Abstract: A method for forming a semiconductor package is provided. The method includes forming a first photonic routing structure over a substrate, disposing the first photonic routing structure over a redistribution structure, disposing a second photonic routing structure and an optical engine die on the redistribution structure and forming a molding structure between and separating the first photonic routing structure and the second photonic routing structure.

Abstract: A method for fabricating a semiconductor device is provided. The method includes coating a photoresist film over a target layer over a semiconductor substrate; performing a lithography process to pattern the photoresist film into a photoresist layer; performing a directional ion bombardment process to the photoresist layer along a direction tilted with respect to a normal direction of the semiconductor substrate, such that a carbon atomic concentration in the photoresist layer is increased; and etching the target layer using the photoresist layer as an etch mask.

Abstract: The current disclosure includes a plasma etching system that includes a movable plasma source and a moveable wafer stage. A relative position between the movable plasma source and the movable wafer stage can be varied to set up an angle along which plasma particles of the plasma hits a wafer positioned on the wafer stage.

Abstract: A semiconductor device structure, along with methods of forming such, are described. The structure includes a substrate having one or more devices formed thereon, one or more bonding pads disposed over the substrate, and a first passivation layer disposed over the one or more bonding pads. The first passivation layer includes a first passivation sublayer having a first dielectric material, a second passivation sublayer disposed over the first passivation sublayer, and the second passivation sublayer has a second dielectric material different from the first dielectric material. The first passivation layer further includes a third passivation sublayer disposed over the second passivation sublayer, and the third passivation sublayer has a third dielectric material different from the second dielectric material. At least two of the first, second, and third passivation sublayers each includes a nitride.

Abstract: A semiconductor package includes a substrate, a semiconductor device over the substrate and a plurality of solder joint structures bonded between the semiconductor device and the substrate, wherein each of the plurality of solder joint structures includes, by weight percent, 2% to 23% of Indium (In).

Abstract: Negative capacitance field-effect transistor (NCFET) and ferroelectric field-effect transistor (FE-FET) devices and methods of forming are provided. The gate dielectric stack includes a ferroelectric gate dielectric layer. An amorphous high-k dielectric layer and a dopant-source layer are deposited sequentially followed by a post-deposition anneal (PDA). The PDA converts the amorphous high-k layer to a polycrystalline high-k film with crystalline grains stabilized by the dopants in a crystal phase in which the high-k dielectric is a ferroelectric high-k dielectric. After the PDA, the remnant dopant-source layer may be removed. A gate electrode is formed over remnant dopant-source layer (if present) and the polycrystalline high-k film.

Abstract: Examples described herein relate to a security management system to secure a container ecosystem. In some examples, the security management system may protect one or more entities such as container management applications, container images, containers, and/or executable applications within the containers. The security management system may make use of digital cryptography to generate digital signatures corresponding to one or more of these entities and verify them during the execution so that any compromised entities can be blocked from execution and the container ecosystem may be safeguarded from any malicious network attacks.

Abstract: Examples described herein relate to a security management system to secure a container ecosystem. In some examples, the security management system may protect one or more entities such as container management applications, container images, containers, and/or executable applications within the containers. The security management system may make use of digital cryptography to generate digital signatures corresponding to one or more of these entities and verify them during the execution so that any compromised entities can be blocked from execution and the container ecosystem may be safeguarded from any malicious network attacks.

Abstract: A semiconductor package includes a substrate, a semiconductor device over the substrate and a plurality of solder joint structures bonded between the semiconductor device and the substrate, wherein each of the plurality of solder joint structures includes, by weight percent, 2% to 23% of Indium (In).

Abstract: The current disclosure includes a plasma etching system that includes a movable plasma source and a moveable wafer stage. A relative position between the movable plasma source and the movable wafer stage can be varied to set up an angle along which plasma particles of the plasma hits a wafer positioned on the wafer stage.

Abstract: A display may include an array of pixels. Each pixel in the array includes an organic light-emitting diode coupled to associated semiconducting oxide transistors. The semiconducting oxide transistors may exhibit different device characteristics. Some of the semiconducting oxide transistors may be formed using a first oxide layer formed from a first semiconducting oxide material using first processing steps, whereas other semiconducting oxide transistors are formed using a second oxide layer formed from a second semiconducting oxide material using second processing steps different than the first processing steps. The display may include three or more different semiconducting oxide layers formed during different processing steps.

Abstract: A semiconductor device structure, along with methods of forming such, are described. The structure includes a substrate having one or more devices formed thereon, one or more bonding pads disposed over the substrate, and a first passivation layer disposed over the one or more bonding pads. The first passivation layer includes a first passivation sublayer having a first dielectric material, a second passivation sublayer disposed over the first passivation sublayer, and the second passivation sublayer has a second dielectric material different from the first dielectric material. The first passivation layer further includes a third passivation sublayer disposed over the second passivation sublayer, and the third passivation sublayer has a third dielectric material different from the second dielectric material. At least two of the first, second, and third passivation sublayers each includes a nitride.

Abstract: A semiconductor device includes a substrate; a memory array over the substrate, the memory array including first magnetic tunnel junctions (MTJs), where the first MTJs are in a first dielectric layer over the substrate; and a resistor circuit over the substrate, the resistor circuit including second MTJs, where the second MTJs are in the first dielectric layer.

Abstract: An item positioning system is provided. The item positioning system comprises a plurality of tag readers and a control device. The plurality of tag readers generate access signals respectively and receive a response signal from a target tag. The control device adjusts transmitting power of the access signals of the tag readers, and determines a position of the target item according to whether the tag readers receive the response signal.

Abstract: A chip testing apparatus and a chip testing method are provided. The chip testing apparatus includes a command generating module, a transceiving module and a control module. When the command generating module generates a first test command, the transceiving module transmits the first test command to a radio frequency identification (RFID) chip and receives a target test result from the RFID chip. The control module determines whether the target test result complies with a reference test result. When the determination result of the control module is no, the control module controls the command generating module to generate a second test command for retesting the RFID chip.

Abstract: A method and apparatus for loading and executing program code at a micro-processor are disclosed. In this method, a monitoring procedure is performed to monitor whether the micro-processor receives a loading request corresponding to a target program code. If the loading request is received, the target program code is loaded from an external memory into an internal memory of the micro-processor. The micro-processor is then rebooted to enter a first mode in which the target program code in the internal memory is to be executed.

Abstract: A circuit device capable of automatic transmission interface selection and associated method are provided. The circuit device includes a first interface port, a second interface port, a first interface driver module, a second interface driver module, and a buffer module. A first interface driver module receives a first interrupt packet, converts the first interrupt packet into a first command packet, and stores the first command packet into the buffer module. A second interface driver module receives a second interrupt packet, converts the second interrupt packet into a second command packet, and stores the second command package into the buffer module. The format of the first interrupt packet is different from that of the second interrupt packet, while the first and the second command packets comply with a common format.

Abstract: A monitoring apparatus and the associated method are provided. The monitoring apparatus includes a tag reading module and a control module. The tag reading module accesses a target tag attached to a target object to generate an access signal. The control module is coupled to the tag reading module and receives the access signal. When the control module operates in an alert mode, the control module selectively generates a control signal according to a reading condition of the access signal.

Abstract: A circuit device capable of automatic transmission interface selection and associated method are provided. The circuit device includes a first interface port, a second interface port, a first interface driver module, a second interface driver module, and a buffer module. A first interface driver module receives a first interrupt packet, converts the first interrupt packet into a first command packet, and stores the first command packet into the buffer module. A second interface driver module receives a second interrupt packet, converts the second interrupt packet into a second command packet, and stores the second command package into the buffer module. The format of the first interrupt packet is different from that of the second interrupt packet, while the first and the second command packets comply with a common format.

Abstract: An item positioning system is provided. The item positioning system comprises a plurality of tag readers and a control device. The plurality of tag readers generate access signals respectively and receive a response signal from a target tag. The control device adjusts transmitting power of the access signals of the tag readers, and determines a position of the target item according to whether the tag readers receive the response signal.