Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.

Abstract: A printing method for three-dimensional painting by UV digital printing device has acts of: First, preparing a printing device having a white print set and a color print set. Second, moving the printing device transversely from one side to the other side of an object for multiple times, wherein the two print sets respectively print on two adjacent zones. Third, moving the printing device longitudinally to next zone on the object. Fourth, repeating the second and third acts until the printing device moves over a last zone on the object. The printing device moves longitudinally after the printing device moves transversely to and fro to finish the height of a zone. Thus, the printing device completes all the heights and the colors in one time of longitudinal moving. Then printing consumes less time and the printing device therefore does not have to be orientated again.

Abstract: A pneumatic ink-jet system is applied in an inkjet printer and uses a negative pressure generator, which is designed according to the Bernoulli's Theory, with a stable airflow in a certain speed to generated stable pressure inside at least one inkpot and at least one print head. Therefore, the at least one print head is kept in an appropriate wet state and the quality of printing is enhanced. Moreover, a top surface of the ink inside the at least one inkpot can be controlled to be higher than the at least one print head, so the pneumatic ink-jet system can be applied in a large format inkjet printer.

Abstract: A pneumatic ink-jet system is applied in an inkjet printer and uses a negative pressure generator, which is designed according to the Bernoulli's Theory, with a stable airflow in a certain speed to generated stable pressure inside at least one inkpot and at least one print head. Therefore, the at least one print head is kept in an appropriate wet state and the quality of printing is enhanced. Moreover, a top surface of the ink inside the at least one inkpot can be controlled to be higher than the at least one print head, so the pneumatic ink-jet system can be applied in a large format inkjet printer.

Abstract: A cutting tool adjustment method includes lowering a cutting tool on a transparent Mylar to produce an indentation before an actual scribing operation; picking up the image of the indentation; using a numerical analysis method and a set formula to automatically calculate a correction angle and position so as to adjust the angle and position of the cutting tool subject to the calculation result; and repeating the calculation and adjustment procedures, if necessary.

Abstract: A cutting tool adjustment method is disclosed to lower a cutting tool on a transparent Mylar to produce an indentation before actual scribing operation, and then to pick up the image of the indentation, and then to use a numerical analysis method and the set formula to automatically calculate the correction angle and position and to adjust the angle and position of the cutting tool subject to the calculation result, and then to repeat the calculation and adjustment procedure if necessary. Thus, the cutting tool and its cutting edge can be accurately adjusted to the correct angle and position to obtain a precise indentation. Further, by means of the automatic adjustment procedure, the present invention saves much adjusting time, thereby improving the productivity.

Abstract: A brittle material breaking apparatus using a lifting mechanism to lift/lower a carrier wherein the lifting mechanism is controlled to lift the carrier for holding the brittle material for breaking, and then to lower the carrier from the brittle material to a distance for enabling the brittle material to be shifted to a next scribe line for further breaking, preventing the occurrence of friction between the brittle material and the carrier and the production of static electricity and micro particles and, improving the breaking quality. The brittle material breaking apparatus further includes a stroke fine adjustment mechanism adapted to adjust the stroke of the breaking-cutter relative to the brittle material.

Abstract: A brittle material breaking apparatus using a lifting mechanism to lift/lower a carrier wherein the lifting mechanism is controlled to lift the carrier for holding the brittle material for breaking, and then to lower the carrier from the brittle material to a distance for enabling the brittle material to be shifted to a next scribe line for further breaking, preventing the occurrence of friction between the brittle material and the carrier and the production of static electricity and micro particles and, improving the breaking quality. The brittle material breaking apparatus further includes a stroke fine adjustment mechanism adapted to adjust the stroke of the breaking-cutter relative to the brittle material.

Abstract: The integrity of control signals used to control a wafer handling robot is monitored by a monitor connected to various points of the robotic control system. The monitor includes a memory for storing data sets representing correct, reference characteristics of the control signals. The monitor samples control signals at various points in the control system and compares these sampled signals with the stored reference characteristics in order to determine whether a signal disparity exists. If a disparity exists, the monitor generates an error.

Abstract: A cutting device for breaking fragile materials is constructed to include a lifting mechanism adapted to move the cutter vertically, a rotary table adapted to control the cutting angle of the cutter on the workpiece, a feed mechanism adapted to control the federate of the cutter, and a rotary mechanism adapted to rotate the cutter for enabling the cutter to cut the workpiece with one of multiple cutting points thereof selectively.

Abstract: A cutting device for breaking fragile materials is constructed to include a lifting mechanism adapted to move the cutter vertically, a rotary table adapted to control the cutting angle of the cutter on the workpiece, a feed mechanism adapted to control the federate of the cutter, and a rotary mechanism adapted to rotate the cutter for enabling the cutter to cut the workpiece with one of multiple cutting points thereof selectively.

Abstract: The integrity of control signals used to control a wafer handling robot is monitored by a monitor connected to various points of the robotic control system. The monitor includes a memory for storing data sets representing correct, reference characteristics of the control signals. The monitor samples control signals at various points in the control system and compares these sampled signals with the stored reference characteristics in order to determine whether a signal disparity exists. If a disparity exists, the monitor generates an error.

Abstract: A digital non-contact blade position detection apparatus is provided for use on a wafer dicing machine for blade position detection so as to correct the position of the cutting blade.