Abstract: A semiconductor package includes a carrier plate, a photonic integrated circuit chip, an electronic integrated circuit chip and an interposer substrate. The carrier plate has a notch and a first surface and a second surfaces opposite to the first surface, and the notch extends from the first surface toward the second surface. The photonic integrated circuit chip is disposed within the notch. The electronic integrated circuit chip is disposed on the first surface of the carrier plate. The photonic integrated circuit chip and the electronic integrated circuit chip are disposed on the carrier through the interposer substrate.

Abstract: The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.

Abstract: The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.

Abstract: An ear canal clamp for small animals includes a base and a clamping mechanism. The clamping mechanism includes two clamping arms movably mounted on the base, a biasing member mounted on the base and constrained between the clamping arms, and two ear canal positioning members mounted respectively to the clamping arms and facing each other. The clamping arms are configured to move toward each other and compress the biasing member to increase the distance between the ear canal positioning members. A biasing force generated by the biasing member when compressed is used to push the clamping arms to move oppositely with respect to each other.

Abstract: A head cap with channel identification includes a head cap, channel identification module, a controlling module, and electrical stimulation modules. The head cap includes the channels therein, and the head cap includes brain regions corresponding to the brain areas of the human being. The electrical stimulation modules disposed in the channels, and the channel identification modules disposed around the peripheral of the channels. The controlling module is electrically coupled to the channel identification modules. When the electrical stimulation modules disposed in some of the channels, the channel identification modules around the peripheral of the channels and the electrical stimulation module are constituted a circuit conduction status or a short circuit status, then the channel identification module transmits a signal to the controlling module to determine the desired sites of the electrical stimulation module where is corresponding to one of the brain areas of the human being according to the signal.

Abstract: The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.

Abstract: A head cap with channel identification includes a head cap, channel identification module, a controlling module, and electrical stimulation modules. The head cap includes the channels therein, and the head cap includes brain regions corresponding to the brain areas of the human being. The electrical stimulation modules disposed in the channels, and the channel identification modules disposed around the peripheral of the channels. The controlling module is electrically coupled to the channel identification modules. When the electrical stimulation modules disposed in some of the channels, the channel identification modules around the peripheral of the channels and the electrical stimulation module are constituted a circuit conduction status or a short circuit status, then the channel identification module transmits a signal to the controlling module to determine the desired sites of the electrical stimulation module where is corresponding to one of the brain areas of the human being according to the signal.

Abstract: The invention provides transcranial electrostimulation by combining transcranial direct current stimulation (tDCS) and theta burst stimulation (TBS) to achieve an unexpected therapeutic effect in various brain or neural diseases. Accordingly, the invention provides a mode of direct current with biphasic square wave pulses in the treatment of brain or neural diseases. Also provided are methods of employing the transcranial electrostimulation of the invention and applications of the transcranial electrostimulation of the invention.

Abstract: The invention provides transcranial electrostimulation by combining transcranial direct current stimulation (tDCS) and theta burst stimulation (TBS) to achieve an unexpected therapeutic effect in various brain or neural diseases. Accordingly, the invention provides a mode of direct current with biphasic square wave pulses in the treatment of brain or neural diseases. Also provided are methods of employing the transcranial electrostimulation of the invention and applications of the transcranial electrostimulation of the invention.

Abstract: The present invention relates to an anticorrosion layer and a manufacturing method thereof, wherein the anticorrosion layer is capable of being coated onto the surface of a substrate for preventing the substrate surface from corrosion, the anticorrosion layer comprises: a polymer material layer, coated on the substrate surface; and a continuous rough surface layer, formed on the surface of the polymer material layer, wherein the continuous rough surface layer has a surface roughness great than 10 nm. Moreover, through the manufacturing method, a protective layer (the anticorrosion layer) with excellent anticorrosion efficiency and low pollution property can be rapidly and massively formed on the substrate surface by way of using a replica mold.

Abstract: A document property detecting includes a circuit comprising a first electrode and a plurality of second electrodes, a transparent conductive substrate electrically connected to the first electrode for loading a document, and a cover with a plurality of conductive media electrically connected to the second electrodes, respectively.

Abstract: A document property detecting includes a circuit comprising a first electrode and a plurality of second electrodes, a transparent conductive substrate electrically connected to the first electrode for loading a document, and a cover with a plurality of conductive media electrically connected to the second electrodes, respectively.

Abstract: In a process for producing nanocarbon materials, a metal reducing agent and a carbon source are subjected to a chemical reduction reaction under an atmosphere which will not interfere with the reaction and at a temperature preferably lower than 1000° C., such that a nanocarbon material having a graphite-like structure is formed therefrom. Optionally, an additive, e.g. a fullerene compound, or a porous substrate such as zeolite powder, may be used during the production of the nanocarbon material.