Patents by Inventor Chih-Wei Su

Chih-Wei Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250070064
    Abstract: An embodiment is a device including a first die and a substrate including a first surface and a second surface opposite the first surface. The device also includes an active device on the first surface of the substrate. The device also includes a first interconnect structure on the first surface of the substrate. The device also includes a through substrate via extending through the first interconnect structure and the substrate to the second surface of the substrate, the through substrate via being electrically coupled to metallization patterns in the first interconnect structure. The device also includes one or more material-filled trench structures extending from the second surface of the substrate into the substrate, the one or more material-filled trench structures being electrically isolated from the through substrate via.
    Type: Application
    Filed: January 3, 2024
    Publication date: February 27, 2025
    Inventors: Ke-Gang Wen, Yu-Bey Wu, Liang-Wei Wang, Hsin-Feng Chen, Tsung-Chieh Hsiao, Chih Chuan Su, Dian-Hau Chen
  • Patent number: 12222576
    Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.
    Type: Grant
    Filed: November 9, 2023
    Date of Patent: February 11, 2025
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Kuen-Wang Tsai, Liang-Ting Ho, Chao-Hsi Wang, Chih-Wei Weng, He-Ling Chang, Che-Wei Chang, Sheng-Zong Chen, Ko-Lun Chao, Min-Hsiu Tsai, Shu-Shan Chen, Jungsuck Ryoo, Mao-Kuo Hsu, Guan-Yu Su
  • Patent number: 11962411
    Abstract: A data retransmission method includes configuring the quantity of code block groups in a transport block and configuring a plurality of physical resource groups; configuring the quantity of physical resources included in each of the physical resource groups according to the different quantities of code block groups; selecting the physical resources included in the physical resource group that corresponds to the initial transmission to send the transport block; determining the quantity of code block groups that were erroneously sent in the transport block according to the response; selecting one of the physical resources in one of the physical resource groups that corresponds to the retransmission to send at least one code block group that was erroneously sent according to the quantity of code block groups that were erroneously sent; and completing the retransmission only after all of the code block groups in the transport block have been successfully sent.
    Type: Grant
    Filed: February 8, 2022
    Date of Patent: April 16, 2024
    Assignee: LITE-ON TECHNOLOGY CORPORATION
    Inventors: Chien-Hsin Tang, Chih Wei Su
  • Publication number: 20230402426
    Abstract: A manufacturing method of a semiconductor structure including the following steps is provided. A first substrate is provided. A first dielectric structure is formed on the first substrate. At least one first cavity is formed in the first dielectric structure. A first stress adjustment layer is formed in the first cavity. The first stress adjustment layer covers the first dielectric structure. A second substrate is provided. A second dielectric structure is formed on the second substrate. At least one second cavity is formed in the second dielectric structure. A second stress adjustment layer is formed in the second cavity. The second stress adjustment layer covers the second dielectric structure. The first stress adjustment layer and the second stress adjustment layer are bonded.
    Type: Application
    Filed: July 27, 2022
    Publication date: December 14, 2023
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Shih-Ping Lee, Shih-Hsorng Shen, Chih-Wei Su, Yu-Chun Huo
  • Publication number: 20230217547
    Abstract: A base station management device is provided in the invention. The base station management device includes a Non-Real Time (Non-RT) Radio-Access-Network Intelligent Controller (RIC) and a management device. The Non-RT RIC communicates with applications through a first communication interface. The management device manages a plurality of base stations, communicates with the Non-RT RIC through a second communication interface, and registers a first application and a second application through the Non-RT RIC. The management device detects the plurality of base stations through the first application to determine whether to update the parameter information of the plurality of base stations through the second application.
    Type: Application
    Filed: March 13, 2023
    Publication date: July 6, 2023
    Inventors: Chih-Wei SU, Chen-chieh TSAI
  • Publication number: 20230189193
    Abstract: A method for communication in service management and orchestration is provided. The method includes receiving, by a Non-real time radio access network (RAN) Intelligent Controller (Non-RT RIC) framework, a first subscription message from an Element Management System (EMS), wherein the first subscription message is used to request second data used to run a Non-RT RIC application (rApp). The method includes transmitting, by the Non-RT RIC framework, a first callback message to the rApp according to the first subscription message to notify the rApp that the EMS requests the second data.
    Type: Application
    Filed: February 3, 2023
    Publication date: June 15, 2023
    Inventors: Chih-Wei SU, Pei-Hsuan LIN
  • Publication number: 20220166552
    Abstract: A data retransmission method includes configuring the quantity of code block groups in a transport block and configuring a plurality of physical resource groups; configuring the quantity of physical resources included in each of the physical resource groups according to the different quantities of code block groups; selecting the physical resources included in the physical resource group that corresponds to the initial transmission to send the transport block; determining the quantity of code block groups that were erroneously sent in the transport block according to the response; selecting one of the physical resources in one of the physical resource groups that corresponds to the retransmission to send at least one code block group that was erroneously sent according to the quantity of code block groups that were erroneously sent; and completing the retransmission only after all of the code block groups in the transport block have been successfully sent.
    Type: Application
    Filed: February 8, 2022
    Publication date: May 26, 2022
    Inventors: Chien-Hsin TANG, Chih Wei SU
  • Patent number: 10966140
    Abstract: A method for detecting and preventing the operation of a rogue access point (AP) by issuing deauthentication packets thereto includes receiving beacon packets of all wireless APs in a wireless network area, obtaining timestamps, and establishing a clock skew model for each wireless AP accordingly. Each clock skew model can be held abnormal according to a growth slope of the clock skew model, and the wireless AP corresponding to an abnormal clock offset model can be defined as a rogue AP. Position and distance range of the rogue AP can be established by RSSIs, and a specified authorized AP adjacent to the rogue AP can be selected and controlled to send deauthentication packets to the rogue AP. A device for detecting and restraining the rogue AP is also provided.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: March 30, 2021
    Assignee: NANNING FUGUI PRECISION INDUSTRIAL CO., LTD.
    Inventors: Cheng-Yi Huang, Chih-Wei Su
  • Publication number: 20200396671
    Abstract: A method for detecting and preventing the operation of a rogue access point (AP) by issuing deauthentication packets thereto includes receiving beacon packets of all wireless APs in a wireless network area, obtaining timestamps, and establishing a clock skew model for each wireless AP accordingly. Each clock skew model can be held abnormal according to a growth slope of the clock skew model, and the wireless AP corresponding to an abnormal clock offset model can be defined as a rogue AP. Position and distance range of the rogue AP can be established by RSSIs, and a specified authorized AP adjacent to the rogue AP can be selected and controlled to send deauthentication packets to the rogue AP. A device for detecting and restraining the rogue AP is also provided.
    Type: Application
    Filed: June 17, 2019
    Publication date: December 17, 2020
    Inventors: CHENG-YI HUANG, CHIH-WEI SU
  • Publication number: 20200027985
    Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a first silicon layer, an insulating layer on the first silicon layer, and a second silicon layer on the insulating layer; forming a metal-oxide semiconductor (MOS) transistor on the substrate; forming an interlayer dielectric layer (ILD) on the MOS transistor; removing part of the ILD layer to form a first trench to expose the insulating layer; and performing a wet etching process through the first trench to remove part of the insulating layer for forming a first air gap under the MOS transistor.
    Type: Application
    Filed: August 22, 2018
    Publication date: January 23, 2020
    Inventors: Purakh Raj Verma, Chih-Wei Su, Je-Min Wen
  • Patent number: 10529854
    Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a first silicon layer, an insulating layer on the first silicon layer, and a second silicon layer on the insulating layer; forming a metal-oxide semiconductor (MOS) transistor on the substrate; forming an interlayer dielectric layer (ILD) on the MOS transistor; removing part of the ILD layer to form a first trench to expose the insulating layer; and performing a wet etching process through the first trench to remove part of the insulating layer for forming a first air gap under the MOS transistor.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: January 7, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Purakh Raj Verma, Chih-Wei Su, Je-Min Wen
  • Patent number: 10447763
    Abstract: The present disclosure recites a distributed storage method applied in a distributed file system, and the method including steps: splitting the original file into data blocks and storing in a data block queue; assigning multiple data nodes to form a first pipe to transmit a first data block from the data block queue, and when the first one of the data nodes in the first pipe have been written in the data block, assigning another multiple data nodes to form a second pipe to transmit a second data block from the data block queue; transmitting the pipes when the overall data nodes of the first and second pipes been written in the first and second data blocks. The present disclosure also provides a distributed storage system, and all of them can improve the transmission speed of the distributed file system.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: October 15, 2019
    Assignee: NANNING FUGUI PRECISION INDUSTRIAL CO., LTD.
    Inventors: Cheng-Yi Huang, Chih-Wei Su
  • Patent number: 10354906
    Abstract: A support apparatus and a support method are provided, the support apparatus includes: a support substrate for bearing a supported component, the support substrate having a first main surface facing the supported component and a second main surface positioned on a side opposite to the first main surface; and a pressure distribution plate, arranged on the first main surface of the support substrate and positioned between the support substrate and the supported component, wherein the pressure distribution plate is configured to bring the supported component to be separated from the support substrate.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: July 16, 2019
    Assignees: BOE Technology Group Co., Ltd., Hefei Xinsheng Optoelectronics Technology Co., Ltd.
    Inventor: Chih-Wei Su
  • Publication number: 20180167439
    Abstract: The present disclosure recites a distributed storage method applied in a distributed file system, and the method including steps: splitting the original file into data blocks and storing in a data block queue; assigning multiple data nodes to form a first pipe to transmit a first data block from the data block queue, and when the first one of the data nodes in the first pipe have been written in the data block, assigning another multiple data nodes to form a second pipe to transmit a second data block from the data block queue; transmitting the pipes when the overall data nodes of the first and second pipes been written in the first and second data blocks. The present disclosure also provides a distributed storage system, and all of them can improve the transmission speed of the distributed file system.
    Type: Application
    Filed: December 8, 2016
    Publication date: June 14, 2018
    Inventors: CHENG-YI HUANG, CHIH-WEI SU
  • Publication number: 20180096876
    Abstract: A support apparatus and a support method are provided, the support apparatus includes: a support substrate for bearing a supported component, the support substrate having a first main surface facing the supported component and a second main surface positioned on a side opposite to the first main surface; and a pressure distribution plate, arranged on the first main surface of the support substrate and positioned between the support substrate and the supported component, wherein the pressure distribution plate is configured to bring the supported component to be separated from the support substrate.
    Type: Application
    Filed: March 2, 2017
    Publication date: April 5, 2018
    Applicants: BOE Technology Group Co., Ltd., Hefei Xinsheng Optoelectronics Technology Co., Ltd.
    Inventor: Chih-Wei Su
  • Patent number: 9774933
    Abstract: A housing assembly of an electronic device includes an outer housing, an inner housing mounted to the outer housing, a first waterproof film positioned between the outer housing and the inner housing, and a second waterproof film spaced from the first waterproof film. The first waterproof film, the outer housing, and the inner housing cooperatively define a first cavity of the housing assembly. The second waterproof film, the inner housing, and the first waterproof film cooperatively form a second cavity of the housing assembly. The first and second waterproof films provide the housing assembly an excellent waterproof property. The electronic device using the housing assembly is also described.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: September 26, 2017
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventors: Chien-Feng Yeh, Wei-Jen Chang, Meng-Jer Huang, Chih-Wei Su, Chun-Yen Liu, Chih-Cheng Chang
  • Publication number: 20170063781
    Abstract: A signaling control system for use in a NAT traversal system includes a registrar server and an application layer gateway server. The registrar server is configured to record registration information of two user terminals. The application layer gateway server is configured to determinate whether the two user terminals are located under a same network address translation device according to the registration information during a process where the two user terminals create a session connection, and forward respective session description protocol information of the two user terminals to each other if it is determined that the two user terminals are located under the same network address translation device.
    Type: Application
    Filed: August 22, 2016
    Publication date: March 2, 2017
    Inventors: Whai-En CHEN, Bo-En CHEN, Chih-Wei SU
  • Patent number: 9578180
    Abstract: A communication network system, a calling terminal and a voice call establishing method thereof are provided. The communication network system comprises a called terminal, the calling terminal and a session initiation protocol (SIP) server. The calling terminal generates and transmits an invite message including IPv4 connection information and IPv6 connection information of the calling terminal. The SIP server is communicatively connected to the calling terminal and the called terminal. The SIP server receives the invite message from the calling terminal and forwards the invite message to the called terminal. The called terminal establishes a voice call with the calling terminal according to one of the IPv4 connection information and the IPv6 connection information of the calling terminal.
    Type: Grant
    Filed: December 5, 2012
    Date of Patent: February 21, 2017
    Assignee: Institute For Information Industry
    Inventors: Whai-En Chen, Chih-Wei Su, Chun-Chieh Chiu
  • Publication number: 20140348368
    Abstract: A housing assembly of an electronic device includes an outer housing, an inner housing mounted to the outer housing, a first waterproof film positioned between the outer housing and the inner housing, and a second waterproof film spaced from the first waterproof film. The first waterproof film, the outer housing, and the inner housing cooperatively define a first cavity of the housing assembly. The second waterproof film, the inner housing, and the first waterproof film cooperatively form a second cavity of the housing assembly. The first and second waterproof films provide the housing assembly an excellent waterproof property. The electronic device using the housing assembly is also described.
    Type: Application
    Filed: August 30, 2013
    Publication date: November 27, 2014
    Applicant: CHIUN MAI COMMUNICATION SYSTEMS, INC.
    Inventors: CHIEN-FENG YEH, WEI-JEN CHANG, MENG-JER HUANG, CHIH-WEI SU, CHUN-YEN LIU, CHIH-CHENG CHANG
  • Patent number: 8059604
    Abstract: A signal measurement method for a mobile communication apparatus supporting multiple transmission interfaces to perform communication transmission in a heterogeneous network environment, system and a recording medium thereof. Changes in the signal strength of an active network transmission interface are employed to adjust signal measurement periods of other non-active network transmission interfaces, thereby reducing the signal measurement frequency of these non-active network transmission interfaces. Moreover, as for the situation that a specific transmission interface periodically reports the signal measurement result to a remote network server, the signal measurement time during the report can also be reduced. By solving the power consumption problem caused by frequently activating the signal measurement of the mobile communication apparatus, the efficacies of saving power and improving the standby time and talk time can be achieved.
    Type: Grant
    Filed: August 29, 2007
    Date of Patent: November 15, 2011
    Assignee: Institute For Information Industry
    Inventors: Chih-Wei Su, Wen-Hsin Wei