Abstract: An antenna structure includes an antenna and a metal member located between the antenna and an electronic member. The antenna is configured for receiving and sending wireless signals. An electrical length of the metal member is greater than or equal to a quarter wavelength of a resonance frequency band of the antenna. The metal member transmits wireless signals generated by the electronic member to ground to prevent signals generated by the electronic member from interfering with the antenna.

Abstract: A wireless communication device includes a first antenna, a second antenna, a first light sensor adjacent to the first antenna, a second light sensor adjacent to the second antenna, a controller, and a magnetic member movably located between the first antenna and the second antenna. When one of the first and second antennas in a state of receiving/transmitting wireless signals is covered by a user's hand, the nearby light sensor sends a pulse signal to the controller. The controller receiving the pulse signal controls the first and second antennas to change their magnetic polarity, enabling the magnetic member to be separated from one of the first and second antennas and attached to the another one, thereby choosing one of the first and second antennas, or a combination of one of the two antennas and the magnetic member to receive/transmit the wireless signals.

Abstract: An antenna assembly includes a carrier, a metal sheet, and an antenna. The metal sheet is attached to the carrier and defining at least one notch. The antenna is connected to the metal sheet and includes a radio body for receiving and transmitting wireless signals. The radio body is positioned above the metal sheet. The length of current path in a peripheral wall of the at least one notch is in a predetermined proportion to the wavelength of the wireless signals, enabling the metal sheet to resonate with the radio body to increase the bandwidth of the antenna.

Abstract: An antenna module includes an antenna, a connecting member attached to the antenna, a sliding board configured for sliding relative to connecting member, and a radiation member attached to the sliding board. When the sliding board is slid by a user, the radiation member makes contact with or separates from the connecting member, enabling one antenna module to receive and transmit wireless signals of different wavelengths.

Abstract: An exemplary wireless communication device includes a circuit board, a metal end portion, an antenna, and a connecting member. The antenna is positioned on the circuit board. The connecting member interconnects the circuit board and the end portion. The connecting member serves as a feeding point of the antenna. The end portion is a portion of a housing of the wireless communication device and further serves as a radiating portion of the antenna.

Abstract: One or more antennas within an earphone arrangement used in an electronic device includes a plurality of coaxial cables, a first antenna unit, a second antenna unit, and a third antenna unit. The coaxial cables carry radio frequency (RF) signals of different frequency bands. The first antenna unit, the second antenna unit, and the third antenna unit each include a radiating member. Each radiating member can receive and transmit RF signals of at least one frequency band, and the coaxial cables carry the RF signals to the device for processing.

Abstract: An analysis method for a semiconductor device is described. The semiconductor device having an abnormal region is provided. Thereafter, a focused ion beam microscope analysis process is performed to the abnormal region, wherein the result of the focused ion beam microscope analysis process shows that the abnormal region has a defect therein. After the focused ion beam microscope analysis process, an electrical property measurement step is performed to the abnormal region, so as to determine whether the defect in the abnormal region is a device failure root cause or not.

Abstract: An analysis method for a semiconductor device is described. The semiconductor device having an abnormal region is provided. Thereafter, a focused ion beam microscope analysis process is performed to the abnormal region, wherein the result of the focused ion beam microscope analysis process shows that the abnormal region has a defect therein. After the focused ion beam microscope analysis process, an electrical property measurement step is performed to the abnormal region, so as to determine whether the defect in the abnormal region is a device failure root cause or not.