Patents by Inventor Chih-Yun WANG

Chih-Yun WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11931456
    Abstract: A pharmaceutical composition containing a mixed polymeric micelle and a drug enclosed in the micelle, in which the mixed polymeric micelle, 1 to 1000 nm in size, includes an amphiphilic block copolymer and a lipopolymer. Also disclosed are preparation of the pharmaceutical composition and use thereof for treating cancer.
    Type: Grant
    Filed: November 16, 2022
    Date of Patent: March 19, 2024
    Assignee: MegaPro Biomedical Co. Ltd.
    Inventors: Ming-Cheng Wei, Yuan-Hung Hsu, Wen-Yuan Hsieh, Chia-Wen Huang, Chih-Lung Chen, Jhih-Yun Jian, Shian-Jy Wang
  • Publication number: 20240074826
    Abstract: A surgical robot including at least one contact module, a control connection module, at least one first robotic arm, and at least one grip control device. A first transmission member of the control connection module drives the control module through a first transmission connecting member. A first shaft member of the first robotic arm is connected with the first transmission member while the grip control device is connected with the first robotic arm by a transmission interface. A force sensing member of the first robotic arm detects a first reaction force from the contact module so that the first robotic arm sends a feedback control signal to the grip control device to control a grip driving member to generate a force feedback for allowing a grip portion to move. Thereby, users can feel movement of the grip portion caused by the force feedback to avoid accidental iatrogenic injuries.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 7, 2024
    Inventors: PO-YUN LIU, CHUN-HUNG KUO, CHIH-CHENG CHIEN, YEN-CHIEH WANG
  • Publication number: 20230343637
    Abstract: Multiple dry etching operations are performed to form an opening for an interconnect structure, with a wet cleaning operation performed in between the dry etching operations. This multi-step etch approach increases the effectiveness of residual material removal, which increases the quality of the interconnect structure and reduces the likelihood of under etching, both of which increase semiconductor device yield and semiconductor device performance.
    Type: Application
    Filed: April 25, 2022
    Publication date: October 26, 2023
    Inventors: Ying-Yu LAI, Chih-Yun WANG, Chih-Hsuan LIN, Hsi Chung CHEN