Abstract: A computer processing system is provided for enhancing video-based language learning. The system includes a video server for storing videos that use one or more languages to be learned. The system further includes a video metadata database for storing translations of sentences uttered in the videos, character profiles of characters appearing in the videos, and mappings between the sentences and a learner profile. The system also includes a learner profile database for storing learner profiles. The system additionally includes a semantic analyzer and matching engine for finding, for at least a given video and a given learner, alternative sentences for and responsive to the translations of the sentences uttered in the given video that conflict with a respective learner profile for the given learner. The computer processing system further includes a presentation system for playing back the given video and providing the alternative sentences to the given learner.

Abstract: A package structure and a method for forming the same are provided. The package structure includes a first package structure and a second package structure. The first package structure includes a first device formed over a first substrate. The first device includes a first conductive plug connected to a through substrate via (TSV) structure formed in the first substrate. A buffer layer surrounds the first substrate. A first bonding layer is formed over the first substrate and the buffer layer. The second package structure includes a second device formed over a second substrate. A second bonding layer is formed over the second device. A hybrid bonding structure is between the first package structure and the second package structure by bonding the first bonding layer to the second bonding layer.

Abstract: A sensing device and a positioning method are disclosed. The sensing device is mounted around a display module to detect an object. The display module includes a display screen for displaying an image. The sensing device includes a first sonic wave transceiver, a second sonic wave transceiver, and a control module. The first and second sonic wave transceivers are respectively configured for transmitting a first sonic wave and a second sonic wave, and receiving a first reflected sonic wave and a second reflected sonic wave generated based on the first and second sonic waves, respectively. A frequency of the first and second sonic waves is between 50 KHz and 70 KHz. The control module is configured for controlling the first and second sonic wave transceivers, and for calculating a position of the object relative to the display module based on the first and second reflected sonic waves.

Abstract: The present invention relates to a suppressing noise system applied in a mobile device, comprises: at least two microphones are used for respectively transmitting a first audio signal with noise and a second audio signal with noise; a pre-processing unit is coupled to the at least two microphones for oversampling the first and second audio signals, downsampling the sampled first and second audio signals, and then generating a first adjusted signal and a second adjusted signal; and a suppressing noise device is coupled to the pre-processing device for filtering noise in the first and second adjusted signals once again, and outputting a third audio signal.

Abstract: System and method for implementing integrated transportation control in a wafer fabrication facility are described. One embodiment is a factory automation system for a wafer fabrication facility (“fab”) comprising a plurality of bays, wherein each of the bays comprise a plurality of equipment interconnected by an intrabay overhead transport (“OHT”) system, and first and second interbay OHT systems each for interconnecting the intrabay OHT systems. The factory automation system comprises a manufacturing execution system (“MES”) for providing lot information regarding wafers being processed in the fab, a material control system (“MCS”) for providing traffic information regarding transportation of wafers in the fab, and an integrated transportation control (“ITC”) system for using the lot information from the MES and the traffic information from the MCS for selecting a destination and a route to the selected destination for a wafer carrier containing wafers in response to a transfer request.

Abstract: A cross-semiconductor fabrication (fab) facility transportation system and method for cross-fab transportation is provided. An exemplary method for cross-fab transportation includes providing a unified control unit that facilitates transportation of one or more wafers across a plurality of wafer fabrication facilities (“fabs”). The unified control unit facilitates selecting a wafer at a first location in a first automated material handling system (“AMHS”) of a first fab for transfer to a second AMHS of a second fab; selecting a second location within the second AMHS of the second fab; selecting a route for transferring the wafer between the first location and the second location; and issuing instructions to the first and second fabs, such that the wafer is transferred from the first location to the second location.

Abstract: In one aspect a factory automation system for a wafer fab is provided. The factory automation system is adapted to facilitate cross-AMHS transfers of wafer lots within a semiconductor foundry. The factory automation system may include a first MCS and an associated first AMHS; a second MCS and an associated second AMHS; and a third MCS and an associated third AMHS. The system may also include a first bridge connecting the first AMHS and the second AMHS to allow a FOUP to travel between the first AMHS and the second AMHS. The system may also include a second bridge connecting the second AMHS and the third AMHS to allow a FOUP to travel between the second AMHS and the third AMHS. The system also includes a unified control unit in communication with the first, second, and third MCSs, the unified control unit for coordinating transfers of FOUPs between the first, second, and third AMHSs.

Abstract: In one aspect a factory automation system for a wafer fab is provided. The factory automation system is adapted to facilitate cross-AMHS transfers of wafer lots within a semiconductor foundry. The factory automation system may include a first MCS and an associated first AMHS; a second MCS and an associated second AMHS; and a third MCS and an associated third AMHS. The system may also include a first bridge connecting the first AMHS and the second AMHS to allow a FOUP to travel between the first AMHS and the second AMHS. The system may also include a second bridge connecting the second AMHS and the third AMHS to allow a FOUP to travel between the second AMHS and the third AMHS. The system also includes a unified control unit in communication with the first, second, and third MCSs, the unified control unit for coordinating transfers of FOUPs between the first, second, and third AMHSs.

Abstract: System and method for implementing integrated transportation control in a wafer fabrication facility are described. One embodiment is a factory automation system for a wafer fabrication facility (“fab”) comprising a plurality of bays, wherein each of the bays comprise a plurality of equipment interconnected by an intrabay overhead transport (“OHT”) system, and first and second interbay OHT systems each for interconnecting the intrabay OHT systems. The factory automation system comprises a manufacturing execution system (“MES”) for providing lot information regarding wafers being processed in the fab, a material control system (“MCS”) for providing traffic information regarding transportation of wafers in the fab, and an integrated transportation control (“ITC”) system for using the lot information from the MES and the traffic information from the MCS for selecting a destination and a route to the selected destination for a wafer carrier containing wafers in response to a transfer request.