Patents by Inventor Chih-Yen LU

Chih-Yen LU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20240153843
    Abstract: A package structure is provided. The package structure includes a semiconductor die and a thermoelectric structure disposed on the semiconductor die. The thermoelectric structure includes P-type semiconductor blocks, N-type semiconductor blocks and metal pads. The P-type semiconductor blocks and the N-type semiconductor blocks are arranged in alternation with the metal pads connecting the P-type semiconductor blocks and the N-type semiconductor blocks. When a current flowing through one of the N-type semiconductor block, one of the metal pad, and one of the P-type semiconductor block in order, the metal pad between the N-type semiconductor block and the P-type semiconductor block forms a cold junction which absorbs heat generated by the semiconductor die.
    Type: Application
    Filed: January 17, 2024
    Publication date: May 9, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Yen Hsieh, Chih-Horng Chang, Chung-Yu Lu
  • Package structure comprising a semiconductor die with a thermoelectric structure and manufacturing method thereof
    Patent number: 11915994
    Abstract: A package structure is provided. The package structure includes a semiconductor die and a thermoelectric structure disposed on the semiconductor die. The thermoelectric structure includes P-type semiconductor blocks, N-type semiconductor blocks and metal pads. The P-type semiconductor blocks and the N-type semiconductor blocks are arranged in alternation with the metal pads connecting the P-type semiconductor blocks and the N-type semiconductor blocks. When a current flowing through one of the N-type semiconductor block, one of the metal pad, and one of the P-type semiconductor block in order, the metal pad between the N-type semiconductor block and the P-type semiconductor block forms a cold junction which absorbs heat generated by the semiconductor die.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Yen Hsieh, Chih-Horng Chang, Chung-Yu Lu
  • Electronic device and method for manufacturing the same
    Patent number: 11850823
    Abstract: An electronic device is provided. The electronic device includes a display, a substrate, and an anti-explosion layer. The substrate is disposed on the display. The anti-explosion layer is disposed between the substrate and the display, and the anti-explosion layer has a tensile strength in a range from 10 MPa to 30 MPa.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: December 26, 2023
    Assignee: INNOLUX CORPORATION
    Inventors: Chao-Li Chuang, Hsin-Wei Huang, Ming-Chi Guo, Chih-Yen Lu, Kuan-Chou Chen
  • ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20200353721
    Abstract: An electronic device is provided. The electronic device includes a display, a substrate, and an anti-explosion layer. The substrate is disposed on the display. The anti-explosion layer is disposed between the substrate and the display, and the anti-explosion layer has a tensile strength in a range from 10 MPa to 30 MPa.
    Type: Application
    Filed: April 17, 2020
    Publication date: November 12, 2020
    Inventors: Chao-Li CHUANG, Hsin-Wei HUANG, Ming-Chi GUO, Chih-Yen LU, Kuan-Chou CHEN