Abstract: A package structure is provided. The package structure includes a semiconductor die and a thermoelectric structure disposed on the semiconductor die. The thermoelectric structure includes P-type semiconductor blocks, N-type semiconductor blocks and metal pads. The P-type semiconductor blocks and the N-type semiconductor blocks are arranged in alternation with the metal pads connecting the P-type semiconductor blocks and the N-type semiconductor blocks. When a current flowing through one of the N-type semiconductor block, one of the metal pad, and one of the P-type semiconductor block in order, the metal pad between the N-type semiconductor block and the P-type semiconductor block forms a cold junction which absorbs heat generated by the semiconductor die.

Abstract: A semiconductor device includes a substrate; a memory array over the substrate, the memory array including first magnetic tunnel junctions (MTJs), where the first MTJs are in a first dielectric layer over the substrate; and a resistor circuit over the substrate, the resistor circuit including second MTJs, where the second MTJs are in the first dielectric layer.

Abstract: A lighting device includes a light board and a light dimmer circuit. The light board includes multiple first light emitting elements and second light emitting elements. The first light emitting elements are disposed in a first area of the light board. The second light emitting elements are disposed in a second area of the light board. The light dimmer circuit is configured to drive the second light emitting elements to generate flickering lights from the second area of the light board, and is configured to drive the first light emitting elements to generate non-flickering lights from the first area of the light board.

Abstract: A training device includes a force receiving component, a location detector, a resistance generator, and a controller. The force receiving component moves along a closed trajectory. The location detector is configured to detect a location of the force receiving component in the closed trajectory and to output a location signal. The resistance generator is configured to exert a resistance on the force receiving component. The controller controls the resistance generator to adjust the resistance based on the location signal.

Abstract: A backlight module includes a light source, a first prism sheet disposed on the light source, and a light type adjustment sheet disposed on a side of the first prism sheet away from the light source and including a base and multiple light type adjustment structures. The multiple light type adjustment structures are disposed on the first surface of the base. Each light type adjustment structure has a first structure surface and a second structure surface connected to each other. The first structure surface of each light type adjustment structure and the first surface of the base form a first base angle therebetween, and the second structure surface of each light type adjustment structure and the first surface of the base form a second base angle therebetween. The angle of the first base angle is different from the angle of the second base angle.

Abstract: A semiconductor structure and manufacturing method thereof are provided. The semiconductor structure includes a substrate and a metallization structure over the substrate. The metallization structure includes a MIM structure, a first contact and a second contact. The MIM structure includes a bottom electrode layer, a dielectric layer on the bottom electrode layer, a ferroelectric layer on the dielectric layer, and a top electrode layer on the ferroelectric layer. The ferroelectric layer is substantially made of lead zirconate titanate (PZT), BaTiO3 (BTO), or barium strontium titanate (BST), and a thickness of the ferroelectric layer is greater than a thickness of the dielectric layer.

Abstract: Examples described herein relate to a security management system to secure a container ecosystem. In some examples, the security management system may protect one or more entities such as container management applications, container images, containers, and/or executable applications within the containers. The security management system may make use of digital cryptography to generate digital signatures corresponding to one or more of these entities and verify them during the execution so that any compromised entities can be blocked from execution and the container ecosystem may be safeguarded from any malicious network attacks.

Abstract: Examples described herein relate to a security management system to secure a container ecosystem. In some examples, the security management system may protect one or more entities such as container management applications, container images, containers, and/or executable applications within the containers. The security management system may make use of digital cryptography to generate digital signatures corresponding to one or more of these entities and verify them during the execution so that any compromised entities can be blocked from execution and the container ecosystem may be safeguarded from any malicious network attacks.

Abstract: A semiconductor structure includes a first tier, a redistribution circuit structure, and a second tier. The first tier includes at least one first die. The redistribution circuit structure is disposed on the first tier and electrically coupled to the at least one first die, where the redistribution circuit structure has a multi-layer structure and includes a vertical connection structure continuously extending from a first side of the redistribution circuit structure to a second side of the redistribution circuit structure, and the first side is opposite to the second side along a stacking direction of the first tier and the redistribution circuit structure. The second tier includes a plurality of second dies, and is disposed on and electrically coupled to the redistribution circuit structure.

Abstract: The present disclosure provides a semiconductor device and a method for forming a semiconductor device. The semiconductor device includes a substrate, and a first gate dielectric stack over the substrate, wherein the first gate dielectric stack includes a first ferroelectric layer, and a first dielectric layer coupled to the first ferroelectric layer, wherein the first ferroelectric layer includes a first portion made of a ferroelectric material in orthorhombic phase, a second portion made of the ferroelectric material in monoclinic phase, and a third portion made of the ferroelectric material in tetragonal phase, wherein a total volume of the second portion is greater than a total volume of the first portion, and the total volume of the first portion is greater than a total volume of the third portion.

Abstract: Examples described herein relate to a security management system to secure a container ecosystem. In some examples, the security management system may protect one or more entities such as container management applications, container images, containers, and/or executable applications within the containers. The security management system may make use of digital cryptography to generate digital signatures corresponding to one or more of these entities and verify them during the execution so that any compromised entities can be blocked from execution and the container ecosystem may be safeguarded from any malicious network attacks.

Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.

Abstract: A package structure is provided. The package structure includes a semiconductor die and a thermoelectric structure disposed on the semiconductor die. The thermoelectric structure includes P-type semiconductor blocks, N-type semiconductor blocks and metal pads. The P-type semiconductor blocks and the N-type semiconductor blocks are arranged in alternation with the metal pads connecting the P-type semiconductor blocks and the N-type semiconductor blocks. When a current flowing through one of the N-type semiconductor block, one of the metal pad, and one of the P-type semiconductor block in order, the metal pad between the N-type semiconductor block and the P-type semiconductor block forms a cold junction which absorbs heat generated by the semiconductor die.

Abstract: An item positioning system is provided. The item positioning system comprises a plurality of tag readers and a control device. The plurality of tag readers generate access signals respectively and receive a response signal from a target tag. The control device adjusts transmitting power of the access signals of the tag readers, and determines a position of the target item according to whether the tag readers receive the response signal.

Abstract: A chip testing apparatus and a chip testing method are provided. The chip testing apparatus includes a command generating module, a transceiving module and a control module. When the command generating module generates a first test command, the transceiving module transmits the first test command to a radio frequency identification (RFID) chip and receives a target test result from the RFID chip. The control module determines whether the target test result complies with a reference test result. When the determination result of the control module is no, the control module controls the command generating module to generate a second test command for retesting the RFID chip.

Abstract: A method and apparatus for loading and executing program code at a micro-processor are disclosed. In this method, a monitoring procedure is performed to monitor whether the micro-processor receives a loading request corresponding to a target program code. If the loading request is received, the target program code is loaded from an external memory into an internal memory of the micro-processor. The micro-processor is then rebooted to enter a first mode in which the target program code in the internal memory is to be executed.

Abstract: A circuit device capable of automatic transmission interface selection and associated method are provided. The circuit device includes a first interface port, a second interface port, a first interface driver module, a second interface driver module, and a buffer module. A first interface driver module receives a first interrupt packet, converts the first interrupt packet into a first command packet, and stores the first command packet into the buffer module. A second interface driver module receives a second interrupt packet, converts the second interrupt packet into a second command packet, and stores the second command package into the buffer module. The format of the first interrupt packet is different from that of the second interrupt packet, while the first and the second command packets comply with a common format.

Abstract: A monitoring apparatus and the associated method are provided. The monitoring apparatus includes a tag reading module and a control module. The tag reading module accesses a target tag attached to a target object to generate an access signal. The control module is coupled to the tag reading module and receives the access signal. When the control module operates in an alert mode, the control module selectively generates a control signal according to a reading condition of the access signal.

Abstract: A circuit device capable of automatic transmission interface selection and associated method are provided. The circuit device includes a first interface port, a second interface port, a first interface driver module, a second interface driver module, and a buffer module. A first interface driver module receives a first interrupt packet, converts the first interrupt packet into a first command packet, and stores the first command packet into the buffer module. A second interface driver module receives a second interrupt packet, converts the second interrupt packet into a second command packet, and stores the second command package into the buffer module. The format of the first interrupt packet is different from that of the second interrupt packet, while the first and the second command packets comply with a common format.

Abstract: An item positioning system is provided. The item positioning system comprises a plurality of tag readers and a control device. The plurality of tag readers generate access signals respectively and receive a response signal from a target tag. The control device adjusts transmitting power of the access signals of the tag readers, and determines a position of the target item according to whether the tag readers receive the response signal.