Patents by Inventor Chih-Ya TSAI

Chih-Ya TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS device, manufacturing method of the same, and integrated MEMS module using the same
    Patent number: 11939212
    Abstract: A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed on and corresponds to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a sealing layer, and at least a portion of the sealing layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the sealing layer define a chamber.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: March 26, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Heng-Chung Chang, Jhih-Jie Huang, Chih-Ya Tsai, Jing-Yuan Lin
  • INFRARED DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230366739
    Abstract: An infrared device is provided. The infrared device includes a substrate, a metal layer, a first semiconductor layer, an absorber layer, and a second semiconductor layer. The metal layer is disposed on the substrate. The first semiconductor layer is disposed on the substrate and electrically connected to the metal layer. A cavity is formed between the first semiconductor layer and the metal layer. The absorber layer is disposed on the first semiconductor layer. The second semiconductor layer is disposed on the absorber layer and electrically connected to the first semiconductor layer. The TCR of the first semiconductor layer is different from that of the second semiconductor layer.
    Type: Application
    Filed: November 24, 2022
    Publication date: November 16, 2023
    Inventors: Heng-Chung CHANG, Chih-Ya Tsai, Hui-Chi Su, Jing-Yuan Lin
  • MEMS device and manufacturing method of the same
    Patent number: 11365117
    Abstract: A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed to correspond to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a packaging layer, and at least a portion of the packaging layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the packaging layer define a chamber.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: June 21, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Heng-chung Chang, Jhih-Jie Huang, Chih-Ya Tsai, Jing-Yuan Lin
  • MEMS DEVICE, MANUFACTURING METHOD OF THE SAME, AND INTEGRATED MEMS MODULE USING THE SAME
    Publication number: 20210380404
    Abstract: A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed on and corresponds to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a sealing layer, and at least a portion of the sealing layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the sealing layer define a chamber.
    Type: Application
    Filed: August 25, 2021
    Publication date: December 9, 2021
    Inventors: Heng-Chung CHANG, Jhih-Jie HUANG, Chih-Ya TSAI, Jing-Yuan LIN
  • MEMS DEVICE AND MANUFACTURING METHOD OF THE SAME
    Publication number: 20210188626
    Abstract: A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed to correspond to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a packaging layer, and at least a portion of the packaging layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the packaging layer define a chamber.
    Type: Application
    Filed: December 23, 2019
    Publication date: June 24, 2021
    Inventors: Heng-chung CHANG, Jhih-Jie HUANG, Chih-Ya TSAI, Jing-Yuan LIN