Patents by Inventor Chih-Wen Liao

Chih-Wen Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250118656
    Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate, a first conductive line, a first conductive via, a second conductive line, and a first barrier layer. The first conductive line is disposed on the substrate. The first conductive via is disposed on the first conductive line. The second conductive line is disposed on the first conductive line. The first barrier layer is disposed between the first conductive via and the second conductive line.
    Type: Application
    Filed: October 6, 2023
    Publication date: April 10, 2025
    Inventors: HWEI-JAY CHU, HSI-WEN TIEN, WEI-HAO LIAO, YU-TENG DAI, HSIN-CHIEH YAO, CHENG-HAO CHEN, CHIH WEI LU
  • Patent number: 12272592
    Abstract: A high voltage device includes: a semiconductor layer, a well, a bulk region, a gate, a source, and a drain. The bulk region is formed in the semiconductor layer and contacts the well region along a channel direction. A portion of the bulk region is vertically below and in contact with the gate, to provide an inversion region of the high voltage device when the high voltage device is in conductive operation. A portion of the well lies between the bulk region and the drain, to separate the bulk region from the drain. A first concentration peak region of an impurities doping profile of the bulk region is vertically below and in contact with the source. A concentration of a second conductivity type impurities of the first concentration peak region is higher than that of other regions in the bulk region.
    Type: Grant
    Filed: May 15, 2024
    Date of Patent: April 8, 2025
    Assignee: RICHTEK TECHNOLOGY CORPORATION
    Inventors: Kun-Huang Yu, Chien-Yu Chen, Ting-Wei Liao, Chih-Wen Hsiung, Chun-Lung Chang, Kuo-Chin Chiu, Wu-Te Weng, Chien-Wei Chiu, Yong-Zhong Hu, Ta-Yung Yang
  • Publication number: 20250112087
    Abstract: A method for fabricating an integrated circuit device is provided. The method includes depositing a first dielectric layer; depositing a second dielectric layer over the first dielectric layer; etching a trench opening in the second dielectric layer, wherein the trench opening exposes a first sidewall of the second dielectric layer and a second sidewall of the second dielectric layer, the first sidewall of the second dielectric layer extends substantially along a first direction, and the second sidewall of the second dielectric layer extends substantially along a second direction different from the first direction in a top view; forming a via etch stop layer on the first sidewall of the second dielectric layer, wherein the second sidewall of the second dielectric layer is free from coverage by the via etch stop layer; forming a conductive line in the trench opening; and forming a conductive via over the conductive line.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 3, 2025
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hwei-Jay CHU, Hsi-Wen TIEN, Wei-Hao LIAO, Yu-Teng DAI, Hsin-Chieh YAO, Tzu-Hui WEI, Chih Wei LU, Chan-Yu LIAO, Li-Ling SU, Chia-Wei SU, Yung-Hsu WU, Hsin-Ping CHEN
  • Publication number: 20250110307
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Application
    Filed: December 12, 2024
    Publication date: April 3, 2025
    Inventors: Chao-Chang HU, Chih-Wei WENG, Chia-Che WU, Chien-Yu KAO, Hsiao-Hsin HU, He-Ling CHANG, Chao-Hsi WANG, Chen-Hsien FAN, Che-Wei CHANG, Mao-Gen JIAN, Sung-Mao TSAI, Wei-Jhe SHEN, Yung-Ping YANG, Sin-Hong LIN, Tzu-Yu CHANG, Sin-Jhong SONG, Shang-Yu HSU, Meng-Ting LIN, Shih-Wei HUNG, Yu-Huai LIAO, Mao-Kuo HSU, Hsueh-Ju LU, Ching-Chieh HUANG, Chih-Wen CHIANG, Yu-Chiao LO, Ying-Jen WANG, Shu-Shan CHEN, Che-Hsiang CHIU
  • Patent number: 12266565
    Abstract: The present disclosure relates to an integrated chip. The integrated chip comprises a dielectric layer over a substrate. A first metal feature is over the dielectric layer. A second metal feature is over the dielectric layer and is laterally adjacent to the first metal feature. A first dielectric liner segment extends laterally between the first metal feature and the second metal feature along an upper surface of the dielectric layer. The first dielectric liner segment extends continuously from along the upper surface of the dielectric layer, to along a sidewall of the first metal feature that faces the second metal feature, and to along a sidewall of the second metal feature that faces the first metal feature. A first cavity is laterally between sidewalls of the first dielectric liner segment and is above an upper surface of the first dielectric liner segment.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: April 1, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsi-Wen Tien, Chung-Ju Lee, Chih Wei Lu, Hsin-Chieh Yao, Shau-Lin Shue, Yu-Teng Dai, Wei-Hao Liao
  • Publication number: 20250079162
    Abstract: Embodiment methods for performing a high pressure anneal process during the formation of a semiconductor device, and embodiment devices therefor, are provided. The high pressure anneal process may be a dry high pressure anneal process in which a pressurized environment of the anneal includes one or more process gases. The high pressure anneal process may be a wet anneal process in which a pressurized environment of the anneal includes steam.
    Type: Application
    Filed: November 19, 2024
    Publication date: March 6, 2025
    Inventors: Szu-Ying Chen, Ya-Wen Chiu, Cheng-Po Chau, Yi Che Chan, Chih Ping Liao, YungHao Wang, Sen-Hong Syue
  • Patent number: 12243775
    Abstract: In one embodiment, a method of forming metal interconnects uses a direct metal etch approach to form and fill the metal gap. The method may include directly etching a metal layer to form metal patterns. The metal patterns may be spaced apart from one another by recesses. A dielectric spacer may be formed extending along the sidewalls of each of the recesses. The recesses may be filled with a conductive material to form a second set of metal patterns. By directly etching the metal film, the technique allows for reduced line width roughness. The disclosed structure may have the advantages of increased reliability, better RC performance and reduced parasitic capacitance.
    Type: Grant
    Filed: January 27, 2023
    Date of Patent: March 4, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai, Hsin-Chieh Yao, Chih-Wei Lu, Chung-Ju Lee
  • Publication number: 20250054824
    Abstract: A package structure including a packaging substrate, a semiconductor device, passive components, a lid, and a dam structure is provided. The semiconductor device is disposed on and electrically connected to the packaging substrate. The passive components are disposed on the packaging substrate, wherein the semiconductor device is surrounded by the passive components. The lid is disposed on the packaging substrate, and the lid covers the semiconductor device and the passive components. The dam structure is disposed between the packaging substrate and the lid, wherein the dam structure covers the passive components and laterally encloses the semiconductor device.
    Type: Application
    Filed: August 8, 2023
    Publication date: February 13, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi Wen Huang, Chih-Hao Chen, Ping-Yin Hsieh, Yi-Huan Liao, Li-Hui Cheng
  • Patent number: 12204163
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: February 5, 2024
    Date of Patent: January 21, 2025
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Publication number: 20230410128
    Abstract: A method for managing a genuine fabric with blockchain data comprises the following steps: receiving at least one image of a genuine fabric photographed by a computing device, wherein the image contains at least one anti-counterfeiting texture generated during a manufacturing process thereof, and the computing device performs image analysis on the anti-counterfeiting texture to obtain at least one hash value; forming an smart contract with a text serial number corresponding to the genuine fabric and the hash value by one of a plurality of nodes in a blockchain through the computing device, and launching the smart contract to the nodes; and providing a key to at least one of a fabric production end and a brand sales end, wherein after the smart contract is signed, a non-fungible token which is associated with the genuine fabric is minted at one of the nodes in the blockchain.
    Type: Application
    Filed: June 27, 2022
    Publication date: December 21, 2023
    Inventor: Chih-Wen LIAO
  • Patent number: 11702775
    Abstract: A method for forming an anti-counterfeiting feature during knitting of a fabric and a fabric thereof, the fabric is knitted with at least one first yarn, a part of the fabric includes a plurality of featured yarn loops formed by a second yarn, the featured yarn loops constitute an anti-counterfeiting feature, the anti-counterfeiting feature can be directly observed from one side surface of the fabric, the second yarn is formed by twisting at least two sub-yarns with different shades, and shades of the at least two sub-yarns and the first yarn are different from each other, and a shade of the featured yarn loops displayed on the side surface is random. Accordingly, the randomness of yarn twisting makes the anti-counterfeiting feature difficult to be replicated, thereby preventing unscrupulous manufacturers from counterfeiting the fabric.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: July 18, 2023
    Assignee: HENG SHENG INVESTMENT LTD.
    Inventor: Chih-Wen Liao
  • Patent number: 11505882
    Abstract: The invention provides a system for performing dynamic production and knitting machine work management comprising a production demand management unit, an advanced scheduling management unit, a cloth pattern storage unit and a manufacturing execution unit. The production demand management unit receives at least one production demand data. The advanced scheduling management unit generates a production scheduling data according to working conditions of a plurality of knitting machines and the production demand data. The cloth pattern storage unit stores a plurality of knitting machine work setting data. The manufacturing execution unit controls each knitting machine to extract one of the plurality of knitting machine work setting data from the cloth pattern storage unit based on a production cloth pattern data. The knitting machine work setting data is forcibly deleted by the knitting machine when a knitting number meets a set value defined by the knitting number limiting data.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: November 22, 2022
    Assignee: WHOLEKNIT INTERNATIONAL CO., LTD.
    Inventor: Chih-Wen Liao
  • Publication number: 20220129914
    Abstract: The present invention provides a method for verifying a product authenticity with fabric features, comprising steps of receiving at least one fabric partial image and performing image analysis to determine an image optical feature distribution information of an anti-counterfeiting feature, receiving a fabric serial number generated by operation of an input device, and determining whether a fabric is an authorized product by using the fabric serial number or the information.
    Type: Application
    Filed: January 6, 2021
    Publication date: April 28, 2022
    Inventors: Chih-Wen LIAO, Chu WU, Yuh-Jiun LIN, Chi-Hang TSAI, Han-Chao LEE, Ko-Yang WANG
  • Publication number: 20220112635
    Abstract: A method for forming an anti-counterfeiting feature during knitting of a fabric and a fabric thereof, the fabric is knitted with at least one first yarn, a part of the fabric includes a plurality of featured yarn loops formed by a second yarn, the featured yarn loops constitute an anti-counterfeiting feature, the anti-counterfeiting feature can be directly observed from one side surface of the fabric, the second yarn is formed by twisting at least two sub-yarns with different colours, and colours of the at least two sub-yarns and the first yarn are different from each other, and a colour of the featured yarn loops displayed on the side surface is random. Accordingly, the randomness of yarn twisting makes the anti-counterfeiting feature difficult to be replicated, thereby preventing unscrupulous manufacturers from counterfeiting the fabric.
    Type: Application
    Filed: November 30, 2020
    Publication date: April 14, 2022
    Inventor: Chih-Wen LIAO
  • Publication number: 20210109510
    Abstract: The invention provides a system for performing dynamic production and knitting machine work management comprising a production demand management unit, an advanced scheduling management unit, a cloth pattern storage unit and a manufacturing execution unit. The production demand management unit receives at least one production demand data. The advanced scheduling management unit generates a production scheduling data according to working conditions of a plurality of knitting machines and the production demand data. The cloth pattern storage unit stores a plurality of knitting machine work setting data. The manufacturing execution unit controls each knitting machine to extract one of the plurality of knitting machine work setting data from the cloth pattern storage unit based on a production cloth pattern data. The knitting machine work setting data is forcibly deleted by the knitting machine when a knitting number meets a set value defined by the knitting number limiting data.
    Type: Application
    Filed: September 30, 2020
    Publication date: April 15, 2021
    Inventor: Chih-Wen LIAO
  • Publication number: 20210109509
    Abstract: The invention provides a system for performing production and factory area material transportation management, comprising a production demand management unit, a warehouse management unit, an advanced scheduling management unit, a manufacturing execution unit and a transport dispatching unit. The production demand management unit receives at least one production demand data input externally. The warehouse management unit records a plurality of production material storage data. The advanced scheduling management unit outputs at least one production scheduling data based on the at least one production demand data and working states of a plurality of operation areas. The manufacturing execution unit generates at least one production execution data based on the production scheduling data.
    Type: Application
    Filed: September 22, 2020
    Publication date: April 15, 2021
    Inventor: Chih-Wen LIAO
  • Patent number: 6255570
    Abstract: A vessel-shaped flute has a body and a captive cap. The cap is pivotally attached to the body with a pivot pin. A through hole is defined through the pivot pin. Consequently, the cap can cover the mouthpiece and all of the finger holes when the vessel-shaped flute is not in use. Protection is provided to the mouthpiece and finger holes to prevent them from being damaged or getting dirty. In addition, a cord can be threaded through the through hole. The user can wear the vessel-shaped flute as a necklace. The use and the decorative effect of the vessel-shaped flute are improved.
    Type: Grant
    Filed: January 4, 2001
    Date of Patent: July 3, 2001
    Inventor: Chih-Wen Liao