Abstract: A manufacturing method of a display panel, a display panel, and a display apparatus. The manufacturing method includes: forming a plurality of backlight units on a process substrate; filling a partition between adjacent backlight units, where a height of the partition relative to the process substrate is greater than a height of the adjacent backlight units relative to the process substrate; preparing a filter layer on a surface of each of the plurality of backlight units away from the process substrate; stripping the backlight units with the filter layer on surfaces of the backlight units from the process substrate, and transferring to a target substrate; and packaging the target substrate.

Abstract: A manufacturing method of a display panel, a display panel, and a display apparatus. The manufacturing method includes: forming a plurality of backlight units on a process substrate; filling a partition between adjacent backlight units, where a height of the partition relative to the process substrate is greater than a height of the adjacent backlight units relative to the process substrate; preparing a filter layer on a surface of each of the plurality of backlight units away from the process substrate; stripping the backlight units with the filter layer on surfaces of the backlight units from the process substrate, and transferring to a target substrate; and packaging the target substrate.

Abstract: A biomimetic adhesive layer is provided, and has a plurality of protrusions with a bottom surface and an upper surface of each of the protrusions; and a support portion connecting with the bottom surface. The protrusions are formed by a polymeric material mixed with permeance particles. Moreover, a method of manufacturing a biomimetic adhesive layer is provided, and has the steps of: providing a metallic mold having a plurality of filling apertures; compressing a polymer substrate with the metallic mold to fill the polymer substrate within the apertures; curing the polymer substrate; and separating the metallic mold from the polymer substrate to obtain the biomimetic adhesive layer.

Abstract: An organic light emitting diode module is provided and includes a substrate, a first electrode located on the substrate, a pair of second electrodes located on the substrate, a light emitting element located on the substrate, a first copper foil electrically connected to the first electrode, a pair of second copper foils respectively electrically connected to the second electrodes, and a cross connection conductor electrically connected to the second copper foils. The second electrodes are in an arrangement opposite to one another. The light emitting element includes a first electrode layer electrically connected to the first electrode, a second electrode layer located between the second electrodes and electrically connected to the second electrodes, and an organic light emitting layer located between the first and second electrode layers.

Abstract: An organic light emitting diode module is provided and includes a substrate, a first electrode located on the substrate, a pair of second electrodes located on the substrate, a light emitting element located on the substrate, a first copper foil electrically connected to the first electrode, a pair of second copper foils respectively electrically connected to the second electrodes, and a cross connection conductor electrically connected to the second copper foils. The second electrodes are in an arrangement opposite to one another. The light emitting element includes a first electrode layer electrically connected to the first electrode, a second electrode layer located between the second electrodes and electrically connected to the second electrodes, and an organic light emitting layer located between the first and second electrode layers.