Abstract: An optical member driving mechanism is provided. The optical member driving mechanism includes a first movable portion used for connecting an optical element, a fixed portion, a first driving assembly used for driving the first movable portion to rotate relative to the fixed portion, and a guiding assembly having a first intermediate element. The first movable portion is movable relative to the fixed portion. The guiding assembly is used for applying a first stabilized force to the first movable portion for making the first intermediate element be in contact with the first movable portion or the fixed portion. The first movable portion is rotatable relative to the fixed portion.

Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A resistor structure includes a resistor body; and a first electrode structure disposed at and being in electric contact with a first end of the resistor body, and a second electrode structure disposed at and being in electric contact with a second end opposite to the first end of the resistor body. Each of the first electrode structure and the second electrode structure has at least one conductive protrusion. The at least one conductive protrusion of the first electrode structure and the at least one conductive protrusion of the second electrode structure both serve as voltage-sensing terminals for electric connection to an external voltage measurement device, or both serve as current-sensing terminals for electric connection to a current measurement device.

Abstract: A resistor structure includes a resistor body; and a first electrode structure disposed at and being in electric contact with a first end of the resistor body, and a second electrode structure disposed at and being in electric contact with a second end opposite to the first end of the resistor body. Each of the first electrode structure and the second electrode structure has at least one conductive protrusion. The at least one conductive protrusion of the first electrode structure and the at least one conductive protrusion of the second electrode structure both serve as voltage-sensing terminals for electric connection to an external voltage measurement device, or both serve as current-sensing terminals for electric connection to a current measurement device.

Abstract: The present invention discloses a wireless package with a resilient connector for connecting a substrate to an antenna. The antenna is disposed directly on a top surface of a molding compound of the wireless package. The resilient connector has a lower terminal bonded to the substrate, a horizontal contact portion, and an oblique support portion integrally extending between the horizontal contact portion and the lower terminal. The horizontal contact portion has a flat top surface that is coplanar with the top surface of the molding compound and is in direct contact with the antenna such that the contact resistance distribution is concentrated and the production yield of the wireless package is improved.

Abstract: A wireless package includes a package substrate, a RFIC chip, a resilient connector, a molding compound encapsulating the RFIC chip, the resilient connector, and the top surface of the package substrate, and an antenna disposed on a top surface of the molding compound. The resilient connector has a terminal bonded to a pad on the top surface of the package substrate, a horizontal contact portion, and an oblique support portion integrally coupled to the horizontal contact portion and extending between the horizontal contact portion and the terminal. The antenna is in direct contact with the horizontal contact portion.

Abstract: The present invention discloses a biochip and the forming method thereof. The disclosed biochip comprises a substrate and a divalent metal compound layer on the substrate. The method for forming a biochip comprises two major steps. The first step is providing a substrate, and the second step is forming a divalent metal compound layer on the substrate.

Abstract: This invention is provided a biochip containing splitable reaction wells and method for producing same and application thereof. The invention avoids cross contamination or interference between different samples on the same biochip. In addition, the soft polymer film removed from reaction wells may be reused on different substrates, thereby saving the cost of experiment or clinical testing.