Patents by Inventor Chih-Yin Wei

Chih-Yin Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120111602
    Abstract: A signal transmission cable including a conductive tape, a number of grounding conductive wires, a number of insulation wires in the first layer and a number of insulation wires in the second layer. The insulation wires in the first layer are used for transmitting a voltage signal, and the insulation wires in the second layer are used for transmitting a power set. The insulation wires in the first layer are paired and arranged on the conductive tape at an equal distance. The grounding conductive wires are embedded between the signal wire pairs for stabilizing the impedance. The insulation wires in the first layer and the insulation wires in the second layer are separated by a conductive tape for destructing the noise coupling effects between the layers. Lastly, the conductive tape covers the first layer and the second layer for impedance control and containing signal energy in the cable.
    Type: Application
    Filed: March 24, 2011
    Publication date: May 10, 2012
    Applicant: Quanta Computer Inc.
    Inventor: Chih-Yin Wei