Abstract: A heterogeneous integration semiconductor package structure including a heat dissipation assembly, multiple chips, a package assembly, multiple connectors and a circuit substrate is provided. The heat dissipation assembly has a connection surface and includes a two-phase flow heat dissipation device and a first redistribution structure layer embedded in the connection surface. The chips are disposed on the connection surface of the heat dissipation assembly and electrically connected to the first redistribution structure layer. The package assembly surrounds the chips and includes a second redistribution structure layer disposed on a lower surface and multiple conductive vias electrically connected to the first redistribution structure layer and the second redistribution structure layer. The connectors are disposed on the package assembly and electrically connected to the second redistribution structure layer.

Abstract: A transflective pixel structure including a reflective region and a transmittance region is provided. The pixel structure includes an active device, a covering layer, a reflective electrode layer, a reflective electrode pattern and a transparent electrode layer. The covering layer is disposed in the reflective region and the transmittance region and covers the active device, where the covering layer has a contact opening at least disposed in the transmittance region. The reflective electrode layer is disposed in the reflective region. The reflective electrode pattern is disposed within the contact opening and extends onto a top surface of the covering layer surrounding the contact opening. The transparent electrode layer is disposed on a surface of the covering layer in the transmittance region. The transparent electrode layer is electrically connected to the reflective electrode layer and the transparent electrode layer is electrically connected to the active device through the contact opening.

Abstract: An active device array mother substrate including a substrate, pixel arrays, and a polymer-stabilized alignment curing circuit is provided. The substrate has panel regions, a circuit region, a first cutting line, and a second cutting line. The first cutting line is disposed on the circuit region between an edge of the substrate and the second cutting line. The active devices of the pixel arrays have a semiconductor layer. The polymer-stabilized alignment curing circuit disposed on the circuit region includes curing pads disposed between the edge of the substrate and the first cutting line and curing lines having an upper conductive layer connected to the corresponding curing pads and the corresponding pixel array. The upper conductive layer is in the same layer as the source/drain conductor. Therefore, the curing lines are capable of preventing problems such as peeling, so as to keep the polymer-stabilized alignment curing circuit operating normally.

Abstract: A transflective pixel structure including a reflective region and a transmittance region is provided. The pixel structure includes an active device, a covering layer, a reflective electrode layer, a reflective electrode pattern and a transparent electrode layer. The covering layer is disposed in the reflective region and the transmittance region and covers the active device, where the covering layer has a contact opening at least disposed in the transmittance region. The reflective electrode layer is disposed in the reflective region. The reflective electrode pattern is disposed within the contact opening and extends onto a top surface of the covering layer surrounding the contact opening. The transparent electrode layer is disposed on a surface of the covering layer in the transmittance region. The transparent electrode layer is electrically connected to the reflective electrode layer and the transparent electrode layer is electrically connected to the active device through the contact opening.

Abstract: An active device array mother substrate including a substrate, pixel arrays, and a polymer-stabilized alignment curing circuit is provided. The substrate has panel regions, a circuit region, a first cutting line, and a second cutting line. The first cutting line is disposed on the circuit region between an edge of the substrate and the second cutting line. The active devices of the pixel arrays have a semiconductor layer. The polymer-stabilized alignment curing circuit disposed on the circuit region includes curing pads disposed between the edge of the substrate and the first cutting line and curing lines having an upper conductive layer connected to the corresponding curing pads and the corresponding pixel array. The upper conductive layer is in the same layer as the source/drain conductor. Therefore, the curing lines are capable of preventing problems such as peeling, so as to keep the polymer-stabilized alignment curing circuit operating normally.