Abstract: A connector includes a base, a latch, and a first axle element. The latch is disposed on the base. The latch includes a main portion, a front-left arm, a front-right arm, a back-left arm, and a back-right arm, wherein each of the front end of the front-left arm and the front end of the front-right arm has a hook-shaped structure, and each of the back-left arm and the back-right arm has a hole. The first axle element is pivoted to the hole of the back-left arm and the base. The back-left arm of the latch is located along the lengthwise direction of the front-left arm, and the back-left arm and the front-left arm are connected by a connecting structure.

Abstract: A method of fabricating a package structure is provided. The method includes providing a carrier having two opposing surfaces, forming dielectric bodies on the two surfaces of the carrier, respectively, each of the dielectric bodies having a wiring layer embedded therein and a conductive layer formed on the wiring layer, and removing the carrier. Therefore, the wiring layers, the conductive layers and the dielectric bodies are formed on the two surfaces of the carrier, respectively, and the production yield is thus increased. The present invention further provides the package structure thus fabricated.