Abstract: An optical transceiver module temperature control device includes a processor, a printed circuit board assembly, an optical transceiver module and a temperature adjustment element. The processor is configured to measure an ambient temperature. The printed circuit board assembly includes a first side and a second side. The first side is opposite to the second side. The optical transceiver module is disposed on the first side of the printed circuit board assembly. The temperature adjustment element is coupled to the processor and disposed on the second side of the printed circuit board assembly. The processor is configured to generate a temperature adjustment signal according to the ambient temperature and an operating temperature range. The temperature adjustment element is configured to perform heat exchange with the printed circuit board assembly according to the temperature adjustment signal to adjust a temperature of the optical transceiver module into the operating temperature range.

Abstract: An integrated circuit includes a first-voltage power rail and a second-voltage power rail in a first connection layer, and includes a first-voltage underlayer power rail and a second-voltage underlayer power rail below the first connection layer. Each of the first-voltage and second-voltage power rails extends in a second direction that is perpendicular to a first direction. Each of the first-voltage and second-voltage underlayer power rails extends in the first direction. The integrated circuit includes a first via-connector connecting the first-voltage power rail with the first-voltage underlayer power rail, and a second via-connector connecting the second-voltage power rail with the second-voltage underlayer power rail.

Abstract: A method of manufacturing a semiconductor device includes forming a first dielectric layer over a substrate, forming a metal layer in the first dielectric layer, forming an etch stop layer on a surface of the first dielectric layer and the metal layer, removing portions of the metal layer and the etch stop layer to form a recess in the metal layer, and forming a tungsten plug in the recess. The recess is spaced apart from a bottom surface of the etch stop layer.

Abstract: A compound of Formula (I) below, or a pharmaceutically acceptable salt, stereoisomer, solvate, or prodrug thereof: in which R1, R2, R3, R5, R6, and R7 are defined as in the SUMMARY section. Further disclosed are a method of using the above-described compound, salt, stereoisomer, solvate, or prodrug for treating microbial infections and a pharmaceutical composition containing the same.

Abstract: A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed on and corresponds to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a sealing layer, and at least a portion of the sealing layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the sealing layer define a chamber.

Abstract: A semiconductor device includes a plurality of channel layers vertically separated from one another. The semiconductor device also includes an active gate structure comprising a lower portion and an upper portion. The lower portion wraps around each of the plurality of channel layers. The semiconductor device further includes a gate spacer extending along a sidewall of the upper portion of the active gate structure. The gate spacer has a bottom surface. Moreover, a dummy gate dielectric layer is disposed between the gate spacer and a topmost channel layer of plurality of channel layers. The dummy gate dielectric layer is in contact with a top surface of the topmost channel layer, the bottom surface of the gate spacer, and the sidewall of the gate structure.

Abstract: A semiconductor structure includes a substrate, a conductive region, a first insulation layer, a second insulation layer, a gate structure, a low-k spacer, a gate contact, and a conductive region contact. The low-k spacer is formed between a sidewall of the gate structure and the first insulation layer. The gate contact is landed on a top surface of the gate structure. A proximity distance between a sidewall of the gate contact and the conductive region contact along a top surface of the second insulation layer is in a range of from about 4 nm to about 7 nm. A method for manufacturing a semiconductor structure is also provided.

Abstract: A system including a processor configured to perform generating a plurality of different layout blocks; selecting, among the plurality of layout blocks, layout blocks corresponding to a plurality of blocks in a floorplan of a circuit; combining the selected layout blocks in accordance with the floorplan into a layout of the circuit; and storing the layout of the circuit in a cell library or using the layout of the circuit to generate a layout for an integrated circuit (IC) containing the circuit. Each of the plurality of layout blocks satisfies predetermined design rules and includes at least one of a plurality of different first block options associated with a first layout feature, and at least one of a plurality of different second block options associated with a second layout feature different from the first layout feature.

Abstract: A method of configuring a display device interface (DDI) detects a trigger signal, generated by a display device. If the trigger signal is associated with a power on event, a full configuration of the DDI is performed, including loading display device capability information provided by the display device into DDI configuration registers and setting one or more DDI configuration parameters accordingly. If the trigger signal is associated with resume event, rather than a power on event, a modified fast link resume operation may be performed to route the trigger signal to a controller configured to explicitly write display device capability information to the appropriate DDI configuration registers before setting the corresponding DDI configuration parameter accordingly. The DDI may include a re-timer, between the DDI source and sink, configured to snoop the explicit write transaction such that the re-timer configuration is also updated.

Abstract: A grinding machine tool for reducing hotness of a casing, includes a casing and a drive assembly. The casing is divided into a head and a body; includes casing parts; includes an air inlet provided on the body and an air outlet provided on a side of the head; and forms a motor cover on the head, and the motor cover does not contact the casing parts to form an airflow passage in the casing. The drive assembly includes a circuit board, a motor placed into the motor cover, and an airflow generating member rotating synchronously with the motor. When the airflow generating member rotates, it generates a first heat dissipation airflow passing through the airflow passage and dissipating heat of the circuit board and the head, and a second heat dissipation airflow dissipating heat on a side of the motor facing the airflow generating member.

Abstract: An air guider disposed in a grinding machine tool. The grinding machine tool comprises a casing and a motor disposed in the casing. The casing comprises a head for disposing the motor and a body formed with at least one air inlet. The air guider comprises a main body, and an ascending diversion portion integrally formed with the main body, the main body is disposed at a junction between the head and the body, the ascending diversion portion comprises a main guide surface to guide a first heat dissipation airflow entering from the air inlet to flow toward a top of the motor, and two auxiliary guide surfaces respectively disposed on two sides of the main guide surface to generate a second heat dissipation airflow.

Abstract: An antenna system is provided, including a ground plane, a first antenna unit, a second antenna unit, a first ground unit and a second ground unit. The ground plane includes a first side and a second side. The first ground unit and the ground plane jointly form a first closed loop, and a length of the first ground unit matches the first high-frequency signal and the second high-frequency signal to provide grounding of the high-frequency signals. The second ground unit forms a second closed loop and is connected to the first ground unit, and a length of the second ground unit is greater than the length of the first ground unit. A sum of the length of the second ground unit and the length of the first ground unit matches the first low-frequency signal and the second low-frequency signal, to jointly provide the grounding of the low-frequency signals.

Abstract: A glasses assembly with a nose pad for high load includes: a pair of glasses, configured with an accommodation portion, where the glasses are smart glasses; a support, configured with a first fixing portion, at least one second fixing portion, and the first fixing portion inserted in the accommodation portion of the glasses; and a flat nose pad, two sides thereof respectively configured with a fixed portion, each of the fixed portions installed on the second fixing portion of the support. With the flat nose pad being worn on the user's nose bridge to form a fulcrum, the glasses, smart glasses can achieve leverage balance through the flat nose pad, and the flat nose pad can buffer the weight of the glasses, smart glasses, capable of significantly reducing the user's discomfort after wearing them for a long time, and preventing them from slipping downward.

Abstract: An antenna system is provided, including a ground plane, a first antenna unit, a second antenna unit, a first ground unit and a second ground unit. The ground plane includes a first side and a second side. The first ground unit and the ground plane jointly form a first closed loop, and a length of the first ground unit matches the first high-frequency signal and the second high-frequency signal to provide grounding of the high-frequency signals. The second ground unit forms a second closed loop and is connected to the first ground unit, and a length of the second ground unit is greater than the length of the first ground unit. A sum of the length of the second ground unit and the length of the first ground unit matches the first low-frequency signal and the second low-frequency signal, to jointly provide the grounding of the low-frequency signals.

Abstract: A glasses assembly with a nose pad for high load includes: a pair of glasses, configured with an accommodation portion, where the glasses are smart glasses; a support, configured with a first fixing portion, at least one second fixing portion, and the first fixing portion inserted in the accommodation portion of the glasses; and a flat nose pad, two sides thereof respectively configured with a fixed portion, each of the fixed portions installed on the second fixing portion of the support. With the flat nose pad being worn on the user's nose bridge to form a fulcrum, the glasses, smart glasses can achieve leverage balance through the flat nose pad, and the flat nose pad can buffer the weight of the glasses, smart glasses, capable of significantly reducing the user's discomfort after wearing them for a long time, and preventing them from slipping downward.

Abstract: An electric composite detection antenna is disclosed. The antenna includes two RF antenna disposed on two sides of the circuit system of the electronic device, and a RF compensation system is disposed in the circuit system and includes an inductive sensing coil, and the induction coil can detect signal attenuation of any RF antenna subjected to external interference, so as to generate a detection signal. The RF compensation system can notice the control unit, to quickly drive any antenna matching circuit to switch to the RF antenna which is not interfered, or to quickly adjust antenna power or adjust the matching value of the RF antenna between the external environment, so that the preset electronic device can perform the stable transmission RF signal through the RF antenna without external interference, and maintain better power for RF signal transmissions.

Abstract: A communication device includes a ground plane and an antenna element. The antenna element includes a first radiation portion and a second radiation portion. The first radiation portion includes a meander section and a rectangular metal section. The meander section has a rectangular hook-shaped structure. A feed point is disposed at a first end of the meander section, and a second end of the meander section is electrically connected to the rectangular metal section. A first end of the second radiation portion of an L-shaped structure is electrically connected to the ground plane. A first end of the rectangular metal section is spaced apart from a second end of the second radiation portion by a first parallel slot. The communication device operates in a first frequency band with the first radiation portion and the second radiation portion, and operates in a second frequency band with the first radiation portion.

Abstract: A Bluetooth headset combined with antenna and touch sensor, which integrates a sensing touch member inside a button of the Bluetooth headset with a Bluetooth antenna. The antenna element with touch function increases the density of the earphone component, in addition to the waterproof improvement, and the Bluetooth antenna is set near the external position of the Bluetooth headset, which makes the audio signal transmission effect clearer. Further, a first touch matching circuit, a second touch matching circuit and a changeover switch are electrically connected between the antenna element and the touch sensing module. When the signal of the antenna element is blocked, the changeover switch automatically switches between the first touch matching circuit and the second touch matching circuit to perform frequency adjustment and selects the better signal of the first or second touch matching circuit to do a circuit matching.

Abstract: A Bluetooth headset combined with antenna and touch sensor, which integrates a sensing touch member inside a button of the Bluetooth headset with a Bluetooth antenna. The antenna element with touch function increases the density of the earphone component, in addition to the waterproof improvement, and the Bluetooth antenna is set near the external position of the Bluetooth headset, which makes the audio signal transmission effect clearer. Further, a first touch matching circuit, a second touch matching circuit and a changeover switch are electrically connected between the antenna element and the touch sensing module. When the signal of the antenna element is blocked, the changeover switch automatically switches between the first touch matching circuit and the second touch matching circuit to perform frequency adjustment and selects the better signal of the first or second touch matching circuit to do a circuit matching.

Abstract: A wireless transmission system, method and device for stereoscopic video are provided. The wireless transmission system includes a wireless transmission device and multiple user devices communicating with the wireless transmission device. Each of the user devices receives a stereoscopic video stream corresponding to a user visual angle. The stereoscopic video stream is composed of multiple views of multiple visual angles. The wireless transmission device obtains the user visual angle for the stereoscopic video stream and a modulation type of each of the user devices respectively, selects multiple transmission visual angles among the multiple visual angles according to the user visual angles, and transmits the stereoscopic video stream corresponding to the transmission visual angles to the corresponding user devices respectively by adjusting the modulation type of the user devices.