Patents by Inventor Chihiro FUJIWARA

Chihiro FUJIWARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10827622
    Abstract: Wiring boards, including an embedded type wiring boards and flexible wiring boards, may be produce by: (1) preparing a wiring layer-attached base including a base and a wiring layer provided on at least one surface of the base, (2) laminating an adhesive sheet including (i) a thermosetting resin composition layer and (ii) a resin film layer on the wiring layer-attached base so that the wiring layer will be embedded in (i) the thermosetting resin composition layer and performing thermal curing to form an insulating layer, (3) forming via holes in the insulating layer, (4) forming a conductor layer, and (5) removing the base.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: November 3, 2020
    Assignee: Ajinomoto Co., Inc.
    Inventors: Shigeo Nakamura, Chihiro Fujiwara
  • Publication number: 20170086306
    Abstract: Wiring boards, including an embedded type wiring boards and flexible wiring boards, may be produce by: (1) preparing a wiring layer-attached base including a base and a wiring layer provided on at least one surface of the base, (2) laminating an adhesive sheet including (i) a thermosetting resin composition layer and (ii) a resin film layer on the wiring layer-attached base so that the wiring layer will be embedded in (i) the thermosetting resin composition layer and performing thermal curing to form an insulating layer, (3) forming via holes in the insulating layer, (4) forming a conductor layer, and (5) removing the base.
    Type: Application
    Filed: September 15, 2016
    Publication date: March 23, 2017
    Applicant: Ajinomoto Co., Inc.
    Inventors: Shigeo NAKAMURA, Chihiro FUJIWARA