Abstract: The present invention sets forth an interface method and system for host acceleration between an electronic device and a host PC. The system comprises an acceleration unit for rapidly classifying a type of an host command then issuing a flag signal to a microprocessor. The microprocessor then executes corresponding actions according to the flag signal and the host command without parsing the host command for accelerating the data communication between the device and a host PC.

Abstract: A non-contact electronic level has a light source, a vial having a bubble and positioned to be irradiated by light from the light source, and a photo sensor located at a position corresponding to the bubble at a fixed distance from the vial. The photo sensor captures an image of the bubble after the vial is irradiated by the light source. An image processing unit is electrically coupled to the photo sensor and converts the image of the bubble into an electronic level signal by comparing the centroid of the image of the bubble with a predetermined point.

Abstract: The present invention is related to a method for fabricating an imprint mold which can be used in the field of nano-imprint lithography. Firstly, a diamond film and a photoresist film are successively formed onto a substrate; wherein the photoresist film is more capable of anticorrosion than the diamond film. Then an energy beam lithography system is provided to make the photoresist film form a photoresist mask with particularly arranged patterns. Because of the etching selectivity between the diamond film and the photoresist film, on the surface of the diamond film a pattern can be easily formed with recessions and protrusions according to the photoresist mask by dry etching method.

Abstract: A method and an appliance for interactive learning mainly comprise a plurality of pieces and a stage. After a user placing at least one piece on the stage, the stage will identify and judge if a combination formed by the at least one piece is meaningful and output a corresponding content package explaining a meaning of the combination subsequently.

Abstract: A method for making a guide panel for a vertical probe card in batch includes the steps of a) preparing a non-metal substrate, b) forming a shielding layer having a plurality of openings on the substrate, c) etching a part of the substrate corresponding to the openings of the shielding layer by an anisotropic etching so as to form bind holes with a predetermined depth on the substrate, d) grinding the substrate to open the blind holes by a back side thinning technology so as to form micro feed through holes on the substrate, and e) removing the shielding layer so as to obtain the desired guide panel.

Abstract: A guide panel for a vertical probe card is disclosed to have a via area and a reinforcing area. The via area has a plurality of feed through vias. The reinforcing area is bonded to the via area. The reinforcing area has a plurality of through holes in communication with the feed through vias and a plurality of reinforcing ribs formed around the through holes and bonded to the via area.

Abstract: A non-contact electronic level has a light source, a vial having a bubble and positioned to be irradiated by light from the light source, and a photo sensor located at a position corresponding to the bubble at a fixed distance from the vial. The photo sensor captures an image of the bubble after the vial is irradiated by the light source. An image processing unit is electrically coupled to the photo sensor and converts the image of the bubble into an electronic level signal by comparing the centroid of the image of the bubble with a predetermined point.

Abstract: A non-contact electronic level has a light source, a vial having an air bubble and positioned to be irradiated by light from the light source, a photo sensor located at a position corresponding to the air bubble at a fixed distance from the vial, with the photo sensor capturing an image of the air bubble after the vial is irradiated by the light source, and an image processing unit electrically coupled to the photo sensor and converting the image of the air bubble into an electronic level signal.

Abstract: The present invention is related to a structure of an imprint mold and a method for fabricating the same, which can be used in the field of nano-imprint lithography. Firstly, a diamond film and a photoresist film are successively formed onto a substrate; wherein the photoresist film is more capable of anticorrosion than the diamond film. Then an energy beam lithography system is provided to make the photoresist film form a photoresist mask with particularly arranged patterns. Because of the etching selectivity between the diamond film and the photoresist film, on the surface of the diamond film can be easily formed a pattern with recessions and protrusions according to the photoresist mask by dry etching method. Thus an imprint mold characterized as better antifriction and easily taking off from imprinted materials is completed.

Abstract: A microelement piezoelectric feedback type picking and releasing device is constructed to include a piezoelectric material, an IDT (interdigital transducer) electrode plated and a progressive electrode plated on the piezoelectric material, the progressive electrode having a plurality of electrode elements of different sizes arranged in proper order in one direction, the IDT electrode forming a releasing unit by means of surface acoustic wave/ultrasonic wave and serving as a voltage signal feedback sensor for clamping force control.

Abstract: A microelement piezoelectric feedback type picking and releasing device is constructed to include a piezoelectric material, an IDT (interdigital transducer) electrode plated and a progressive electrode plated on the piezoelectric material, the progressive electrode having a plurality of electrode elements of different sizes arranged in proper order in one direction, the IDT electrode forming a releasing unit by means of surface acoustic wave/ultrasonic wave and serving as a voltage signal feedback sensor for clamping force control.