Abstract: A flexible wiring board which exhibits a sufficient flex life under high temperature working conditions. The flexible wiring board comprises an insulation layer provided on both surfaces of a conductor layer, optionally with an adhesive layer provided interposed therebetween, wherein the layers being in direct contact with both surfaces of the conductor layer exhibit an average complex shear modulus value of from 1.0×1010 to 4×1010 dyn/cm2 at a temperature of 60° C. and a frequency of 25 Hz.

Abstract: A flexible wiring board including a gold pad having dynamic Vickers hardness of not less than 50 or having a ratio of amount of nickel in a surface of the gold pad (atomic weight %) to thickness of gold (&mgr;m) of not more than 5 or having both the dynamic Vickers hardness of not less than 50 and the ratio of amount of nickel in the surface of the gold pad (atomic weight %) to thickness of gold (&mgr;m) of not more than 5, to provide a flexible wiring board that can substantially ensure the connection reliability when the board is connected with a semiconductor device by wiring bonding.

Abstract: The present invention provides a rigid circuit member obtained by bending a composite laminate comprising a circuit conductor made of a metal foil interposed between plastic films having an elastic modulus of not less than 450 kg/mm2 with an adhesive, characterized in that as said plastic film there is used a polyethylene naphthalate film. The present invention also provides a circuit board adapted to be connected to a conductor on a rigid substrate, characterized in that said circuit conductor is interposed between polyethylene naphthalate films. The present invention further provides a printed circuit board, comprising a polyethylene naphthalate film having an elastic modulus of not less than 500 kg/mm2, not more than 1.5×10−5/° C., a hygroscopic expansion coefficient of not more than 1.2×10−5/%RH, a water vapor permeability of not more than 15 g/m2/mil day, a percent water absorption of not more than 2% and a melting point of not higher than 280° C.

Abstract: A flexible printed circuit comprising a plastic film and a conducting layer, wherein the plastic film exhibits a heat shrinkage rate ellipse having an eccentricity of not more than 0.7 and preferably exhibits an ultrasonic wave propagation rate ellipse having an eccentricity of not more than 0.4 and a polarized microwave transmission intensity ellipse having an eccentricity of not more than 0.55. The flexible printed circuit has improved dimensional accuracy owing to the dimensional stability of the plastic film.

Abstract: A raw material plastic film like a band stretched in two directions with a machine direction as a longitudinal direction of stretch and a transverse direction as a lateral direction of stretch is prepared. One standard line parallel with the machine direction of stretch is assumed on a film face of the raw material plastic film. An area due to cut a cover layer plastic film and an area due to cut a base layer plastic film (the two areas are of almost the same shape) are assumed to be on the standard line in a state in which the areas are aligned in orientation. However, both an arbitrary point of the area due to cut and the point of the area due to cut corresponding thereto need to be on the standard line. A cover layer plastic film and a base layer plastic film are cut out from the two areas due to cut. Metal electric circuit is formed on a surface of the base layer plastic film via an adhesive layer. The metal electric circuit has a plastic deformation component of 0.

Abstract: A composite sheet comprises a first resin film; and a second resin film laminated on the first resin film; wherein two ellipses of coefficient of linear expansion are created on polar coordinates in corresponding parts of the first and second resin films by a predetermined method and the two ellipse are overlapped so as to match in the center point and coordinate axes X and Y, and the maximum value of a linear expansion coefficient difference between the two resin films is equal to or less than a predetermined value.

Abstract: An exposure development device for long base member is disclosed, comprising:a long base member exposing section which repeats the operations of exposing an image forming long base member in the long size state, the image forming long base member being prepared by laminating an image forming material comprising a transparent support having adhered thereon a photopolymerizable composition layer on a long substrate on the surface of which an image is formed, and intermittently feeding the exposed image forming long base member;a synchronous connection section which detects a length of the image forming long base member intermittently fed from the exposing section and continuously feeds the image forming long base member; anda continuous peel development section which continuously peels the transparent support and non-exposed portions of the photopolymerizable composition layer of the image forming long base member continuously fed from the synchronous section, from the long substrate to retain the exposed photo

Abstract: An apparatus for measuring an optical axis direction in which an intensity of the light transmissive to a specimen to be measured disposed between two polarizers is measured by an orthogonal Nicol optical system which uniaxially comprises a light source, said two polarizers, and a light receptor thereby determining the optical axis direction of the specimen to be measured. The apparatus comprises a conveyor for continuously moving the specimen in an elongated form in the direction intersecting with the orthogonal Nicol optical system at a right angle. An intensity of the transmissive light is measured during the period of time when the specimen is fed from one side of a casing, and removed from the other side of the casing. The casing encases the optical system.

Abstract: A peeling type developing method and apparatus for removing exposed photoresist from printed circuit boards. The printed circuit board is covered with a photopolymerization compound layer and then a transparent support layer. After exposure, a thin adhesive tape is stuck to the support layer extending obliquely across the board and crossing opposite corners thereof. The adhesive tape, together with the support layer and the unexposed portions of the photoresist material, are peeled off the printed circuit board by a pair of pinch rolls with the aid of a peeling bar in line contact with the substrate through the adhesive tape and the support layer.