Abstract: Provided is a smart system for vehicle fault prediction, including: an in-vehicle diagnosis system, a client to-be-diagnosed device set, a diagnosis management platform, a database, and a smart analysis engine. A diagnostic task script of the management platform is parsed, and a host/client interaction module, a safety module, and a diagnostic module perform the diagnostic task. The in-vehicle diagnostic engine transmits the diagnostic result to the diagnostic management platform, which sends the diagnostic result to the database, which then stores the diagnostic result and transmits to the smart analysis engine, which analyzes the diagnostic results and infers the potential risk of vehicle failure. Furthermore, the present invention also provides a smart method for vehicle fault prediction.

Abstract: A direction control apparatus is provided. The direction control apparatus includes an input unit, and a magnetic sensing unit. The input unit includes an operation member, a magnetic member, an elastic member, and a base. The elastic member is an elastic structure. The magnetic sensing unit includes a magnetic sensor, and a magnetic signal processing device. The magnetic sensor is a device for sensing a distribution of a magnetic field, and the magnetic signal processing device is an electronic calculating device. The elastic member is provided for restricting the operation member at either a first status position or a second status position. When at the first status position, the operation member is positioned at balanced position where the elastic member achieves an elastic balance.

Abstract: An earmuff for a headphone and a headphone having the same are provided. The earmuff comprises a case, an earpad and an adjusting component. The case has at least one locating structure. The earpad is disposed on the case. The adjusting component is disposed between the earpad and the case. The adjusting component comprises at least one adjustable portion and at least one fixed portion. The at least one adjustable portion is correspondingly and movably connected to the at least one locating structure of the case. The at least one fixed portion is fixed with the earpad. By adjusting the adjustable portion, a surrounding shape formed by the adjusting component can be changed, thereby causing the shape of the earpad to change. As such, a purpose of adjusting a listening experience without exchanging the earmuff can be achieved.

Abstract: A semiconductor structure includes a substrate of a first conductive type, a device region including an active element and covering a portion of the substrate, and a trench region including a trench structure and in direct contact with the device region and with the substrate. The trench structure includes a bottom-filling material, a top-filling material covering the bottom-filling material, and a shield spacer surrounding the bottom-filling material and the top-filling material. There is a discontinuous grain interface disposed between the bottom-filling material and the top-filling material.

Abstract: A speaker includes a speaker driver and a speaker back cover. The speaker driver has a basket at its rear side. The speaker back cover is sealed and fixed to the basket and includes two casing parts which are relatively movably or rotatably connected and form a resonance space at the rear side of the speaker driver. Each casing part has a channel structure with an opening. The two channel structures are connected so that the resonance space is connected to the outside of the speaker back cover through it. The two casing parts can be moved or rotated relative to each other to adjust a channel path length of the two channel structures from their inner opening to their outer opening.

Abstract: An illuminated keyboard includes a backlight module including a light guide plate, and multiple first and second light emitting modules. The light guide plate includes first and second sides opposite to each other, and multiple first and second accommodating portions. Each first accommodating portion has a first incident surface facing the first side. The second accommodating portions are arranged alternately with the first accommodating portions, and each has a second incident surface facing the second side. The first light emitting modules are respectively disposed at the first accommodating portions. Wavelengths of light emitted by the first light emitting modules are different at an initial time, and are changed at a predetermined interval. The second light emitting modules are respectively disposed at the second accommodating portions. Wavelengths of light emitted by the second light emitting modules are different at the initial time, and are changed at the predetermined interval.

Abstract: The present application discloses a quick-frozen noodle un-freezing, cooking and vending machine, including a cabinet, a freezer chest and a mechanical arm. The cabinet is provided with a product dispenser port. The freezer chest is disposed in the cabinet. The mechanical arm is disposed in the cabinet. The cabinet is provided with a product dispenser door. A steam boiler, a water storage mechanism and an injection rod are further included. The steam boiler is disposed in the cabinet. The water storage mechanism is disposed in the cabinet and is connected to the steam boiler. The injection rod is movably disposed in the cabinet. The present invention provides the following effects: quick-frozen noodles are unfreezed by steam, moisture in the noodles is not lost during the unfreezing process, and the unfreezed noodles have good elasticity and provide good texture for chewing.

Abstract: The method plans a predetermined circuit pattern on an inner surface of a constructive object and plans a contact portion on an outer surface of the constructive object for external electric connection. Laser is used to scan an area in which both the circuit pattern and the contact portion are located. A through hole is formed to make both the circuit pattern and the contact portion uninsulated and to form an irregular roughened surface on the area scanned by heat of the laser. A layer of conductive material is deposited on the roughened surface by a mixture of a catalyst solution and metal powder. The constructive object is immersed in a reaction tank to implement electroless plating to gradually thicken the layer of conductive material to become a conductor. The conductor penetrating the through hole makes the circuit pattern and the contact portion electrically connected.

Abstract: Various embodiments of fuel cells and cell assemblies and methods of using the same are provided. Each fuel cell or cell assembly can simultaneously perform a charging function and a discharging function, the former by receiving electric currents from external charging devices, the latter by outputting an electric current to an electrical load. The fuel cell includes a metal layer serving as a positive electrode for the charging function, at least one air electrode layer serving as a positive electrode for the discharging function, as well as a zinc material serving as a negative electrode for both the charging and discharging functions. The fuel cell also includes a plurality of gas chambers via which an electrolyte is disposed into the fuel cell. The electrolyte is disposed up to a level located lower than the gas chambers.

Abstract: A membrane circuit board includes a first substrate, a second substrate, a space layer and a conductive adhesive. The first substrate includes a plurality of first butting circuits and at least one first transmission circuit. The first transmission circuit is connected to one of the first butting circuits. The second substrate includes a plurality of second butting circuits, each corresponding to one of the first butting circuits. The space layer is disposed between the first substrate and the second substrate. The space layer includes a butting opening and at least one first stress weakening portion. One end of the first stress weakening portion is connected to the butting opening, and the first stress weakening portion corresponds to the first transmission circuit. The conductive adhesive is disposed within the butting opening and is in contact with both the first butting circuits and the second butting circuits.

Abstract: The present disclosure discloses a flow battery system, a battery monitoring device for the flow battery system, and an electrode element for the battery monitoring device and a manufacturing method thereof. The battery monitoring device includes a positive end plate, a positive electrode element, a negative end plate, a negative electrode element, electrolyte supply channels, electrolyte discharge channels, a separator, and a voltage measurement unit. The positive electrode element penetrates through the positive end plate and includes an electrode rod and a signal transmission portion that protrudes from an outer surface of the positive end plate. The negative electrode element penetrates through the negative end plate and includes an electrode rod and a signal transmission portion that is projected on an outer surface of the negative end plate. The separator is between the positive end plate and the negative end plate.

Abstract: A membrane keyboard and manufacturing method thereof, the manufacturing method comprises the following steps: forming a first positioning hole on an upper circuited layer, forming a second positioning hole and a plurality of hollow portions on a spacer layer, forming a third positioning hole on a lower circuited layer, wherein a minimum diameter of the second positioning hole is smaller than a minimum diameter of the first positioning hole and a minimum diameter of the third positioning hole; adhering the upper circuited layer, the spacer layer and the lower circuited layer, to form a restoring member positioning hole; placing the membrane circuit board in the restoring member assembly fixture and passing the restoring member positioning hole through a locating pillar of the restoring member assembly fixture, with an inner wall of the second positioning hole abutting the locating pillar.

Abstract: A Bluetooth connection system is provided. The Bluetooth connection system includes a control host and a Bluetooth audio device. The control host includes a transmission unit. The Bluetooth audio device wirelessly communicates with the transmission unit, wherein the control host receives an instruction, then turns on the transmission unit and executes a search task to find the Bluetooth audio device around the control host. When the Bluetooth audio device does not return a confirmation Bluetooth connection signal to the control host, the control host sends a wake-up signal to the Bluetooth audio device to start a re-pairing procedure.

Abstract: A semiconductor device includes a first well region having the first conductivity type and a second well region having the second conductivity type formed in a substrate having the first conductivity type. An isolation component and a third well region are formed in the second well region. The third well region has the first conductivity type and is in contact with the bottom surface of the isolation component. A first doping region is formed in the first well region and a second doping region is formed in the second well region. The first and second doping regions have the second conductivity type and are disposed at opposite sides of the gate structure. The interface between the first well region and the second well region is positioned between the isolation component and the first doping region. The interface is separated from the third well region by a lateral distance.

Abstract: An illuminated keyboard includes a backlight module including a light guide plate, and multiple first and second light emitting modules. The light guide plate includes first and second sides opposite to each other, and multiple first and second accommodating portions. Each first accommodating portion has a first incident surface facing the first side. The second accommodating portions are arranged alternately with the first accommodating portions, and each has a second incident surface facing the second side. The first light emitting modules are respectively disposed at the first accommodating portions. Wavelengths of light emitted by the first light emitting modules are different at an initial time, and are changed at a predetermined interval. The second light emitting modules are respectively disposed at the second accommodating portions. Wavelengths of light emitted by the second light emitting modules are different at the initial time, and are changed at the predetermined interval.

Abstract: In one example, an electronic device may include a display screen defining a plurality of display regions. Further, the electronic device may include a camera to capture an image of an operator of the electronic device. Furthermore, the electronic device may include a controller operatively coupled to the camera and the display screen. The controller may detect an orientation of the operator's face with respect to the display screen using the captured image. Further, the controller may determine a first display region of the plurality of display regions corresponding to the detected orientation of the operators face. Furthermore, the controller may activate the first display region to position a cursor of a pointing device within the first display region.

Abstract: The method plans a predetermined circuit pattern on an inner surface of a constructive object and plans a contact portion on an outer surface of the constructive object for external electric connection. Laser is used to scan an area in which both the circuit pattern and the contact portion are located. A through hole is formed to make both the circuit pattern and the contact portion uninsulated and to form an irregular roughened surface on the area scanned by heat of the laser. A layer of conductive material is deposited on the roughened surface by a mixture of a catalyst solution and metal powder. The constructive object is immersed in a reaction tank to implement electroless plating to gradually thicken the layer of conductive material to become a conductor. The conductor penetrating the through hole makes the circuit pattern and the contact portion electrically connected.

Abstract: A semiconductor device includes a substrate, a gate dielectric layer, a gate electrode, a field plate, a source electrode and a drain electrode. The gate dielectric layer is disposed on the substrate and includes a first portion having a first thickness, a second portion having a second thickness, and a third portion having a third thickness. The first, second and third thicknesses are different from each other, and the first thickness is smaller than the second and third thicknesses. The gate electrode is disposed on the first portion of the gate dielectric layer. The field plate is separated from and electrically coupled to the gate electrode, and is disposed on the second and third portions of the gate dielectric layer. The source and drain electrodes are disposed on the sides of the gate electrode and the field plate, respectively.

Abstract: Various embodiments of a battery charging apparatus are disclosed, along with methods of charging and rejuvenating a battery using the apparatus. The apparatus may include a positive electrode and a negative electrode which are configured to connect to a battery, and a charging current generator generating a charging current that charges the battery for a period of time via the positive and and negative electrodes by adding electric charge to the battery. The charging current is generated based on parameters of the battery, including a charging constant and an initial charging state. In some embodiments, a natural logarithm of a ratio of the added electric charge to the initial charging state substantially equals to a product of the charging constant and a length of the period of time and negative one.

Abstract: A semiconductor structure includes a substrate, a channel layer, a barrier layer, a source structure, a drain structure, a doped compound semiconductor layer, a dielectric layer, and a gate structure. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer. The source structure and the drain structure are disposed on opposite sides of the barrier layer. The doped compound semiconductor layer is disposed on the barrier layer. The doped compound semiconductor layer has a first side adjacent to the source structure and a second side adjacent to the drain structure. The doped compound semiconductor layer has at least one opening exposing at least a portion of the barrier layer. The dielectric layer is disposed on the doped compound semiconductor layer and the barrier layer. The gate structure is disposed on the doped compound semiconductor layer.