Abstract: A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets and a metal mesh. According to the method, the two titanium metal sheets and the metal mesh are subjected to a surface treatment, so that surface of any one of the titanium metal sheets and the metal mesh is modified to form a hydrophilic layer. With these arrangements, the titanium metal material can be freely plastically deformed and possess a capillary force, and the titanium metal sheet can therefore be used in place of the conventional copper sheet to serve as a material for making heat dissipation devices. The heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

Abstract: A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

Abstract: A manufacturing method of heat dissipation unit is disclosed. The heat dissipation unit is mainly composed of two titanium metal plate bodies. The titanium metal plate bodies are heat-treated, whereby the titanium metal plate bodies can be mechanical processed, shaped and surface-modified. Accordingly, the titanium metal can be freely shaped and provide capillary attraction. In this case, the titanium metal plate bodies can be used as the material of the heat dissipation unit instead of the conventional copper plate bodies to greatly reduce the weight and enhance the heat dissipation performance.

Abstract: A jig structure for manufacturing heat dissipation unit includes a main body, which internally defines a chamber and has a top forming an upper side thereof. The top defines at least one opening, on which at least one silicon dioxide layer is provided. The chamber is in a vacuum-tight state or maintains a positive pressure inert gas atmosphere therein. The jig structure for manufacturing heat dissipation unit can be used with a laser machining tool to provide a better environment and increased flexibility for laser machining or laser welding in manufacturing a heat dissipation unit.

Abstract: A heat dissipation component is disclosed. The heat dissipation component has a main body. The main body has a first metal plate body and a second metal plate body. The first and second metal plate bodies together define a chamber. A capillary structure layer is disposed in the chamber and a working fluid is filled in the chamber. An outer periphery of the chamber of the main body has a flange section. The flange section has a sintered welding section. The sintered welding section is perpendicularly connected with the first and second metal plate bodies. Such that, the connection and sealing of the welded first and second metal plate bodies can be enhanced.

Abstract: A heat dissipation device includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

Abstract: A jig structure for manufacturing heat dissipation unit includes a main body, which internally defines a chamber and has a top forming an upper side thereof. The top defines at least one opening, on which at least one silicon dioxide layer is provided. The chamber is in a vacuum-tight state or maintains a positive pressure inert gas atmosphere therein. The jig structure for manufacturing heat dissipation unit can be used with a laser machining tool to provide a better environment and increased flexibility for laser machining or laser welding in manufacturing a heat dissipation unit.

Abstract: A heat dissipation unit manufacturing method is disclosed. The heat dissipation unit has a main body formed of a first and a second metal plate member, which together define a sealed chamber between them. The chamber has a wick structure and a working fluid provided therein, and a lip portion formed along an outer peripheral edge thereof. The lip portion includes a sinter-welded section perpendicularly connects the first metal plate member to the second metal plate member. In the heat dissipation unit manufacturing method, the first and the second metal plate member are joined along their peripheral edges by lap joint laser welding, in which a laser beam directly perpendicularly passes through the first metal plate member into one third to two thirds of a thickness of the second metal plate member, so that the two metal plate members are more firmly joined to create upgraded vacuum-tightness between them.

Abstract: A heat dissipation component manufacturing method is disclosed. The heat dissipation component has a main body. The main body has a first metal plate body and a second metal plate body. The first and second metal plate bodies together define a chamber. A capillary structure layer is disposed in the chamber and a working fluid is filled in the chamber. An outer periphery of the chamber of the main body has a flange section. The flange section has a sintered welding section. The sintered welding section is perpendicularly connected with the first and second metal plate bodies. The heat dissipation component manufacturing method employs fillet welding to directly perpendicularly weld and connect the first and second metal plate bodies so as to enhance the connection and sealing of the welded first and second metal plate bodies.

Abstract: A heat dissipation component is disclosed. The heat dissipation component has a main body. The main body has a first metal plate body and a second metal plate body. The first and second metal plate bodies together define a chamber. A capillary structure layer is disposed in the chamber and a working fluid is filled in the chamber. An outer periphery of the chamber of the main body has a flange section. The flange section has a sintered welding section. The sintered welding section is perpendicularly connected with the first and second metal plate bodies. Such that, the connection and sealing of the welded first and second metal plate bodies can be enhanced.

Abstract: A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

Abstract: A heat dissipation device includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

Abstract: A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

Abstract: A heat dissipation device includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

Abstract: A manufacturing method of heat dissipation unit is disclosed. The heat dissipation unit is mainly composed of two titanium metal plate bodies. The titanium metal plate bodies are heat-treated, whereby the titanium metal plate bodies can be mechanical processed, shaped and surface-modified. Accordingly, the titanium metal can be freely shaped and provide capillary attraction. In this case, the titanium metal plate bodies can be used as the material of the heat dissipation unit instead of the conventional copper plate bodies to greatly reduce the weight and enhance the heat dissipation performance.

Abstract: A manufacturing method of heat dissipation unit is disclosed. The heat dissipation unit is mainly composed of two titanium metal plate bodies. The titanium metal plate bodies are heat-treated, whereby the titanium metal plate bodies can be mechanical processed, shaped and surface-modified. Accordingly, the titanium metal can be freely shaped and provide capillary attraction. In this case, the titanium metal plate bodies can be used as the material of the heat dissipation unit instead of the conventional copper plate bodies to greatly reduce the weight and enhance the heat dissipation performance.

Abstract: A support structure for heat dissipation unit includes at least one main body and an oxide coating. Multiple grooves are formed on an outer circumference of the main body. The oxide coating is coated on the outer circumference of the main body and the surfaces of the grooves. The sintered powder body can be replaced with the support structure with the directional oxide coating coated on the outer circumference of the main body and the surfaces of the grooves to greatly speed the vapor-liquid circulation of the working fluid in the chamber of the heat dissipation unit so as to enhance the heat dissipation performance.

Abstract: A heat dissipation structure applied to mobile device includes a heat conduction main body. The heat conduction main body has a heat dissipation side and a heat absorption side. A radiation heat dissipation layer is formed on the heat dissipation side. The heat dissipation structure is disposed in the mobile device to provide a very good heat dissipation effect for the closed space of the mobile device by way of natural convection and radiation. Therefore, the heat dissipation performance of the entire mobile device is greatly enhanced.

Abstract: A heat dissipation structure enhancing heat source self heat radiation includes a heat source and a heat radiation layer formed on at least one side of an exterior of the heat source. With the heat dissipation structure, the heat source can have largely increased self heat radiation efficiency, enabling heat emitted by the heat source to be quickly dissipated into ambient environment to avoid heat accumulation on the heat source.

Abstract: A heat dissipation structure for semiconductor element includes a semiconductor element and a covering. The covering has a first side and an opposite second side and is formed on the second side with a heat radiation layer. The covering is externally covered on one side of the semiconductor element with the first side of the covering attached to the covered side of the semiconductor. By attaching the covering to one side of the semiconductor element, heat emitted by the semiconductor element during operation can be more quickly absorbed by the covering and radiated from the heat radiation layer into ambient environment to avoid heat accumulation on the semiconductor element.