Abstract: An unmanned vehicle processing system includes a controller, a laser source, a galvanometer module and a receiving device. The controller provides a laser trigger signal. The laser source is connected electrically to the controller, receives the laser trigger signal and further emits accordingly a laser beam. The galvanometer module includes a scanning galvanometer for reflecting and converting the laser beam into a processing beam. The receiving device is connected electrically to the controller, receives a processing reflected beam reflected from the object and further emits correspondingly a reflected reception signal to the controller. The controller obtains a processing distance between the unmanned vehicle and the object according to the reflected reception signal and the laser trigger signal, the reflected reception signal has a reflected-signal intensity, and the controller detects a processed state of the object according to the reflected-signal intensity.

Abstract: An antenna-in-module includes a ground plate, three radiating elements, and two feed stubs. A first radiating element and a ground plate are arranged at an interval along a Z-axis and are disposed opposite to each other. The first radiating element and a second radiating element are arranged at an interval along an X-axis. A first gap between the first radiating element and the second radiating element extends along a Y-axis. A third radiating element and the second radiating element are arranged at an interval along the Z-axis and are disposed opposite to each other. At least a part of a first feed stub is disposed in a first aperture that includes space between the first gap and the ground plate. At least a part of a second feed stub is disposed in a second aperture that includes space between the second radiating element and the third radiating element.

Abstract: An electronic device includes a decoupling member, a first radiator, a second radiator, a first feed unit, a second feed unit, and a rear cover. A gap is formed between the first radiator and the second radiator, the decoupling member is indirectly coupled to the first radiator and the second radiator, and the decoupling member is disposed on a surface of the rear cover. The decoupling member does not overlap a first projection, and the first projection is a projection of the first radiator in a first direction. The decoupling member does not overlap a second projection, and the second projection is a projection of the second radiator in the first direction. The first direction is a direction perpendicular to a plane on which the rear cover is located.

Abstract: Embodiments of this application provide an electronic device, including a first decoupling member, a first radiator, a second radiator, a first feed unit, a second feed unit, and a rear cover. A first gap is formed between the first radiator and the second radiator. The first radiator includes a first feed point. The second radiator includes a second feed point. The first decoupling member is indirectly coupled to the first radiator and the second radiator, and the first decoupling member is disposed on a surface of the rear cover.

Abstract: An electronic device includes a radiator, a first feed circuit, and a second feed circuit. The radiator includes a first branch. The first feed circuit feeds the radiator at a first end of the first branch, and the second feed circuit feeds the radiator at a first position in the first branch. The first position is in an area with a largest current in the first branch when the first feed circuit performs feeding and the second feed circuit does not perform feeding.

Abstract: A broadside antenna includes a first radiation element and a second radiation element arranged at an interval, a first grounding element and a second grounding element arranged at an interval, and a first excitation element. A first gap is formed between the first radiation element and the second radiation element. The first excitation element includes a first feeding structure and a first extension stub that are arranged at an interval. The first feeding structure includes a first feed-in part connected to a feed source. The first extension stub is located on a side of the first feeding structure adjacent close to the first feed-in part. The first extension stub includes a first grounding part adjacent to the first feed-in part. The first grounding part is connected to the grounding surface.

Abstract: An antenna apparatus includes a feeding antenna inside an electronic device and one or more antenna elements, such as a floating metal antenna, disposed on a rear cover of the electronic device. The floating metal antenna and a feeding antenna inside the electronic device may form a coupling antenna structure. The feeding antenna may be an antenna fastened on an antenna support (which may be referred to as a support antenna). The feeding antenna may alternatively be a slot antenna formed by slitting on a metal middle frame of the electronic device. The antenna apparatus may be implemented in limited design space, thereby effectively saving antenna design space inside the electronic device. The antenna apparatus may generate excitation of a plurality of resonance modes, so that antenna bandwidth and radiation characteristics can be improved.

Abstract: An inductor structure includes a first curve metal component, a second curve metal component, a connection component, and a capacitor. The first and the second curve metal components are disposed on a layer. The layer is located at a first plane, the first and the second curve metal components are located at a second plane. The connection component is coupled to the first curve metal component and the second curve metal component. A first terminal of the connection component is coupled to a first terminal of the first curve metal component. A second terminal of the connection component is coupled to a first terminal of the second curve metal component. A first terminal of the capacitor is coupled to a second terminal of the first curve metal component. A second terminal of the capacitor is coupled to a second terminal of the second curve metal component.

Abstract: An embodiment of this application provides an electronic device, including a decoupling member, a first radiator, a second radiator, a first feed unit, a second feed unit, and a rear cover. A gap is formed between the first radiator and the second radiator, the decoupling member is indirectly coupled to the first radiator and the second radiator, and the decoupling member is disposed on a surface of the rear cover. The decoupling member does not overlap a first projection, and the first projection is a projection of the first radiator on the rear cover in a first direction. The decoupling member does not overlap a second projection, and the second projection is a projection of the second radiator on the rear cover in the first direction. The first direction is a direction perpendicular to a plane on which the rear cover is located.

Abstract: A patterned shielding structure is disposed between an inductor structure and a substrate. The patterned shielding structure includes a shielding layer and a first stacked structure. The shielding layer extends along a plane. The first stacked structure is stacked, along a first direction, on the shielding layer. The first direction is perpendicular to the plane. The first stacked structure has a crossed shape and is configured to enhance a shielding effect.

Abstract: An antenna apparatus includes a feeding antenna inside an electronic device and one or more antenna elements, such as a floating metal antenna, disposed on a rear cover of the electronic device. The floating metal antenna and a feeding antenna inside the electronic device may form a coupling antenna structure. The feeding antenna may be an antenna fastened on an antenna support (which may be referred to as a support antenna). The feeding antenna may alternatively be a slot antenna formed by slitting on a metal middle frame of the electronic device. The antenna apparatus may be implemented in limited design space, thereby effectively saving antenna design space inside the electronic device. The antenna apparatus may generate excitation of a plurality of resonance modes, so that antenna bandwidth and radiation characteristics can be improved.

Abstract: A patterned shielding structure is disposed between an inductor structure and a substrate. The patterned shielding structure includes a shielding layer and a first stacked structure. The shielding layer extends along a plane. The first stacked structure is stacked, along a first direction, on the shielding layer. The first direction is perpendicular to the plane. The first stacked structure has a crossed shape and is configured to enhance a shielding effect.

Abstract: An inductor structure includes a first curve metal component, a second curve metal component, a connection component, and a capacitor. The first and the second curve metal components are disposed on a layer. The layer is located at a first plane, the first and the second curve metal components are located at a second plane. The connection component is coupled to the first curve metal component and the second curve metal component. A first terminal of the connection component is coupled to a first terminal of the first curve metal component. A second terminal of the connection component is coupled to a first terminal of the second curve metal component. A first terminal of the capacitor is coupled to a second terminal of the first curve metal component. A second terminal of the capacitor is coupled to a second terminal of the second curve metal component.

Abstract: An inductor structure includes a first curve metal component, a second curve metal component, and a connection component. The first curve metal component is disposed on a layer. The layer is located at a first plane, the first curve metal component is located at a second plane, and the first plane is perpendicular to the second plane. The second curve metal component is disposed on the layer. The second curve metal component is located at the second plane. The connection component is coupled to the first curve metal component and the second curve metal component.

Abstract: A multi-antenna communication device is provided, including a grounding conductor plane separating a first side space and a second side space and having a first edge. A four-antenna array including first, second, third and fourth antennas is located at the first edge, and has an overall maximum array length extending along the first edge. The first and second antennas are located in the first side space, and the third and fourth antennas are located in the second side space. Each of the first to fourth antennas includes a feeding conductor line, a grounding conductor line, and a radiating conductor portion electrically connected to a signal source through the feeding conductor line and electrically connected to the first edge through the grounding conductor line, thereby forming a loop path and generating at least one resonant mode. The radiating conductor portion has a corresponding projection line segment at the first edge.

Abstract: A multi-band multi-antenna array includes a ground conductor plane and a dual antenna array. The ground conductor plane includes a first edge and separates a first side space and a second side space. The dual antenna array has a maximum array length extending along the first edge and includes a first antenna and a second antenna. The first antenna includes a first resonant loop and a first radiating conductor line exciting the first antenna generating a first resonant mode and a second resonant mode, respectively, wherein frequencies of the first resonant mode are lower than frequencies of the second resonant mode. The second antenna includes a second resonant loop and a second radiating conductor line exciting the first antenna generating a third resonant mode and a fourth resonant mode, respectively, wherein frequencies of the third resonant mode are lower than frequencies of the fourth resonant mode.

Abstract: The present invention discloses a bonding-wire-type heat sink structure for semiconductor devices. An embodiment of the said bonding-wire-type heat sink structure comprises: a semiconductor substrate; a heat source formed on or included in the semiconductor substrate, said heat source including at least one hot spot; at least one heat conduction layer; at least one heat conductor connecting the at least one hot spot with the at least one heat conduction layer; at least one heat dissipation component in an electrically floating state; and at least one bonding wire connecting the at least one heat conduction layer with the at least one heat dissipation component, so as to transmit the heat of the heat source to the heat dissipation component.

Abstract: A multi-antenna communication device is provided, including a grounding conductor plane separating a first side space and a second side space and having a first edge. A four-antenna array including first, second, third and fourth antennas is located at the first edge, and has an overall maximum array length extending along the first edge. The first and second antennas are located in the first side space, and the third and fourth antennas are located in the second side space. Each of the first to fourth antennas includes a feeding conductor line, a grounding conductor line, and a radiating conductor portion electrically connected to a signal source through the feeding conductor line and electrically connected to the first edge through the grounding conductor line, thereby forming a loop path and generating at least one resonant mode. The radiating conductor portion has a corresponding projection line segment at the first edge.

Abstract: The present invention discloses a bonding-wire-type heat sink structure for semiconductor devices. An embodiment of the said bonding-wire-type heat sink structure comprises: a semiconductor substrate; a heat source formed on or included in the semiconductor substrate, said heat source including at least one hot spot; at least one heat conduction layer; at least one heat conductor connecting the at least one hot spot with the at least one heat conduction layer; at least one heat dissipation component in an electrically floating state; and at least one bonding wire connecting the at least one heat conduction layer with the at least one heat dissipation component, so as to transmit the heat of the heat source to the heat dissipation component.

Abstract: The present invention discloses an LC tank capable of reducing electromagnetic radiation by itself and the manufacturing method of the same. An embodiment of said LC tank comprises: a first tank area whose boundary is defined by a first part of an inductance; a second tank area whose boundary is defined by a second part of the inductance in which the second part includes a gap; a cross-interconnection structure operable to electrically connect the first and second parts of the inductance and distinguish the first tank area from the second tank area; and at least one capacitance formed inside at least one of the first and second tank areas, wherein the area ratio of the first tank area to the second tank area is between 20% and 80%.