Abstract: A work gondola apparatus is provided with: a work cage into which a worker boards; equipment mounting parts disposed on both outer sides of the work cage; battery-driven elevating/lowering mechanisms which are mounted to the respective equipment mounting parts and which elevate/lower the work cage to a working location by means of cables that are being suspended; and batteries for driving the respective elevating/lowering mechanisms.

Abstract: A work vehicle (1) including a suspended platform includes a work cage (10) to carry an operator, an arm mechanism (60) having a distal end, the distal end movable to an intended position by at least one of a rotating mechanism (30), an extension mechanism (40), or a derricking mechanism (50) installed on a vehicle body (20). The suspended platform (100) includes a support post (70) located at the distal end of the arm mechanism (60), a suspension frame (80), from which the work cage (10) is suspended, mounted on an upper end of the support post (70) to allow the operator to perform an operation above the upper end of the support post (70), and a lift mechanism (90) that raises or lowers the work cage (10) suspended from the suspension frame (80) with a plurality of lanyards (91) to a work position.

Abstract: A work gondola apparatus is provided with: a work cage into which a worker boards; equipment mounting parts disposed on both outer sides of the work cage; battery-driven elevating/lowering mechanisms which are mounted to the respective equipment mounting parts and which elevate/lower the work cage to a working location by means of cables that are being suspended; and batteries for driving the respective elevating/lowering mechanisms.

Abstract: A work vehicle (1) including a suspended platform includes a work cage (10) to carry an operator, an arm mechanism (60) having a distal end, the distal end movable to an intended position by at least one of a rotating mechanism (30), an extension mechanism (40), or a derricking mechanism (50) installed on a vehicle body (20). The suspended platform (100) includes a support post (70) located at the distal end of the arm mechanism (60), a suspension frame (80), from which the work cage (10) is suspended, mounted on an upper end of the support post (70) to allow the operator to perform an operation above the upper end of the support post (70), and a lift mechanism (90) that raises or lowers the work cage (10) suspended from the suspension frame (80) with a plurality of lanyards (91) to a work position.

Abstract: Methods and apparatus for detecting the welding state in each bonding section and the application of ultrasonic vibration and pressing force is stopped promptly when completion of welding is determined. This permits bonding to be finished, corresponding to each wire bonding section at all times, in a shortest time without need of application of unnecessary ultrasonic vibration and pressing force after completion of welding in spite of dispersion of the welding characteristic of the individual bonding pads.

Abstract: A semiconductor chip mounted on a substrate having a soldering land pattern for containing a molten solder interposed between said conductive surface and a facing surface of the semiconductor chip. The soldering land pattern comprises corners spaced respectively from the four corners of the semiconductor chip bottom surface and escapes formed between the corners sufficiently outside of the respective sides of the semiconductor chip bottom surface to accept liquid solder displaced from the area between the conductive surface and the facing surface of the semiconductor chip upon placing the semiconductor chip within the soldering land pattern to improve conductivity and simplify the construction. The device is also shown in a motor control.

Abstract: A method and apparatus employing image processing of photographic data by a thermographic camera to determine the heat development of individual semiconductor devices. Therefore, defects of individual devices such as disconnection due to breaks and abnormal heat development due to electrostatic breakdowns can be determined reliably.

Abstract: A rotating electrical machine control embodying a circuit including semiconductor devices mounted on a conductive pattern formed on a metal substrate without using heat sinks. Performance is improved as is durability by matching the linear expansion coefficient of the resin used to seal the semiconductor chips with that of the conductive pattern formed on the metal substrate.

Abstract: A method and apparatus employing image processing of photographic data by a thermographic camera to determine the heat development of individual semiconductor devices. Therefore, defects of individual devices such as disconnection due to breaks and abnormal heat development due to electrostatic breakdowns can be determined reliably.

Abstract: A semiconductor chip mounted on a substrate having a soldering land pattern for containing a molten solder interposed between said conductive surface and a facing surface of the semiconductor chip. The soldering land pattern comprises corners spaced respectively from the four corners of the semiconductor chip bottom surface and escapes formed between the corners sufficiently outside of the respective sides of the semiconductor chip bottom surface to accept liquid solder displaced from the area between the conductive surface and the facing surface of the semiconductor chip upon placing the semiconductor chip within the soldering land pattern to improve conductivity and simplify the construction. The device is also shown in a motor control.

Abstract: A rotating electrical machine control embodying a circuit including semiconductor devices mounted on a conductive pattern formed on a metal substrate without using heat sinks. Performance is improved as is durability by matching the linear expansion coefficient of the resin used to seal the semiconductor chips with that of the conductive pattern formed on the metal substrate.

Abstract: Methods and apparatus for detecting the welding state in each bonding section and the application of ultrasonic vibration and pressing force is stopped promptly when completion of welding is determined. This permits bonding to be finished, corresponding to each wire bonding section at all times, in a shortest time without need of application of unnecessary ultrasonic vibration and pressing force after completion of welding in spite of dispersion of the welding characteristic of the individual bonding pads.