Patents by Inventor Chih-Yang Hsu

Chih-Yang Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210217866
    Abstract: A non-volatile memory device includes a substrate. A plurality of shallow trench isolation (STI) lines are disposed on the substrate and extend along a first direction. A memory gate structure is disposed on the substrate between adjacent two of the plurality of STI lines. A trench line is disposed in the substrate and extends along a second direction intersecting the first direction, wherein the trench line also crosses top portions of the plurality of STI lines. A conductive line is disposed in the trench line and used as a selection line to be coupled to the memory gate structure.
    Type: Application
    Filed: February 18, 2020
    Publication date: July 15, 2021
    Applicant: United Microelectronics Corp.
    Inventors: Chia-Wen Wang, Chien-Hung Chen, Chia-Hui Huang, Jen Yang Hsueh, Ling Hsiu Chou, Chih-Yang Hsu
  • Publication number: 20210206662
    Abstract: A water sterilizing tube includes a shell, an outer tube, an inner tube and a UV lighting module. The shell has a first end, a second end and an annular wall. The first end is provided with a water inlet and a water outlet. The outer tube is coaxially disposed in the shell. An end of the outer tube communicates with the water outlet. An air gap is formed between the outer tube and the annular wall. The inner tube is coaxially disposed in the outer tube. An end of the inner tube communicates with the water inlet. An extended channel is formed between the outer and inner tubes. The UV lighting module has a UV light corresponding to the outer tube. An axis line of the outer and the inner tube and a direction of light emitting of the UV light are superposed with each other.
    Type: Application
    Filed: March 16, 2020
    Publication date: July 8, 2021
    Inventors: Chih-Hung WEI, Ming-Chang WU, Jian-Yang WU, Guan-Yao HUANG, Po-Ning CHANG, Wun-Ru LIAO, Chih-Yang HSU
  • Patent number: 10658799
    Abstract: A transmission cable including a signal wire and a shielding layer is provided. The signal wire is configured to transmit a differential signal provided by an eDP interface or a V-by-one interface. The shielding layer is configured to cover the signal wire. An end of the signal wire receives the differential signal provided by the eDP interface or the V-by-one interface, and another end of the signal wire outputs the differential signal provided by the eDP interface or the V-by-one interface. In addition, a display system is also provided.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: May 19, 2020
    Assignee: Innolux Corporation
    Inventors: Chih-Yang Hsu, Chien-Hung Chen, Heng-Chang Chang, Chin-Lung Ting, Cheng-Te Wang
  • Publication number: 20180241161
    Abstract: A transmission cable including a signal wire and a shielding layer is provided. The signal wire is configured to transmit a differential signal provided by an eDP interface or a V-by-one interface. The shielding layer is configured to cover the signal wire. An end of the signal wire receives the differential signal provided by the eDP interface or the V-by-one interface, and another end of the signal wire outputs the differential signal provided by the eDP interface or the V-by-one interface. In addition, a display system is also provided.
    Type: Application
    Filed: January 15, 2018
    Publication date: August 23, 2018
    Applicant: Innolux Corporation
    Inventors: Chih-Yang Hsu, Chien-Hung Chen, Heng-Chang Chang, Chin-Lung Ting, Cheng-Te Wang
  • Patent number: 9702537
    Abstract: A fluid cooled lamp includes: a heat conductive pipe has multiple heat conductive surfaces and a hollow channel; multiple illumination modules arranged at each heat conductive surface; a junction assembly for inlet and outlet of fluid including an inlet joint and an outlet joint, the inlet joint and the outlet joint are respectively communicated with both ends of the hollow channel; a flow guiding inner tube communicated with inlet joint and located in the hollow channel, multiple spray holes are disposed in the flow guiding inner tube, the fluid is sprayed from each spray hole and impacts an inner wall of the heat conductive pipe to remove heat.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: July 11, 2017
    Assignee: HIGH POWER LIGHTING CORP.
    Inventors: Chih-Hung Wei, Ming-Chang Wu, Jian-Yang Wu, Chih-Yang Hsu, Wun-Ru Liao, Yu-Ting Liu
  • Publication number: 20170049007
    Abstract: A meshed cooling structure includes a cooling mesh and a thermally conductive component. The cooling mesh includes a plurality of mesh layers. Each mesh layer includes a plurality of cooling wires which are interlaced, and each cooling wire of each mesh layer has a caliber different from one another. The thermally conductive component supports and transfers heat to the cooling mesh. The thermally conductive component includes a base and a plurality of supporting bodies spaced side by side. A supporting height is formed between one side of each supporting body and the other side opposite to the one side. The one side of each supporting body supports and in contact with the cooling mesh. The other side of each supporting body is connected to the base. Each cooling wire and each supporting body are opposite to each other obliquely.
    Type: Application
    Filed: December 29, 2015
    Publication date: February 16, 2017
    Inventors: Chih-Hung WEI, Ming-Chang WU, Jian-Yang WU, Pu WEN, Chih-Yang HSU
  • Publication number: 20160377277
    Abstract: A fluid cooled lamp includes: a heat conductive pipe has multiple heat conductive surfaces and a hollow channel; multiple illumination modules arranged at each heat conductive surface; a junction assembly for inlet and outlet of fluid including an inlet joint and an outlet joint, the inlet joint and the outlet joint are respectively communicated with both ends of the hollow channel; a flow guiding inner tube communicated with inlet joint and located in the hollow channel, multiple spray holes are disposed in the flow guiding inner tube, the fluid is sprayed from each spray hole and impacts an inner wall of the heat conductive pipe to remove heat.
    Type: Application
    Filed: March 9, 2016
    Publication date: December 29, 2016
    Inventors: Chih-Hung WEI, Ming-Chang WU, Jian-Yang WU, Chih-Yang HSU, Wun-Ru LIAO, Yu-Ting LIU
  • Patent number: 9466497
    Abstract: The invention provides a method for fabricating a silicon-oxide-nitride-oxide-silicon (SONOS) non-volatile memory cell, comprising: (S1) forming a pad oxide pattern on a silicon substrate having a recess exposing a tunnel region of the silicon substrate; (S2) forming a bottom oxide layer, a nitride layer, a top oxide layer covering the recess and the pad oxide pattern to form a first ONO structure; (S3) forming a photoresist on the first ONO structure covering the recess and a peripheral region of the pad oxide pattern; (S4) removing a part of the first ONO structure exposed by the photoresist to form an U-shaped ONO structure; (S5) trimming the photoresist to exposed a part of the U-shaped ONO structure above the recess; (S6) removing the part of the U-shaped ONO structure; (S7) removing the photoresist; (S8) removing the pad oxide pattern and the top oxide layer; and (S9) forming a gate structure.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: October 11, 2016
    Assignee: UNITED MICROELECTRONICS CORPORATION
    Inventors: Kuo-Lung Li, Ping-Chia Shih, Hsiang-Chen Lee, Yu-Chun Chang, Chia-Wen Wang, Meng-Chun Chen, Chih-Yang Hsu
  • Publication number: 20120032194
    Abstract: A lighting module with high rending property includes a substrate, a plurality of first light emitting diode (LED) chips, a plurality of second LED chips and a wavelength conversion layer. The first LED chips are deposed on the substrate and electrically connected to the substrate. The second LED chips are deposed on the substrate and electrically connected to the substrate. The wavelength conversion layer seals the first LED chips and the second LED chips. The light emitted from the LED chips and the light emitted from the wavelength conversion layer caused by an excitation by the LED chips are mixing to form warm white light with high color rending property. The number ratio of the first LED chips to the second LED chips deposed on the substrate is 2:1.
    Type: Application
    Filed: August 9, 2010
    Publication date: February 9, 2012
    Inventors: Chih-Hung WEI, Ming-Chang Wu, Chih-Yang Hsu, Ding-Yuan Jheng, Ming-Yu Hsu
  • Patent number: 8084790
    Abstract: An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the light-receiving region on the image sensing module; c) providing a second substrate, having a plurality of second contacts corresponding to the plurality of first contacts and an opening for allowing the light-receiving region to be exposed while the second substrate is placed over the image sensing module, the plurality of second contacts being disposed around the opening; d) connecting the plurality of first contacts and the plurality of second contacts; and e) disposing a transparent lid above the light-receiving region, on a side of the second substrate which is opposite to the plurality of second contacts.
    Type: Grant
    Filed: August 2, 2010
    Date of Patent: December 27, 2011
    Assignee: Tong Hsing Electronic Industries, Inc.
    Inventors: Chi-Chih Huang, Chih-Yang Hsu
  • Publication number: 20100295099
    Abstract: An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the light-receiving region on the image sensing module; c) providing a second substrate, having a plurality of second contacts corresponding to the plurality of first contacts and an opening for allowing the light-receiving region to be exposed while the second substrate is placed over the image sensing module, the plurality of second contacts being disposed around the opening; d) connecting the plurality of first contacts and the plurality of second contacts; and e) disposing a transparent lid above the light-receiving region, on a side of the second substrate which is opposite to the plurality of second contacts.
    Type: Application
    Filed: August 2, 2010
    Publication date: November 25, 2010
    Inventors: Chi-Chih HUANG, Chih-Yang Hsu
  • Patent number: 7811861
    Abstract: An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the light-receiving region on the image sensing module; c) providing a second substrate, having a plurality of second contacts corresponding to the plurality of first contacts and an opening for allowing the light-receiving region to be exposed while the second substrate is placed over the image sensing module, the plurality of second contacts being disposed around the opening; d) connecting the plurality of first contacts and the plurality of second contacts; and e) disposing a transparent lid above the light-receiving region, on a side of the second substrate which is opposite to the plurality of second contacts.
    Type: Grant
    Filed: August 1, 2008
    Date of Patent: October 12, 2010
    Assignee: Tong Hsing Electronic Industries Ltd.
    Inventors: Chi-Chih Huang, Chih-Yang Hsu
  • Patent number: 7812624
    Abstract: A testing method for a LED module and its associated elements includes the steps of: providing a LED module on which a plurality of light-emitting diodes is arranged; providing an integration detector, and mounting it above the LED module; providing an electrically conducting means having a plurality of conductive terminals and an electronic signal connector electrically connected to the conductive terminals; electrically connecting the light-emitting diodes with the conductive terminals; using the electronic signal connector to change the ON/OFF states of the electrical signals of the light-emitting diodes and the conductive terminals; and detecting the photo-electrical properties of each light-emitting diode via the integration detector.
    Type: Grant
    Filed: May 26, 2009
    Date of Patent: October 12, 2010
    Assignee: High Power Lighting Corp.
    Inventors: Chih-Hung Wei, Ming-Chang Wu, Chih-Yang Hsu, Chih-Lung Wu, Ding-Yuan Jheng
  • Publication number: 20100252852
    Abstract: An LED includes a cooling block, an LED chip, two insulating layers, two electrically conductive layers and two gold wires. According to the invention, two open trenches are arranged by opening on the cooling block; the LED chip is fixed on a surface of the cooling block; the insulating layers are plated on inner walls of the trenches; the electrically conductive layers are plated on the insulating layers and are insulated from the cooling block; the gold wires are electrically conducted to the electrically conductive layers and the LED chip; since the insulating layers are only plated on parts, where the cooling block contacts the electrically conductive layers, the other parts of the cooling block are exposed, such that the cooling area is increased and the cooling performance is promoted; in addition, the invention is further to provide a cooling block assembly constituted by these cooling blocks.
    Type: Application
    Filed: April 6, 2009
    Publication date: October 7, 2010
    Inventors: Chih-Hung WEI, Chih-Yang HSU, Ming-Chang Wu, Ming-Yu HSU, Ming-Te KU, Chih-Lung WU
  • Publication number: 20100096658
    Abstract: An improved structure of light emitting diode comprises that a copper clad laminate is made with a rectangular type slot thereon and a ring type slot on the outside boundary to enclose the rectangular type slot, while side wall of the slot form a natural guide angle with the surface of the copper clad laminate to further form an island type platform; a conductor being made between rectangular type slot and ring type slot is penetrated through the copper clad laminate and externally enclosed by the insulator thereby allowing conductor to be insulated; a light emitting diode chip is installed thereon; a fluorescent glue is optionally installed on the light emitting diode with a covering range smaller than the natural guiding angle of the rectangular type slot, wherein the copper clad laminate is installed on the printed circuit board.
    Type: Application
    Filed: October 20, 2008
    Publication date: April 22, 2010
    Inventors: Ming-Chang Wu, Chih-Yang Hsu, Ming-Yu Hsu, Chih-Hung Wei
  • Publication number: 20100025795
    Abstract: An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the light-receiving region on the image sensing module; c) providing a second substrate, having a plurality of second contacts corresponding to the plurality of first contacts and an opening for allowing the light-receiving region to be exposed while the second substrate is placed over the image sensing module, the plurality of second contacts being disposed around the opening; d) connecting the plurality of first contacts and the plurality of second contacts; and e) disposing a transparent lid above the light-receiving region, on a side of the second substrate which is opposite to the plurality of second contacts.
    Type: Application
    Filed: August 1, 2008
    Publication date: February 4, 2010
    Applicant: Impac Technology Co., Ltd.
    Inventors: Chi-Chih Huang, Chih-Yang Hsu
  • Publication number: 20090256222
    Abstract: A packaging method for an image sensing device is disclosed. The packaging method includes the steps of a) providing an annular dam on a substrate; b) mounting an image sensing module, having a light-receiving region exposed, inside the annular dam on the substrate; c) connecting the image sensing module and the substrate via a plurality of bonding wires; d) forming a barrier around the light-receiving region on the image sensing module; e) filling an adhesive between the barrier and the annular dam with the plurality of bonding wires being encapsulated; f) forming a transparent lid above the light-receiving region; and g) cutting off the annular dam.
    Type: Application
    Filed: April 14, 2008
    Publication date: October 15, 2009
    Applicant: Impac Technology Co., Ltd.
    Inventor: Chih-Yang Hsu
  • Publication number: 20090224344
    Abstract: A packaging method for an image sensing device is disclosed. The packaging method includes the steps of a) providing a wafer having at least an image sensing module with a light-receiving region exposed; b) forming a barrier around the light-receiving region on the image sensing module; c) dicing the wafer for forming an individual device with the image sensing module; and d) forming a transparent lid supported by the barrier above the light-receiving region of the image sensing module.
    Type: Application
    Filed: March 7, 2008
    Publication date: September 10, 2009
    Applicant: Impac Technology Co., Ltd.
    Inventors: Chi-Chih Huang, Chih-Yang Hsu
  • Publication number: 20090215216
    Abstract: A packaging method for an image sensing device is disclosed. The packaging method includes the steps of a) mounting an image sensing module, having a light-receiving region exposed, on a substrate; b) connecting the image sensing module and the substrate via a plurality of bonding wires; c) forming a protecting layer on the light-receiving region of the image sensing module; d) forming a molding layer to seal the plurality of bonding wires; e) flattening the protecting layer and the molding layer; f) removing the protecting layer to expose the light-receiving region of the image sensing module; and g) forming a transparent lid.
    Type: Application
    Filed: February 21, 2008
    Publication date: August 27, 2009
    Applicant: Impac Technology Co., Ltd.
    Inventors: Chi-Chih Huang, Chih-Yang Hsu
  • Publication number: 20080158642
    Abstract: An exemplary LCD device (2) includes a first substrate (210), a second substrate (220) arranged parallel to the first substrate, a liquid crystal layer (230) interposed between the first and second substrates, and an electrochromic layer (250) with adjustable transmittance and reflectivity. The electrochromic layer is arranged at one surface of the second substrate. The transmittance and reflectivity are adjusted according to environmental brightness.
    Type: Application
    Filed: December 27, 2007
    Publication date: July 3, 2008
    Inventor: Chih-Yang Hsu