Abstract: Examples described herein relate to a security management system to secure a container ecosystem. In some examples, the security management system may protect one or more entities such as container management applications, container images, containers, and/or executable applications within the containers. The security management system may make use of digital cryptography to generate digital signatures corresponding to one or more of these entities and verify them during the execution so that any compromised entities can be blocked from execution and the container ecosystem may be safeguarded from any malicious network attacks.

Abstract: A display may include an array of pixels such as light-emitting diode pixels. The pixels may include multiple circuitry decks that each include one or more circuit components such as transistors, capacitors, and/or resistors. The circuitry decks may be vertically stacked. Each circuitry deck may include a planarization layer formed from a siloxane material that conforms to underlying components and provides a planar upper surface. In this way, circuitry components may be vertically stacked to mitigate the size of each pixel footprint. The circuitry components may include capacitors that include both a high-k dielectric layer and a low-k dielectric layer. The display pixel may include a via with a width of less than 1 micron.

Abstract: A method includes: positioning a wafer on an electrostatic chuck of a physical vapor deposition apparatus, the wafer including an opening exposing a conductive feature; setting a temperature of the wafer to a room temperature; forming a tungsten thin film in the opening by the physical vapor deposition apparatus, the tungsten thin film including a bottom portion that is on an upper surface of the conductive feature exposed by the opening, a top portion that is on an upper surface of a dielectric layer through which the opening extends and a sidewall portion that is on a sidewall of the dielectric layer exposed by the opening; removing the top portion and the sidewall portion of the tungsten thin film from over the opening; and forming a tungsten plug in the opening on the bottom portion by selectively depositing tungsten by a chemical vapor deposition operation.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes a fin active region formed on a semiconductor substrate and spanning between a first sidewall of a first shallow trench isolation (STI) feature and a second sidewall of a second STI feature; an anti-punch through (APT) feature of a first type conductivity; and a channel material layer of the first type conductivity, disposed on the APT feature and having a second doping concentration less than the first doping concentration. The APT feature is formed on the fin active region, spans between the first sidewall and the second sidewall, and has a first doping concentration.

Abstract: A semiconductor device includes a first channel region disposed over a substrate, and a first gate structure disposed over the first channel region. The first gate structure includes a gate dielectric layer disposed over the channel region, a lower conductive gate layer disposed over the gate dielectric layer, a ferroelectric material layer disposed over the lower conductive gate layer, and an upper conductive gate layer disposed over the ferroelectric material layer. The ferroelectric material layer is in direct contact with the gate dielectric layer and the lower gate conductive layer, and has a U-shape cross section.

Abstract: An item positioning system is provided. The item positioning system comprises a plurality of tag readers and a control device. The plurality of tag readers generate access signals respectively and receive a response signal from a target tag. The control device adjusts transmitting power of the access signals of the tag readers, and determines a position of the target item according to whether the tag readers receive the response signal.

Abstract: A chip testing apparatus and a chip testing method are provided. The chip testing apparatus includes a command generating module, a transceiving module and a control module. When the command generating module generates a first test command, the transceiving module transmits the first test command to a radio frequency identification (RFID) chip and receives a target test result from the RFID chip. The control module determines whether the target test result complies with a reference test result. When the determination result of the control module is no, the control module controls the command generating module to generate a second test command for retesting the RFID chip.

Abstract: A method and apparatus for loading and executing program code at a micro-processor are disclosed. In this method, a monitoring procedure is performed to monitor whether the micro-processor receives a loading request corresponding to a target program code. If the loading request is received, the target program code is loaded from an external memory into an internal memory of the micro-processor. The micro-processor is then rebooted to enter a first mode in which the target program code in the internal memory is to be executed.

Abstract: A circuit device capable of automatic transmission interface selection and associated method are provided. The circuit device includes a first interface port, a second interface port, a first interface driver module, a second interface driver module, and a buffer module. A first interface driver module receives a first interrupt packet, converts the first interrupt packet into a first command packet, and stores the first command packet into the buffer module. A second interface driver module receives a second interrupt packet, converts the second interrupt packet into a second command packet, and stores the second command package into the buffer module. The format of the first interrupt packet is different from that of the second interrupt packet, while the first and the second command packets comply with a common format.

Abstract: A monitoring apparatus and the associated method are provided. The monitoring apparatus includes a tag reading module and a control module. The tag reading module accesses a target tag attached to a target object to generate an access signal. The control module is coupled to the tag reading module and receives the access signal. When the control module operates in an alert mode, the control module selectively generates a control signal according to a reading condition of the access signal.

Abstract: A circuit device capable of automatic transmission interface selection and associated method are provided. The circuit device includes a first interface port, a second interface port, a first interface driver module, a second interface driver module, and a buffer module. A first interface driver module receives a first interrupt packet, converts the first interrupt packet into a first command packet, and stores the first command packet into the buffer module. A second interface driver module receives a second interrupt packet, converts the second interrupt packet into a second command packet, and stores the second command package into the buffer module. The format of the first interrupt packet is different from that of the second interrupt packet, while the first and the second command packets comply with a common format.

Abstract: An item positioning system is provided. The item positioning system comprises a plurality of tag readers and a control device. The plurality of tag readers generate access signals respectively and receive a response signal from a target tag. The control device adjusts transmitting power of the access signals of the tag readers, and determines a position of the target item according to whether the tag readers receive the response signal.

Abstract: A chip testing apparatus and a chip testing method are provided. The chip testing apparatus includes a command generating module, a transceiving module and a control module. When the command generating module generates a first test command, the transceiving module transmits the first test command to a radio frequency identification (RFID) chip and receives a target test result from the RFID chip. The control module determines whether the target test result complies with a reference test result. When the determination result of the control module is no, the control module controls the command generating module to generate a second test command for retesting the RFID chip.

Abstract: A method and apparatus for loading and executing program code at a micro-processor are disclosed. In this method, a monitoring procedure is performed to monitor whether the micro-processor receives a loading request corresponding to a target program code. If the loading request is received, the target program code is loaded from an external memory into an internal memory of the micro-processor. The micro-processor is then rebooted to enter a first mode in which the target program code in the internal memory is to be executed.