Abstract: A tracking system and a device integrating an existing positional tracking system and a docking mechanism include a tracking system hardware module, a docking mechanism, and a positional tracking software module and are adapted to capture a user's finger movement and send in real time and synchronously the user's finger movement to a computer. The docking mechanism is compatible with an existing third-party positional tracking system such that the device can operate in conjunction with existing, commercially-available positional tracking systems, for example, HTC VIVE Tracker, and Oculus Quest, and thus is applicable to an existing game engine.

Abstract: The present invention discloses an RF element group testing system and method. The method comprises steps: adding an identification feature to a first RF signal, which is output by one of the plurality of tested RF elements, to generate an identification RF signal; synthesizing the identification RF signal and a second RF signal, which is output by each of the rest of the tested RF elements, to generate a corresponding synthesis signal; resolving the synthesis signal into the identification RF signal and the corresponding second RF signal according to the identification feature; restoring the identification RF signal into the first RF signal; and calculating at least one signal-feature parameter of the first RF signal and the second RF signal.

Abstract: A method for improving transmission power management with compliance to regulations of radiofrequency exposure, which may comprise: at a current time, estimating whether a window average power, which may reflect average power transmitted using a radio technology during a moving time window, will exceed a power limit after the current time; if true, proceeding to at least one of a first handling subroutine and a second handling subroutine to set a power cap, and causing power transmitted to be capped by the power cap after the current time. The first handling subroutine may comprise: scheduling to set the power cap lower at a scheduled time. Estimating whether the window average power will exceed the power limit may involve discarding one of a plurality of power records. The second handling subroutine may comprise: setting the power cap not higher than the discarded one of the plurality of power records.

Abstract: A multi-chamber semiconductor manufacturing system is provided, including: a base, a plurality of processing units and a transfer unit. The base includes a main body and a plurality of supporting frames protrudingly disposed on a mounting surface of the main body. The plurality of processing units are connected to the plurality of supporting frames. The transfer unit is connected to the plurality of supporting frames and located between the plurality of processing units. The transfer unit is configured to transfer a substrate between the plurality of processing units. An aspect ratio value of the base is between 1 and 3.

Abstract: A receiving structure providing real-time information as to the materials constituting its contents includes a box body, a first side plate, and a second side plate. The box body, the first side plate, and the second side plate forming a receiving space, and the receiving space receives materials. A discharge port is formed between the second side plate and the first side plate, the discharge port is in communication with the receiving space, and the discharge port is configured to take out the material. A material checking unit is provided on the first side plate, the material checking unit detects and enables real time identification of the materials in the receiving structure.

Abstract: The present disclosure provides a signal delay setting circuit, an isolation integrated circuit and a power conversion circuitry. The isolation integrated circuit includes a primary side circuit, an isolation circuit and a secondary side circuit. The primary side circuit generates a primary side signal according to a first input signal and a second input signal. The isolation circuit converts the primary side signal into a secondary side signal. The secondary side circuit receives the secondary side signal through the isolation circuit, to generate an output signal. The signal delay setting circuit is coupled to the secondary side circuit, calculates a delay time according to a voltage difference between an alternative terminal and a secondary side ground terminal of the isolation integrated circuit, and delays the secondary side signal according to the delay time, to control the duty ratio of the output signal.

Abstract: An electronic device includes a logic body, a processing unit, and a bracket component. The logical body has a plurality of first end openings and a plurality of first bottom openings. The first end openings are disposed at a first end portion of the logic body. The first bottom openings are disposed at a bottom portion of the logic body and are adjacent to the first end portion. The processing unit is disposed in an interior of the logic body, away from the first end openings, and misaligned with the first bottom openings. The bracket component is rotatably disposed at the bottom portion. In a closed mode, the bracket component is positioned close to the bottom portion and covers the first bottom openings. In an open mode, the bracket component is unfolded from the bottom portion and exposes the first bottom openings.

Abstract: An electronic device includes a logic body, a heat dissipation fin, and a rotating bracket. The logic body has multiple first end openings and multiple first bottom openings. The first end openings are disposed on a first end of the logic body. The first bottom openings are disposed on a bottom of the logic body and are adjacent to the first end. The heat dissipation fins are disposed inside an interior of the logic body and correspond to the first bottom openings. The rotating bracket is rotatably disposed at the bottom. In a closed mode, the rotating bracket is close to the bottom and covers the first bottom openings. In an open mode, the rotating bracket is unfolded from the bottom and exposes the first bottom openings.

Abstract: Embodiments of the present disclosure provide a bond stage for bonding a semiconductor integrated circuit (IC) die. The bond stage includes a bonding platform having a top surface and a bottom surface opposing the top surface, a first actuator operable to tilt the bonding platform about a first rotation axis, and a plurality of contact sensors disposed at the bonding platform.

Abstract: The present disclosure provides a method and a system therefore for processing wafer. The method includes: extracting a first gas from a chamber via a first route; blocking a second route used to be pumped down to chuck a wafer placed in the chamber, wherein the second route connects the chamber and the first route; and providing a second gas via a third route to purge a junction of the first route and the second route.

Abstract: This disclosure provides methods, components, devices and systems for reducing out-of-band emission (OOBE) for transmissions associated with a distributed resource unit (RU) (dRU) allocation. Some aspects more specifically relate to introducing more unevenness in terms of tone spacing to a first subset of dRUs associated with a given bandwidth and maintaining relatively more even tone spacing for a second subset of dRUs associated with that given bandwidth. In some implementations, for example, a complete set of dRUs associated with a bandwidth may include a first subset of dRUs and a second subset of dRUs, with dRUs of the first subset having more uneven tone spacings as compared to dRUs of the second subset. In some aspects, the first subset of dRUs may include dRUs associated with relatively fewer tones as compared to dRUs of the second subset.

Abstract: A quick conductor connector includes a receiving space recessed from a top of a main body, the receiving space having an annular stepped section formed around a top opening thereof with locating guide sections spaced thereon and sockets formed on a bottom thereof for receiving conductors therein; a locating member disposed on the annular stepped section and provided on inner and outer circumferential edges with stop sections and extensions, respectively; the extensions being extendable into the locating guide sections for guiding the locating member to rotate and change the positions of the stop sections relative to the annular stepped section; and a plug member including electrically conducting sections extendable into the sockets and electrically connected to the conductors, and limiting sections that can be blocked by the stop sections when the locating member is rotated to thereby prevent the plug member from sliding upward out of the receiving space.

Abstract: A molecular analysis component, comprising: a first substrate having a first nanopore extending therethrough and the first nanopore having a diameter; and a second substrate having a second nanopore extending therethrough and the second nanopore having a diameter, the first and second nanopores both extending in a direction, and the first and second nanopores are separated by a distance of from about 0.5 nm to about 500 nm as measured along the direction, the distance optionally being of from about 5 nm to about 250 nm.

Abstract: An edge emitting laser (EEL) device includes a substrate, an n-type buffer layer, a first n-type cladding layer, a grating layer, a spacer layer, a lower confinement unit, an active layer, an upper confinement unit, a p-type cladding layer, a tunnel junction layer and a second n-type cladding layer sequentially arranged from bottom to top. The tunnel junction layer can stop an etching process from continuing to form the second n-type cladding layer into a predetermined ridge structure and converting a part of the p-type cladding layer into the n-type cladding layer to reduce series resistance of the EEL device. Therefore, the optical field and active layer tend to be coupled at the middle of the active layer, the lower half of the active layer can be utilized effectively, and the optical field is near to the grating layer to achieve better optical field/grating coupling efficiency and lower threshold current.

Abstract: The present application provides a defect detection method. The method includes obtaining a first image of a product and a first defect detection result of the first image. The product is cleaned, and a second image of the product is obtained after the product has been cleaned. Once a second defect detection result of the second image is obtained, a third defect detection result of the product is determined based on the first defect detection result and the second defect detection result.

Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate, an insulating layer, and a diaphragm. The substrate has an opening portion. The backplate is disposed on a side of the substrate, with protrusions protruding toward the substrate. The diaphragm is movably disposed between the substrate and the backplate and spaced apart from the backplate by a spacing distance. The protrusions are configured to limit the deformation of the diaphragm when air flows through the opening portion.

Abstract: A glass composition includes, based on 100 wt % of the glass composition, silicon dioxide present in an amount ranging from 45 wt % to 61 wt %, aluminum oxide present in an amount (A) ranging from 15 wt % to 22 wt %, calcium oxide present in an amount (C) ranging from 0.1 wt % to 6 wt %, magnesium oxide present in an amount (M) of greater than 0 wt % and lower than 2 wt %, zinc oxide present in an amount of greater than 0 wt % and lower than 8 wt %, copper oxide present in an amount of greater than 0 wt % and lower than 7 wt %, and boron oxide present in an amount of greater than 6 wt % and lower than 18 wt %. A glass fiber including the glass composition, and an electronic product including the glass fiber are also provided.

Abstract: To arrange a power unit, an electric power conversion unit, and engine-related components compactly, a drive motor, a reduction drive, a generator, and an engine body are integrally arranged in this order in a vehicle width direction of a power unit compartment such that respective heights thereof are substantially the same. An electric power conversion unit, in which a motor inverter, an electric power generation inverter, and a DC/DC converter are integrated, is arranged above the drive motor, the reduction drive, and the generator. Engine-related components such as a low-voltage battery, an air cleaner, and an oil filter are arranged above the engine body.

Abstract: A method of decoding video data performed by an electronic device is provided. The method receives the video data and determines a block unit from a current frame included in the video data. The method determines an extrapolation merge list of the block unit. The extrapolation merge list includes multiple extrapolation merge candidates. The method selects an extrapolation reference candidate from the extrapolation merge candidates for the block unit. Each of the extrapolation merge candidates includes multiple previous extrapolation parameters used to reconstruct a corresponding one of multiple extrapolation-reconstructed blocks. The extrapolation reference candidate is one of the extrapolation merge candidates. The method then determines an extrapolation prediction filter of the block unit based on the extrapolation reference candidate, and reconstructs the block unit based on the extrapolation prediction filter.