Patents by Inventor Chih-wen TSENG

Chih-wen TSENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250079684
    Abstract: An antenna module and a related network communication device are provided in this disclosure. A network communication device includes a circuit board, a network communication chip, an antenna, a signal line, and an antenna bracket. The network communication chip is disposed on the circuit board. The antenna bracket has a first antenna slot, a circuit board slot, a circuit board hook and an opposite supporting part. The first antenna slot is configured to carry the antenna. The circuit board hook and the opposite supporting part are respectively located on opposing first surface and second surface of the circuit board. The circuit board slot is located between the circuit board hook and the opposite supporting part to accommodate the circuit board. The circuit board hook is buckled to a first buckle hole of the circuit board.
    Type: Application
    Filed: August 2, 2024
    Publication date: March 6, 2025
    Applicant: Sercomm Corporation
    Inventors: Chih Wen Tseng, Chia Chun Sun
  • Publication number: 20230327340
    Abstract: A network communication device having an antenna frame includes a circuit board, a network communication chip, an antenna, a signal cable and an antenna frame. The network communication chip is disposed on the circuit board. The signal cable is electrically connected to the antenna and the circuit board. The antenna frame is assembled on the circuit board. The antenna frame has a slot. The antenna is engaged in the slot. The antenna is directly fixed on the circuit board through the antenna frame, and the assembling of the antenna is easy to complete.
    Type: Application
    Filed: March 13, 2023
    Publication date: October 12, 2023
    Applicant: Sercomm Corporation
    Inventors: Hsien-Wen Liu, Chih Wen Tseng
  • Patent number: 11196619
    Abstract: A network system comprising: a control node; a first head node, comprising a first head forward port, a first head backward port and a first head backup port, wherein the first head forward port is connected to the control node; a first ordinary node, comprising a first forward port, a first backward port and a first backup port, wherein the first forward port is connected to the first head backward port; a second ordinary node, comprising a second forward port, a second backward port and a second backup port, wherein the second forward port is connected to the first backward port; and a third ordinary node, comprising a third forward port, a third backward port and a third backup port, wherein the third forward port is connected to the second backward port, wherein the third backup port is connected to the first head backup port.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: December 7, 2021
    Assignee: Sercomm Corporation
    Inventors: Chih-Wen Tseng, Chuanqi Luo, Lin Cheng
  • Publication number: 20200322213
    Abstract: A network system comprising: a control node; a first head node, comprising a first head forward port, a first head backward port and a first head backup port, wherein the first head forward port is connected to the control node; a first ordinary node, comprising a first forward port, a first backward port and a first backup port, wherein the first forward port is connected to the first head backward port; a second ordinary node, comprising a second forward port, a second backward port and a second backup port, wherein the second forward port is connected to the first backward port; and a third ordinary node, comprising a third forward port, a third backward port and a third backup port, wherein the third forward port is connected to the second backward port, wherein the third backup port is connected to the first head backup port.
    Type: Application
    Filed: March 2, 2020
    Publication date: October 8, 2020
    Inventors: Chih-Wen Tseng, CHUANQI LUO, Lin Cheng
  • Patent number: 8631622
    Abstract: Wood-based flooring systems with click-type interlocking joint systems include a protective film system covering the contact surfaces of the click system. The protective film system includes one or more sheets of a material with low moisture transmissivity and a low coefficient of friction. In this way, the contact surfaces of the click system are protected against undue humidity absorption and frictional rubbing to thereby avoid squeaking after installation. In some embodiments there are four film sheets covering the entirety of all four click surfaces, in others there is one film sheet covering the entirety of all four click surfaces, in others there is film covering the entirety of only the two longitudinal click surfaces, in others there is film covering the entirety of only the two tongue click surfaces, and in others there is film covering only the contact surfaces of the click surfaces.
    Type: Grant
    Filed: July 9, 2012
    Date of Patent: January 21, 2014
    Assignee: Chinafloors Holding Limited
    Inventors: Thomas L. M. Baert, Chih-wen Tseng
  • Publication number: 20130329936
    Abstract: An array speaker structure with pop-up mechanisms includes: an array speaker unit; a first conductive connector positioned at an upper end of the array speaker unit; a second conductive connector positioned at a lower end of the array speaker unit, the array speaker unit being rotatably electrical-signal connected between the first and second conductive connectors; two pop-up mechanism installed in the first and second conductive connectors in electrical contact therewith; and a pushbutton switch for hooking or releasing the first conductive connector. When the pushbutton switch is moved away from the first conductive connector, the array speaker unit is bounced out under elastic restoring force of the pop-up mechanisms. Then the array speaker unit can be rotated to a desired position.
    Type: Application
    Filed: June 7, 2012
    Publication date: December 12, 2013
    Inventors: Chih-Wen Tseng, Che-Ming Liang, Jui-Hsiang Hsiao
  • Publication number: 20130008118
    Abstract: Wood-based flooring systems with click-type interlocking joint systems include a protective film system covering the contact surfaces of the click system. The protective film system includes one or more sheets of a material with low moisture transmissivity and a low coefficient of friction. In this way, the contact surfaces of the click system are protected against undue humidity absorption and frictional rubbing to thereby avoid squeaking after installation. In some embodiments there are four film sheets covering the entirety of all four click surfaces, in others there is one film sheet covering the entirety of all four click surfaces, in others there is film covering the entirety of only the two longitudinal click surfaces, in others there is film covering the entirety of only the two tongue click surfaces, and in others there is film covering only the contact surfaces of the click surfaces.
    Type: Application
    Filed: July 9, 2012
    Publication date: January 10, 2013
    Applicant: CHINAFLOORS HOLDING LIMITED
    Inventors: Thomas L.M. BAERT, Chih-wen TSENG