Patents by Inventor Chih-Yu KO

Chih-Yu KO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIQUID-FILLED PACKAGING STRUCTURE OF HEATING COMPONENT
    Publication number: 20150060932
    Abstract: A liquid-filled packaging structure of a heating component includes a main body, at least one heating component and a channel. The main body includes an accommodating space, a first opening connecting with the accommodating space and a second opening connecting with the accommodating space. The heating component is disposed in the accommodating space. The two opposite ends of the channel connect with the first opening and the second opening, respectively, so as to form a circulation loop. The accommodating space and the channel are filled with a liquid.
    Type: Application
    Filed: July 11, 2014
    Publication date: March 5, 2015
    Inventors: Meng-Chi HUANG, Wen-Hua ZHANG, Tune-Hune KAO, Min-Chieh CHOU, Chih-Yu KO