Patents by Inventor Chih-Yuan PAI

Chih-Yuan PAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20240153812
    Abstract: A method for fabricating a semiconductor device includes the steps of first forming a shallow trench isolation (STI) in a substrate, forming a first gate structure on the substrate and adjacent to the STI, forming a first doped region between the first gate structure and the STI, forming a second doped region between the first doped region and the first gate structure, forming a first contact plug on the first doped region, and then forming a second contact plug on the second doped region.
    Type: Application
    Filed: December 4, 2022
    Publication date: May 9, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Wen-Kai Lin, Chi-Horn Pai, Sheng-Yuan Hsueh, Kuo-Hsing Lee, Chih-Kai Kang
  • ORNAMENT ASSEMBLY WITH ADJUSTABLE MOUNTING LOCATIONS
    Publication number: 20110159234
    Abstract: An ornament with adjustable mounting locations includes an ornament unit and an adhesion unit. The ornament unit has a baseboard and a pattern layer located on the baseboard. The adhesion unit has a first adhesion member fastened to a rear surface of the baseboard. Thus the size and hung location of the ornament unit can be adjusted as desired.
    Type: Application
    Filed: December 22, 2010
    Publication date: June 30, 2011
    Inventor: Chih-Yuan PAI