Abstract: An apparatus for automated encapsulation of motor rotor core with magnet steel is introduced. The apparatus includes at least one encapsulation unit, a plastic granule feeding device, a waste removing device, a conveyance device and a control device. Under a coordinated control of the control device, a rotor core feeding mechanism of the encapsulation unit feeds rotor cores to a plastic dispensing mechanism in cycles, the plastic granule feeding device separates, outputs and dispenses plastic granules, so that they are arrayed before being dispensed onto the rotor cores, and the conveyance device conveys plastic granules and moves the waste removing device to carry waste to a waste removal zone. With these arrangements, it is able to realize automated feeding of rotor cores, automated feeding of plastic granules and automated removal of waste to achieve completely automated rotor core encapsulation operation while enables mass production of motor rotor cores.

Abstract: An apparatus for automated encapsulation of motor rotor core with magnet steel is introduced. The apparatus includes at least one encapsulation unit, a plastic granule feeding device, a waste removing device, a conveyance device and a control device. Under a coordinated control of the control device, a rotor core feeding mechanism of the encapsulation unit feeds rotor cores to a plastic dispensing mechanism in cycles, the plastic granule feeding device separates, outputs and dispenses plastic granules, so that they are arrayed before being dispensed onto the rotor cores, and the conveyance device conveys plastic granules and moves the waste removing device to carry waste to a waste removal zone. With these arrangements, it is able to realize automated feeding of rotor cores, automated feeding of plastic granules and automated removal of waste to achieve completely automated rotor core encapsulation operation while enables mass production of motor rotor cores.

Abstract: A dual printed circuit board assembly, a printed circuit board, and a modular printed circuit board are provided. The printed circuit board includes a plurality of first connection points. The modular printed circuit board includes a plurality of second connection points. The modular printed circuit board is adapted to be mounted on the printed circuit board and includes a sensing unit, a first detecting unit, and a first notifying unit. The sensing unit outputs a detecting voltage according to a contact state between the first connection points and the second connection points. The first detecting unit determines whether the first connection points are respectively connected to the corresponding second connection points according to the detecting voltage. When one of the first connection points is not connected to the corresponding one of the second connection points, the first detecting unit controls the first notifying unit to issue a notification.

Abstract: A dual printed circuit board assembly, a printed circuit board, and a modular printed circuit board are provided. The printed circuit board includes a plurality of first connection points. The modular printed circuit board includes a plurality of second connection points. The modular printed circuit board is adapted to be mounted on the printed circuit board and includes a sensing unit, a first detecting unit, and a first notifying unit. The sensing unit outputs a detecting voltage according to a contact state between the first connection points and the second connection points. The first detecting unit determines whether the first connection points are respectively connected to the corresponding second connection points according to the detecting voltage. When one of the first connection points is not connected to the corresponding one of the second connection points, the first detecting unit controls the first notifying unit to issue a notification.