Abstract: Semiconductor devices and methods of forming the same are provided. A semiconductor device according to one embodiment includes an active region including a channel region and a source/drain region adjacent the channel region, a gate structure over the channel region of the active region, a source/drain contact over the source/drain region, a dielectric feature over the gate structure and including a lower portion adjacent the gate structure and an upper portion away from the gate structure, and an air gap disposed between the gate structure and the source/drain contact. A first width of the upper portion of the dielectric feature along a first direction is greater than a second width of the lower portion of the dielectric feature along the first direction. The air gap is disposed below the upper portion of the dielectric feature.

Abstract: Various embodiments of the present disclosure are directed towards an imaging device including a first image sensor element and a second image sensor element respectively comprising a pixel unit disposed within a semiconductor substrate. The first image sensor element is adjacent to the second image sensor element. A first micro-lens overlies the first image sensor element and is laterally shifted from a center of the pixel unit of the first image sensor element by a first lens shift amount. A second micro-lens overlies the second image sensor element and is laterally shifted from a center of the pixel unit of the second image sensor element by a second lens shift amount different from the first lens shift amount.

Abstract: A semiconductor device structure, along with methods of forming such, are described. The semiconductor device structure includes a device, a first dielectric material disposed over the device, and an opening is formed in the first dielectric material. The semiconductor device structure further includes a conductive structure disposed in the opening, and the conductive structure includes a first sidewall. The semiconductor device structure further includes a surrounding structure disposed in the opening, and the surrounding structure surrounds the first sidewall of the conductive structure. The surrounding structure includes a first spacer layer and a second spacer layer adjacent the first spacer layer. The first spacer layer is separated from the second spacer layer by an air gap.

Abstract: In some embodiments, an image sensor is provided. The image sensor includes a photodetector disposed in a semiconductor substrate. A wave guide filter having a substantially planar upper surface is disposed over the photodetector. The wave guide filter includes a light filter disposed in a light filter grid structure. The light filter includes a first material that is translucent and has a first refractive index. The light filter grid structure includes a second material that is translucent and has a second refractive index less than the first refractive index.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes a first photodetector disposed in a first pixel region of a semiconductor substrate and a second photodetector disposed in a second pixel region of the semiconductor substrate. The second photodetector is laterally separated from the first photodetector. A first diffuser is disposed along a back-side of the semiconductor substrate and over the first photodetector. A second diffuser is disposed along the back-side of the semiconductor substrate and over the second photodetector. A first midline of the first pixel region and a second midline of the second pixel region are both disposed laterally between the first diffuser and the second diffuser.

Abstract: A projector, a 3D sensing module and a method for fabricating the projector are provided. The 3D sensing module includes the projector and a receiver. The projector is configured to project a light beam to an object, and the receiver is configured to receive the light beam reflected from the object. The projector includes a circuit board, electronic components, a holder and a lens module. The circuit board has a plurality of first bonding pads and a plurality of second bonding pads on a top surface of the circuit board. The electronic components are bonded on the first bonding pads. The holder has a cavity and third bonding pads bonded on and electrically connected to the second bonding pads. The lens module is disposed in the cavity of the holder.

Abstract: An optical film stack including a DOE, a first detecting circuit layer, a liquid crystal changeable diffuser, and a conductive structure is provided. The first detecting circuit layer is disposed on the DOE. The liquid crystal changeable diffuser is disposed beside the DOE and includes a first transparent substrate, a second detecting circuit layer, a second transparent substrate, a third detecting circuit layer, and a liquid crystal layer. The second detecting circuit layer is disposed on the first transparent substrate. The second transparent substrate is disposed beside the first transparent substrate. The third detecting circuit layer is disposed on the second transparent substrate. The liquid crystal layer is disposed between the first transparent substrate and the second transparent substrate. The conductive structure electrically connects the first detecting circuit layer, the second detecting circuit layer, and the third detecting circuit layer.

Abstract: An optical film stack including a DOE, a first detecting circuit layer, a liquid crystal changeable diffuser, and a conductive structure is provided. The first detecting circuit layer is disposed on the DOE. The liquid crystal changeable diffuser is disposed beside the DOE and includes a first transparent substrate, a second detecting circuit layer, a second transparent substrate, a third detecting circuit layer, and a liquid crystal layer. The second detecting circuit layer is disposed on the first transparent substrate. The second transparent substrate is disposed beside the first transparent substrate. The third detecting circuit layer is disposed on the second transparent substrate. The liquid crystal layer is disposed between the first transparent substrate and the second transparent substrate. The conductive structure electrically connects the first detecting circuit layer, the second detecting circuit layer, and the third detecting circuit layer.

Abstract: A projector, a 3D sensing module and a method for fabricating the projector are provided. The 3D sensing module includes the projector and a receiver. The projector is configured to project a light beam to an object, and the receiver is configured to receive the light beam reflected from the object. The projector includes a circuit board, electronic components, a holder and a lens module. The circuit board has a plurality of first bonding pads and a plurality of second bonding pads on a top surface of the circuit board. The electronic components are bonded on the first bonding pads. The holder has a cavity and third bonding pads bonded on and electrically connected to the second bonding pads. The lens module is disposed in the cavity of the holder.

Abstract: A DOE module including a transparent substrate, a first electrode, a second electrode, a first sensing wire, a sensing layer, a DOE layer, and an insulating layer is provided. The first electrode is disposed on the transparent substrate, and the second electrode is disposed on the transparent substrate. The first sensing wire is distributed on the transparent substrate and electrically connected to the first electrode. The sensing layer is distributed on the transparent substrate and electrically connected to the second electrode. The first sensing wire is insulated from the sensing layer to form a capacitance between the first sensing wire and the sensing layer. The DOE layer is disposed on the transparent substrate. The insulating layer covers the first sensing wire and the sensing layer. The insulating layer has a first opening and a second opening respectively exposing the first electrode and the second electrode.

Abstract: The present invention provides an electronic device, wherein the electronic device includes a projector and a controller. The projector includes a laser module and a lens module with a cover glass, wherein a laser beam generated from the laser module passes through the lens module to generate a projected image. The controller is coupled to the projector, and is arranged for determining if the cover glass is broken to generate a determination result, and controlling a power of the laser module according to the determination result.

Abstract: The present invention provides an electronic device, wherein the electronic device includes a projector and a controller. The projector includes a laser module and a lens module with a cover glass, wherein a laser beam generated from the laser module passes through the lens module to generate a projected image. The controller is coupled to the projector, and is arranged for determining if the cover glass is broken to generate a determination result, and controlling a power of the laser module according to the determination result.

Abstract: A capacitor array structure which includes N capacitor units is provided. Each capacitor unit includes a first metal layer, a second metal layer, and a third metal layer to form an upper electrode and a lower electrode. The second metal layer is disposed between the first metal layer and the third metal layer, and includes a second patterned metal portion of the lower electrode and a first patterned metal portion of the upper electrode. disposed above. The second patterned metal portion of the lower electrode has an opening, and a side of the first patterned metal portion of the upper electrode is exposed in the opening, such that the side of the first patterned metal portion of the upper electrode is adjacent to the lower electrode of another capacitor unit.

Abstract: A capacitor array structure which includes N capacitor units is provided. Each capacitor unit includes a first metal layer, a second metal layer, and a third metal layer to form an upper electrode and a lower electrode. The second metal layer is disposed between the first metal layer and the third metal layer, and includes a second patterned metal portion of the lower electrode and a first patterned metal portion of the upper electrode. disposed above. The second patterned metal portion of the lower electrode has an opening, and a side of the first patterned metal portion of the upper electrode is exposed in the opening, such that the side of the first patterned metal portion of the upper electrode is adjacent to the lower electrode of another capacitor unit.

Abstract: A digital video broadcast receiver including a frequency synthesizer, a plurality of frequency dividing-phase shifting circuits, an antenna and a plurality of signal processing modules is provided. The frequency synthesizer synthesizes a first frequency signal. The frequency dividing-phase shifting circuits individually perform a frequency dividing-phase shifting operation on the first frequency signal to generate a plurality of first signals having different frequencies and a plurality of second signals corresponding to the first signals, where each of the first signals is orthogonal to the corresponding second signal. The antenna receives a radio frequency signal. The signal processing modules respectively obtain a plurality of signal components belonging to different sub-bands from the radio frequency signal according to the first signals and the second signals.

Abstract: A digital video broadcast receiver including a frequency synthesizer, a plurality of frequency dividing-phase shifting circuits, an antenna and a plurality of signal processing modules is provided. The frequency synthesizer synthesizes a first frequency signal. The frequency dividing-phase shifting circuits individually perform a frequency dividing-phase shifting operation on the first frequency signal to generate a plurality of first signals having different frequencies and a plurality of second signals corresponding to the first signals, where each of the first signals is orthogonal to the corresponding second signal. The antenna receives a radio frequency signal. The signal processing modules respectively obtain a plurality of signal components belonging to different sub-bands from the radio frequency signal according to the first signals and the second signals.

Abstract: The present invention is directed to a clock generator and a method of generating a clock signal. A digital control oscillator (DCO) generates a clock signal. A first frequency calibration unit extracts a periodic signal and determines a frequency error quantity between the extracted periodic signal and a derived clock signal. A second frequency calibration unit generates a coarse tuning signal when an absolute value of the frequency error quantity is greater than a first predetermined threshold, and generates a fine tuning signal when the absolute value of the frequency error quantity is less than a second predetermined threshold.