various non-planar semiconductor devices and/or other semiconductor devices. However, in other situations, the one or more metal rail conductors can be isolated from the gate, the source, and/or the drain regions these various non-planar semiconductor devices.Type: GrantFiled: November 7, 2022Date of Patent: October 8, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chih-Liang Chen, Chih-Ming Lai, Ching-Wei Tsai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kuo-Cheng Chiang, Ru-Gun Liu, Wei-Hao Wu, Yi-Hsiung Lin, Chia-Hao Chang, Lei-Chun Chou
-
Publication number: 20240329361Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a circuit assembly. The movable assembly is configured to connect an optical element, the movable assembly is movable relative to the fixed assembly, and the optical element has an optical axis. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The circuit assembly includes a plurality of circuits and is affixed to the fixed assembly.Type: ApplicationFiled: June 7, 2024Publication date: October 3, 2024Inventors: Sin-Hong LIN, Yung-Ping YANG, Wen-Yen HUANG, Yu-Cheng LIN, Kun-Shih LIN, Chao-Chang HU, Yung-Hsien YEH, Mao-Kuo HSU, Chih-Wei WENG, Ching-Chieh HUANG, Chih-Shiang WU, Chun-Chia LIAO, Chia-Yu CHANG, Hung-Ping CHEN, Wei-Zhong LUO, Wen-Chang LIN, Shou-Jen LIU, Shao-Chung CHANG, Chen-Hsin HUANG, Meng-Ting LIN, Yen-Cheng CHEN, I-Mei HUANG, Yun-Fei WANG, Wei-Jhe SHEN
-
Patent number: 12107051Abstract: A semiconductor device and method for forming the semiconductor device is provided. The semiconductor device includes an integrated circuit having through vias adjacent to the integrated circuit die, wherein a molding compound is interposed between the integrated circuit die and the through vias. The through vias have a projection extending through a patterned layer, and the through vias may be offset from a surface of the patterned layer. The recess may be formed by selectively removing a seed layer used to form the through vias.Type: GrantFiled: August 7, 2023Date of Patent: October 1, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Ming-Da Cheng
-
Publication number: 20240315877Abstract: An eyeshade structure for bilirubin detection includes a body, a first detection module, and a second detection module. The body includes a bottom plate and a side wall. The side wall is connected to the bottom plate and forms an accommodating space with the bottom plate. The first detection module is arranged on the bottom plate. The second detection module is arranged on the bottom plate and is adjacent to the first detection module. The first detection module and the second detection module each include a circuit board, a light-emitting element, an inner photographing element, and an outer photographing element. The circuit board is connected to the bottom plate. The light-emitting element is electrically connected to the circuit board. The inner photographing element is electrically connected to the circuit board. The outer photographing element is electrically connected to the circuit board.Type: ApplicationFiled: September 18, 2023Publication date: September 26, 2024Applicant: PolyVisions Technology Co., Ltd.Inventors: Chih-Ju Lin, Yi-Wei Liu, Lee-Lin Tsai
-
Publication number: 20240322828Abstract: The invention introduces an apparatus and a method for expanding round keys during data encryption. The method includes: configuring a word-processing circuitry to operate in a first mode to calculate a first intermediate calculation result corresponding to an even-number round key according to a last double word of a 0th double word to a 7th double word in each even-number clock cycle starting from a 2nd clock cycle; and configuring the word-processing circuitry to operate in a second mode to calculate a second intermediate calculation result corresponding to an odd-number round key according to the last double word of the 0th double word to the 7th double word in each odd-number clock cycle starting from a 3rd clock cycle. In the first mode, a first data path is formed in the word-processing circuitry, which includes a word split circuitry, a rotate-word circuitry, a substitute-word circuitry, a round-constant circuitry and a word concatenation circuitry.Type: ApplicationFiled: May 4, 2023Publication date: September 26, 2024Applicant: Silicon Motion, Inc.Inventors: Wun-Jhe WU, Po-Hung CHEN, Chiao-Wen CHENG, Jiun-Hung YU, Chih-Wei LIU
-
Publication number: 20240321616Abstract: A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.Type: ApplicationFiled: June 3, 2024Publication date: September 26, 2024Inventors: Chih-Wei CHOU, Sheng-Yuan LIN, Yuan-Hsin CHI, Yin-Tun CHOU, Hung-Chih WANG, Yu-Chi LIU
-
Publication number: 20240315564Abstract: A thermal image endoscope system includes a thermal image endoscope catheter and a control device. The thermal image endoscope catheter including: a tube body; a thermal image capturing assembly and a disposing component are positioned at a head part of the tube body, the thermal image capturing assembly captures a thermal image from a shooting area; the disposing component has a disposing area and the disposing area is inside the shooting area; a towing component is connected to the head part. The control device including: a driving component is connected to a towing component, a controller actuates the driving component according to a disposing command received by a receiving component to drive the towing component to tow the head part, and actuates a gate of a light guide assembly to selectively couple or decouple a light pipe of the light guide assembly to the disposing component.Type: ApplicationFiled: September 27, 2023Publication date: September 26, 2024Applicant: PolyVisions Technology Co., Ltd.Inventors: Chih-Ju Lin, Yi-Wei Liu
-
Publication number: 20240312901Abstract: An interconnect structure including a contact via in an interlayer dielectric, a first conductive feature in a first dielectric layer, the first dielectric layer over the interlayer dielectric, a first liner in the first dielectric layer, the first liner comprising a first part in contact with a sidewall surface of the first conductive feature, and a second part in contact with a bottom surface of the first conductive feature. The interconnect structure includes a first cap layer in contact with a top surface of the first conductive feature, a second conductive feature in a second dielectric layer, the second dielectric layer over the first dielectric layer, a second liner in the second dielectric layer, wherein the first and second conductive features comprise a first conductive material, and the contact via, first liner, first cap layer, and second liner comprise a second conductive material chemically different than the first conductive material.Type: ApplicationFiled: July 12, 2023Publication date: September 19, 2024Inventors: Chien CHANG, Yen-Chun LIN, Jen-Wei LIU, Chih-Han TSENG, Harry CHIEN, Cheng-Hui WENG, Chun-Chieh LIN, Hung-Wen SU, Ming-Hsing TSAI, Chih-Wei CHANG
-
Publication number: 20240314976Abstract: A fluid immersion cooling system includes a fluid tank that contains a layer of a dual-phase coolant fluid and one or more layers of single-phase coolant fluids. The dual-phase and single-phase coolant fluids are immiscible, with the dual-phase coolant fluid having a lower boiling point and higher density than a single-phase coolant fluid. A substrate of an electronic system is submerged in the tank such that high heat-generating components are immersed at least in the layer of the dual-phase coolant fluid. Heat from the components is dissipated to the dual-phase coolant fluid to generate vapor bubbles of the dual-phase coolant fluid. The vapor bubbles rise to a layer of a single-phase coolant fluid that is above the layer of the dual-phase coolant fluid. The vapor bubbles condense to droplets of the dual-phase coolant fluid. The droplets fall down into the layer of the dual-phase coolant fluid.Type: ApplicationFiled: May 22, 2024Publication date: September 19, 2024Inventors: Yueh Ming LIU, Yu Hsiang HUANG, Yu Chuan CHANG, Tan Hsin CHANG, Hsiao Chung CHEN, Chia-Wei CHEN, Chih-Ta CHEN, Cheng-Hung LIN, Ming-Te HSU
-
Patent number: 12096657Abstract: A display may include an array of pixels. Each pixel in the array includes an organic light-emitting diode coupled to associated semiconducting oxide transistors. The semiconducting oxide transistors may exhibit different device characteristics. Some of the semiconducting oxide transistors may be formed using a first oxide layer formed from a first semiconducting oxide material using first processing steps, whereas other semiconducting oxide transistors are formed using a second oxide layer formed from a second semiconducting oxide material using second processing steps different than the first processing steps. The display may include three or more different semiconducting oxide layers formed during different processing steps.Type: GrantFiled: October 18, 2021Date of Patent: September 17, 2024Assignee: Apple Inc.Inventors: Jung Yen Huang, Shinya Ono, Chin-Wei Lin, Akira Matsudaira, Cheng Min Hu, Chih Pang Chang, Ching-Sang Chuang, Gihoon Choo, Jiun-Jye Chang, Po-Chun Yeh, Shih Chang Chang, Yu-Wen Liu, Zino Lee