Patents by Inventor Chih-Yi Liao

Chih-Yi Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240213134
    Abstract: An electronic package is provided, in which an electronic element is disposed on a carrier with a circuit layer, and an encapsulation layer encapsulating the electronic element has an opening exposing the circuit layer, where a metal structure can be contact-bonded on a wall surface of the opening, and a conductive element is formed on the metal structure and electrically connected to the circuit layer. Therefore, no gap is formed between the conductive element and the wall surface of the opening, such that the DC resistance of the conductive element can be reduced.
    Type: Application
    Filed: April 28, 2023
    Publication date: June 27, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Wei-Hao LI, Chih-Yi LIAO, Cheng-Wei HSU, Chih-Yuan TSAI, Ko-Wei CHANG, Guo-Yu WU
  • Publication number: 20210351097
    Abstract: An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulation layer encapsulates the electronic component and the conductive elements. The encapsulation layer has concave portions corresponding in position to the conductive elements. Each of the conductive elements is in no contact with corresponding one of the concave portions.
    Type: Application
    Filed: April 27, 2021
    Publication date: November 11, 2021
    Inventors: Chih-Chiang He, Yu-Wei Yeh, Chia-Yang Chen, Chih-Yi Liao, Chih-Hsien Chiu, Chang-Chao Su
  • Publication number: 20210005524
    Abstract: An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulation layer encapsulates the electronic component and the conductive elements. The encapsulation layer has concave portions corresponding in position to the conductive elements. Each of the conductive elements is in no contact with corresponding one of the concave portions.
    Type: Application
    Filed: February 18, 2020
    Publication date: January 7, 2021
    Inventors: Chih-Chiang He, Yu-Wei Yeh, Chia-Yang Chen, Chih-Yi Liao, Chih-Hsien Chiu, Chang-Chao Su
  • Patent number: 10818515
    Abstract: The present disclosure provides an electronic package and a method for fabricating the same. A protective layer is formed on a carrier of the electronic component. The electronic component and the protective layer are covered by a covering layer. A through hole is formed in the covering layer and extends through the protective layer, such that a portion of a surface of the carrier is exposed to the through hole. A conductive structure is disposed in the through hole and electrically connected with the carrier. Through the formation of the protective layer, the buffering effect of the protective layer can prevent the laser from directly burning through the covering layer and the protective layer to avoid damages to the carrier.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: October 27, 2020
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Yu-Wei Yeh, Yen-Hung Lin, Chih-Yi Liao, Chih-Hsien Chiu
  • Publication number: 20200251395
    Abstract: An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulating layer encapsulates the electronic component and the conductive elements. The encapsulating layer is formed with recessed portions corresponding in position to the conductive elements. A gap is formed between the conductive elements and the recessed portions.
    Type: Application
    Filed: July 2, 2019
    Publication date: August 6, 2020
    Inventors: Chih-Chiang He, Yu-Wei Yeh, Chia-Yang Chen, Chih-Yi Liao, Chih-Hsien Chiu, Chang-Chao Su
  • Publication number: 20200090952
    Abstract: The present disclosure provides an electronic package and a method for fabricating the same. A protective layer is formed on a carrier of the electronic component. The electronic component and the protective layer are covered by a covering layer. A through hole is formed in the covering layer and extends through the protective layer, such that a portion of a surface of the carrier is exposed to the through hole. A conductive structure is disposed in the through hole and electrically connected with the carrier. Through the formation of the protective layer, the buffering effect of the protective layer can prevent the laser from directly burning through the covering layer and the protective layer to avoid damages to the carrier.
    Type: Application
    Filed: November 20, 2018
    Publication date: March 19, 2020
    Inventors: Yu-Wei Yeh, Yen-Hung Lin, Chih-Yi Liao, Chih-Hsien Chiu