Abstract: An embodiment composite material for semiconductor package mount applications may include a first component including a tin-silver-copper alloy and a second component including a tin-bismuth alloy or a tin-indium alloy. The composite material may form a reflowed bonding material having a room temperature tensile strength in a range from 80 MPa to 100 MPa when subjected to a reflow process. The reflowed bonding material may include a weight fraction of bismuth that is in a range from approximately 4% to approximately 15%. The reflowed bonding material may an alloy that is solid solution strengthened by a presence of bismuth or indium that is dissolved within the reflowed bonding material or a solid solution phase that includes a minor component of bismuth dissolved within a major component of tin. In some embodiments, the reflowed bonding material may include intermetallic compounds formed as precipitates such as Ag3Sn and/or Cu6Sn5.

Abstract: A method includes depositing solder paste over first contact pads of a first package component. Spring connectors of a second package component are aligned to the solder paste. The solder paste is reflowed to electrically and physically couple the spring connectors of the second package component to the first contact pads of the first package component. A device includes a first package component and a second package component electrically and physically coupled to the first package component by way of a plurality of spring coils. Each of the plurality of spring coils extends from the first package component to the second package component.

Abstract: An apparatus is provided for mounting and protecting a subject object, such as, in some embodiments, a hard disk drive, comprising: a) a damping structure comprising an elastomeric material adapted to partially cover the subject object; and b) an insert plate assembly borne in the damping structure comprising: i) an insert plate, and ii) a screw, post, dowel or pin adapted to engage a mounting hole in the subject object.

Abstract: An optical disk drive with a protected pick-up unit. The optical disk drive includes a core body, a guide bar, a pick-up unit and an impact-reducing mechanism. The core body has an operating zone. The guide bar is connected to the core body. The pick-up unit is movably supported by the guide bar to access an optical disk in the operating zone. The impact-reducing mechanism is disposed outside the operating zone to sustain impact of the pick-up unit when the pick-up unit moves outside the operating zone and collides with the impact-reducing mechanism.

Abstract: An optical disc drive comprising a chassis, a tray, an optical pickup, a housing and an airflow guiding means is provided. The tray is movably disposed on the chassis, for carrying a disc into and out of the optical disc drive. The optical pickup reads data on the disc covering parts of the aperture through the aperture. The housing covers the chassis. The airflow guiding means has several passages. The airflow guiding means is disposed in the optical disc drive and relatively to the aperture of the tray, for diverting airflow around the rotating disc.