Patents by Inventor Chihhung HO

Chihhung HO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging device for integrated power supply system and packaging method thereof
    Patent number: 10636779
    Abstract: The present disclosure provides a packaging device for an integrated power supply system and a packaging method thereof. The packaging device comprises: a power consumption system die and a power supply system die below the power consumption system die; the power supply system die comprises an active module, a passive module and a rewiring layer, wherein the active module and the reactive module are molded, and the rewiring layer is located above the molded active module and passive module, to connect the active module and the passive module, and a plurality of power supply tracks are disposed in the rewiring layer to abut the power consumption system die; the power consumption system die is abutted with the plurality of power supply tracks; and an external power source supplies power to the power consumption system die through the power supply system die.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: April 28, 2020
    Assignee: SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
    Inventors: Jangshen Lin, Chengchung Lin, Chihhung Ho, Qifeng Cai
  • A PACKAGING DEVICE FOR INTEGRATED POWER SUPPLY SYSTEM AND PACKAGING METHOD THEREOF
    Publication number: 20190043846
    Abstract: The present disclosure provides a packaging device for an integrated power supply system and a packaging method thereof. The packaging device comprises: a power consumption system die and a power supply system die below the power consumption system die; the power supply system die comprises an active module, a passive module and a rewiring layer, wherein the active module and the reactive module are molded, and the rewiring layer is located above the molded active module and passive module, to connect the active module and the passive module, and a plurality of power supply tracks are disposed in the rewiring layer to abut the power consumption system die; the power consumption system die is abutted with the plurality of power supply tracks; and an external power source supplies power to the power consumption system die through the power supply system die.
    Type: Application
    Filed: August 1, 2017
    Publication date: February 7, 2019
    Inventors: Changshen LIN, Chengchung LIN, Chihhung HO, Qifeng CAI