Abstract: A compatible inductor-type circuit structure with direct input from commercial power includes a substrate and a light-source control-loop device. The light-source control-loop device is disposed on the substrate and includes a constant current circuit, plural light source modules, a switch, a commercial power simulation circuit, a high voltage protection circuit, plural bridge rectifier circuits and a limited current protection circuit. The constant current circuit, the light source modules, the switch, the commercial power simulation circuit, the high voltage protection circuit, the bridge rectifier circuits and the limited current protection circuit are connected together electrically. By the abovementioned structures, a luminaire can be installed directly on any lamp holder, without considering whether to remove the ballast. The circuit structure can be compatible with a dedicated LED lamp holder or a lamp holder activated by a ballast, thereby facilitating the usage.

Abstract: A compatible inductor-type circuit structure with direct input from commercial power includes a substrate and a light-source control-loop device. The light-source control-loop device is disposed on the substrate and includes a constant current circuit, plural light source modules, a switch, a commercial power simulation circuit, a high voltage protection circuit, plural bridge rectifier circuits and a limited current protection circuit. The constant current circuit, the light source modules, the switch, the commercial power simulation circuit, the high voltage protection circuit, the bridge rectifier circuits and the limited current protection circuit are connected together electrically. By the abovementioned structures, a luminaire can be installed directly on any lamp holder, without considering whether to remove the ballast. The circuit structure can be compatible with a dedicated LED lamp holder or a lamp holder activated by a ballast, thereby facilitating the usage.

Abstract: The present invention relates to an area light source module with multipoint chip-on-board. With separatively-disposed multipoint chip conductive layer portions and conductive wiring layer portions disposed between multipoint chip conductive layer portions of a substrate body, it can be more flexible for the wire-bonding and conductive connection and the circuit design of conductive metal wire bodies to be formed in serial and parallel connections, and also the whole assembly structure and the manufacturing process can be simplified, thereby facilitating the heat dissipation efficiency of light source chip bodies to increase the illumination efficiency and providing stable structural configuration and illumination.