Abstract: A particle removal method includes loading a particle attracting member with a coating layer into a processing chamber of a processing apparatus. The processing chamber is configured to perform a lithography exposure process on a semiconductor wafer. The method also includes fixing the particle attracting member on a reticle holder in the processing chamber in a cleaning cycle, attracting particles in the processing chamber by the coating layer of the particle attracting member due to a potential difference between the particles and the coating layer, and loading the particle attracting member with the coating layer and the attracted particles out of the processing chamber, after the cleaning cycle. The method also includes loading the semiconductor wafer into the processing chamber, and performing the lithography exposure process on the semiconductor wafer in the processing chamber using a reticle fixed on the reticle holder after the cleaning cycle.

Abstract: This invention discloses method for feeding Hermetia illucens and used as for preparing composite material of puparium, which comprises the following steps: S1, dry Hermetia illucens pupariums and grind them into powdery, S2, adding powdery of Hermetia illucens pupariums into sodium hydroxide aqueous solution, stirring, separating and filtering, S3, adding the pupariums into hydrochloric acid solution, stirring, separating and filtering; S4, placing the pupariums into sodium hydroxide aqueous solution, stirring, separating and filtering; S5, drying the pupariums, and screening out the granular pretreated powder of the Hermetia illucens pupariums. The invention also disclose preparation method of composite material and thin film of Hermetia illucens pupariums and antibacterial and antimildew additive.